Electronics Forum | Sun Jul 04 19:49:05 EDT 2004 | indy
Hello Everyone, We are having some problem with Palladium-Silver surface finish. We have ceramic components with the above surface finish. When we try to assemble these on Sn/Pb solder, we are observing open joints. If we reflow the compt for more t
Electronics Forum | Fri Oct 01 13:37:27 EDT 2004 | rkevin
Well Thanks for all the good advise. Lots of different opinions on this one. I took the advise to contact my current supplier of solder paste. They sent in one of their tech people along with a sales guy and we ran without much trouble. Other than a
Electronics Forum | Thu Dec 07 07:36:15 EST 2006 | callckq
Hi Davef, The BGA pad is with ENIG finish, the PCB pad is with immersion silver and the solder paste is with SAC type. I already checked, the solder paste Cu is just 0.5%..Hence, I am guessing that copper migration is from PCB pad. No way it is fr
Electronics Forum | Thu Aug 14 16:18:08 EDT 2008 | mbnetto
Hello I'm mounting a notebook board with the memory conector manufactured by CONCRAFT. We are facing some soldability problems with this conector because some ground leads don't solder on the pads. I tried 4 different brand of solder paste, tried to
Electronics Forum | Wed Jul 15 17:47:59 EDT 2015 | mikekeens
I've read different views on this but the best results i've seen are from when the misprinted PCB is put directly into an automated 'spray-in-air' cleaning machine and cleaned using an appropriate cleaning chemical. Any attempt to manually clean the
Electronics Forum | Fri Feb 09 14:04:22 EST 2018 | ameenullakhan
Hi Justin, The solder paste we are monitoring well. And there is thawing machine to make sure solder paste is not opened early, before it reaches its ambient temperature. we have got a suggestion that , it might be from PCB enig surface finish. Mig
Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
Electronics Forum | Thu Dec 12 10:00:44 EST 2019 | alexeyzb
Hello! 1) You can try to use solderbility tester (https://www.gen3systems.com/solderability-testing-must). 2) You can try to find more agressive solder paste. Some time ago we had the same problem. We gave some samples to our friends from another co
Electronics Forum | Thu Jan 20 14:28:49 EST 2000 | Scott S. Snider
I ran this test back in '92 or '93 when Alpha was first pushing to change from Brookfield to Malcolm readings. The correlation between Malcolm readings to solder paste height is good. I could always look at the viscosity reading and know at least a d
Electronics Forum | Thu Jun 23 05:51:32 EDT 2005 | Paul
Hi Folks, just wondering if anyone else agrees that Rheometric pumps do not work and are more trouble than they're worth. They do not circulate the solder paste properly. The only solder paste that is processed on a FIFO basis is the materia
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