Electronics Forum | Thu Aug 13 12:55:46 EDT 1998 | Dave F
| Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | Xingsheng Xingsheng: Welcome. Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill Web resources: http://www.pwbrc.org/ a
Electronics Forum | Fri Jul 24 23:20:11 EDT 2009 | umar
Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?
Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef
Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo
Electronics Forum | Wed Apr 06 08:27:12 EDT 2011 | kaschliman
Our two component suppliers use 99.5Sn/0.5Cu and 97Sn/3Ag solder (respectively) for tinning their leads. We use 98.9Sn/.66Cu/.33Ag solder in our wave solder machine. Is there any significant advantage to either tinning process regarding solderabili
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Fri Jun 24 07:02:35 EDT 2005 | davef
Problem 1: Solder shortage * Stencil aperatures [except the heat slug] should be 1:1 with the board. * Stencil should be 5 thou thick laser cut. * Board should be 1:1 with the component * Print should look good. Problem #2: Bad connection between p
Electronics Forum | Tue Jan 14 10:41:49 EST 2020 | robl
Hi Arnel, I've used these before but with a 0.005" stencil. The key issue here was that the pins are actually a solder preform at the base that melts into the board - sort of BGA like, so too much paste can cause issues. Samtec have some great app
Electronics Forum | Tue May 23 02:41:37 EDT 2017 | zsoden
Thanks Bukas. I've actually gone to a lot of trouble over the past 24 months to completely clean, rebuild and adjust the pump and nozzle assemblies and even through all of that we've still never been able to get theoretical maximal wave height from t
Electronics Forum | Fri Sep 24 09:49:53 EDT 1999 | C.K.
Hi Folks: We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. The bridging is happening after coming out of reflow...one last thing t
Electronics Forum | Tue Jan 14 11:39:51 EST 2020 | avillaro2020
Thanks Robl. I’ve contacted samtec followed their advice but ended up empty handed. Originally my stencil thickness is 6 mils, samtec stressed the need for the paste and charge to have good contact but this is challenged by the inherent charge non-co
