Electronics Forum | Thu Apr 22 16:07:36 EDT 1999 | Rick
| | Do solders exist that are both lead-free and low-temperature (e.g. 100-170 Celsius range)? If so, who supplies these materials? Any websites or contact information would be most helpful. | | | | Also, I am not an expert on soldering, so any
Electronics Forum | Fri Jan 15 08:43:43 EST 1999 | Mike McM
Bernie, If the pads are for a chip component and only about a half a pad off without anything else in the misregistered area, go ahead and use the stencil as is. Surface tension of the solder at liquidus should cause it to wick back to the pad, even
Electronics Forum | Thu Jan 14 11:06:33 EST 1999 | Earl Moon
| | Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | | | K
Electronics Forum | Sat Jul 25 04:57:17 EDT 1998 | Stoney Tsai
| I have been building one sophisticated SMT soldering expert system (KBS), through my 8-YEARs SMT experience. As I know, in the marketplace only published some SMT raw material selection Expert System. | The system needs more technical information a
Electronics Forum | Wed Sep 26 11:15:59 EDT 2001 | Hussman
What do you folks use for control on your wave solder process? Primarily after wave. I know there are a variety of "wave riders" that will assure proper wave solder parameters, but would like to know what down stream controls some are using. We ar
Electronics Forum | Wed Oct 30 10:26:42 EST 2002 | Randy V.
I would perform a simple solderability test per ANSI/J-STD-002. You can do this using a compatable no-clean flux like Indium NC771 and a solder pot. If the leads wet well you do not have a solderability problem. I did not notice what plating was on t
Electronics Forum | Wed Nov 17 08:20:47 EST 2004 | Chunks
Pros are no need to clean after reflow. No need to buy a cleaner or worry about "wet" parts afterwards when you're trying to test your unit. Cons are that most leave a bit of a residue behind. It's harmless but may drive your bed-of-nails tester a
Electronics Forum | Mon Nov 17 09:47:25 EST 2008 | cisridn
I would not recommend doing BGA soldering with only a hot air gun. I have done it in the past, but the boards would eventually come back from the field because the solder joints did not form correctly and the BGA would have to be reworked again. I
Electronics Forum | Thu May 03 17:33:20 EDT 2018 | dleeper
Solder paste selection can have a huge impact on size and quantity of voids. Talk to a few suppliers and ask for their recommendation on low voiding formulas. Pick a few of your top candidates and then perform a DOE to see who has the best result. S
Electronics Forum | Thu Nov 10 20:39:44 EST 2022 | SMTA-64386598
The solderability shelf life of ENIG is related almost entirely to diffusion of O2 through the gold plating. When O2 diffuses through the gold, the underlying nickel is oxidized rendering it unsolderable (with ENIG - you solder to Ni, the gold dissol
