Electronics Forum | Tue May 03 21:14:19 EDT 2011 | davef
Can we talk some to better understand the scope and breadth of the problem? * From your picture, it looks as if the problem shows-up on some pads, but not others. Is this accurate? * Is this lot related? * Is this related to a few items from a lot? *
Electronics Forum | Tue Aug 14 17:55:01 EDT 2001 | Boysen
Are you using a water soluble paste? Older generations of water soluble paste are notorious for voiding. Some of the new generation water soluble fluxes allow a much wider process window.
Electronics Forum | Thu May 30 09:14:03 EDT 2013 | emeto
I have another idea. Would you check the apertures on the stencil? May be they didn't cut the right size apertures there. If you have smaller aperture you can't get the right amount of paste.
Electronics Forum | Wed Aug 11 15:58:39 EDT 1999 | Doug Philbrick
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Thu Mar 22 13:06:50 EDT 2012 | smtmfgeng
Does anyone have any insight on alternatives to Indium NC-SMQ 92J solder paste for minimizing poor wetting on parts with oxidized leads (see datasheet here: http://www.dtsprocess.com/contents/articlefiles/6-SMQ92j.pdf). I am considering setting up a
Electronics Forum | Thu Nov 08 10:52:22 EST 2012 | Bryan Ng
I am considering using high-temp ball Sn10Pb90 + eutectic solder paste for MLC reflow (no underfill). You can see that there is no Intermetallic bond for the paste and the balls. Under high stress/shock condition, the solder joints develop micro c
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Wed Aug 09 11:59:19 EDT 2017 | dleeper
As you already know, it depends on the paste. There isn't really a rule of thumb, but less time exposed it better. The issue is the flux exposure to the air and ambient conditions. The flux can evaporate or absorb moisture from the air. If the paste
Electronics Forum | Tue Jan 31 09:41:06 EST 2017 | emeto
If there is no specific quality reason, stay with paste. More processes you add, more points of failure. They don't need a lot of paste to get attached to the board. The ones I used were 8mil round apertures, so I did cut 1:1 on a 3 mil coated stenci
Electronics Forum | Mon Jan 30 19:20:45 EST 2017 | jgo
Thanks Rob. I'm not so sure in a mass production environment that using the mount spray and kapton tapes are going to be efficient. For solder paste dispensing, any idea what is the smallest solder dot size the machine can dispense?