Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon
| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec
Electronics Forum | Fri May 29 08:25:13 EDT 2009 | floydf
We are getting what looks like cold solder joints on one of our boards. The boards have an aluminum substrate, and use OSP plating. The solder is lead free - 96.5 Sn, 3.0 Ag, .5 Cu. The flux is no clean. When we first had the problem, my solder profi
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Thu Aug 01 13:04:57 EDT 2002 | gdstanton
Its interesting. It appears I'm getting conflicting feeback from Indium. This says its not a problem... http://indium.custhelp.com/cgi-bin/indium.cfg/php/enduser/std_adp.php?p_sid=kTDKGClg&p_lva=&p_faqid=355&p_created=1014734692&p_sp=cF9ncmlkc29
Electronics Forum | Mon Dec 11 15:50:01 EST 2000 | externet
Hi ! Try fresh DRY solder paste... Keep solder paste in a sealed container until the moment of use. Humidity absorbed by the soldering paste becomes vapor violently at the moment of heating it , expelling the solder in form of balls everywhere.
Electronics Forum | Tue Sep 20 17:38:59 EDT 2005 | kmorris
HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eutectic solder, your approach is a good one. All solder paste does in this assembly application is supply the flux. Additional solder volume is not ne
Electronics Forum | Tue Feb 19 19:36:21 EST 2002 | davef
You weren�t clear but I assume the problem is not widely distributed and affects only a few parts on each board. Do this trick: * Cut a ~1� piece of fairly serious wire, like 18 or 12 AWG. * Strip the insulation. * Gear-up with gloves, glasses, and
Electronics Forum | Fri May 14 00:34:22 EDT 1999 | Mike D.
| I need some pics or documentation on how a finish soldered joint looks like for SMT component. I have various people who supposedly says has knowledge with High Temp says my joint could look better. The joint looks shiny and great except for a grai
Electronics Forum | Tue Feb 03 03:35:30 EST 2009 | sachu_70
Hi Jose, such a process is possible, but you need to confirm that the PCB material has high Tg. In additon, you need to re-look solder paste printing parameters and make required changes in stencil apperture design for optimum solder volume. Just a
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con