Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
Electronics Forum | Fri Dec 08 01:05:33 EST 2006 | Setup Guy
Hi Guru, I have a project to evaluate different kind of Solder Bar and Flux to be used in wave solder(RoSH)machine, to choose in which is the best to be use. What is your best practice to evaluate the Solder Bar and Flux ? Cheers, Setup Guy
Electronics Forum | Tue Dec 08 12:44:52 EST 2020 | janwillemreusink
Who is using two sorts of tin in one selective soldering machine with to solder pots? So then the soldering program selects the correct pot (tin). What are the risks? Adding wrong tin in the wrong pot. Mixing up the nozzles?
Electronics Forum | Thu Dec 23 09:09:54 EST 1999 | Chris May
Good on you Wolfgang, Have a good one. Merry Christmas and a Happy New Year to anyone that has helped me in the past. And yes, where did it go ?????? (Answers on a postcard......) Regards & stuff, Chris May.
Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto
Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If
Electronics Forum | Fri Dec 15 07:45:17 EST 2006 | realchunks
The best practice is to perform a design of experiments. Without knowing your product or board composition, it is sensless to recommend any flux or solder. Contact some local area wave solder sales people. There are also "no lead specialist" that
Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.
Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si
Electronics Forum | Wed Apr 26 07:37:34 EDT 2006 | amol_kane
"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from
Electronics Forum | Wed Apr 26 07:37:52 EDT 2006 | amol_kane
"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from
Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o
I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.
