Electronics Forum: solder and paste (Page 326 of 752)

White residues

Electronics Forum | Mon May 26 11:02:17 EDT 2008 | jandon

Hi Mr. Necdet Ozyonum, Recently we did have same kind of problems when we use lead free reflow profile for leaded solder paste (AIM WS-483). There where solder resist lacks, we found white residue after aqueous cleaning. Not in the solder joints but

Solder Paste Reflow Profiling

Electronics Forum | Mon Jul 23 12:12:57 EDT 2001 | kennyhktan

Good day! As we all know the normal recommended solder paste(Sn62/Pb37) reflow profile time is around 40~60sec above the temperature of melting point. Now I'm setting my peak temperature at the high site of solder paste recommended spec. due to metal

Solder particals in the oven?

Electronics Forum | Thu Jun 06 11:42:24 EDT 2002 | Brad Jakeway

What you are seeing on your gold fingers is referred to as flux spattering. This is a very commond problem with gold fingers if you have a zero flux spattering criteria for quality control. The key to eliminating this problem is in the reflow profi

Re: Nitrogen to use or not to use

Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra

At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and

Skewed transistors

Electronics Forum | Mon Apr 21 16:39:50 EDT 2003 | k_h

You might try reducing your solder paste volume. To much solder paste gives the part a pool to float in, nullifying the positive effect of surface tension. I use an aperture on stencil for the heat sink which is 5mils reduced on each side and a 25mil

Reflow problem

Electronics Forum | Wed Sep 26 11:17:38 EDT 2012 | garym4569

We have been having a solder paste reflow issue which results in the solder not wetting to the LED lead. The solder appears to create "puddles" on the pcb pad. I have attached AOI image for review. We have had the pads analyzed for contamination, w

This looks very interesting (Mydata Jet Solder Printer)

Electronics Forum | Fri Oct 14 15:44:30 EDT 2005 | fastek

Yes....interesting. Word is this better be successful for them or they are done. At first glance my issue would be what impact do solder paste "dots" have in the following areas compared to stenciled paste: 1) Controllable with regards to volume 2

BGA Repair Medium

Electronics Forum | Thu Aug 24 09:36:43 EDT 2006 | davef

Medium?? We prefer fully-baked. No, no. It's hearing messages from just about any dead component or board. "Wooo. Chunks. You dove me in the wave solder machine a year ago. I forgive you, because I never saw myself working in a karaoki bar."

BGA non wetting

Electronics Forum | Tue Sep 14 14:22:11 EDT 2010 | grahamcooper22

If the HASL was poor quality and very thin you would find this defect....but you would expect to see it on more pads also. Also, you'd expect to see your solder from your solder paste either dewetted on the pad or reflowed onto the BGA sphere making

SMT Stencil design

Electronics Forum | Thu Mar 19 11:44:03 EDT 2020 | svajunasastrauskas

Hello, can someone share good practise how to calculate how many percent solder paste can be applied on solder mask for better solderability (by increasing stencil aperture). In eg, aperture is increased 30 percent, could it be more? Where find this


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