Electronics Forum | Mon Jun 24 22:15:56 EDT 2019 | sssamw
Can you please tell us which components cracked? Component type, size, pitch, pin Qty, etc. The solder cracked in thermal cycling is very complicated and difficult to solve.
Electronics Forum | Wed Feb 14 04:48:58 EST 2018 | ameenullakhan
The profile I have shared is for SMQ92J leaded solder paste
Electronics Forum | Mon Mar 26 16:33:54 EDT 2018 | jacobidiego
I realize that I wrote wrong. Sry The stencil of 0,1mm of thickness is printing 45% more volume. I know this becouse the SPI is setup with the stencil gerbers and the messurements have a median of 145% of volume. what do you mean with excesive sold
Electronics Forum | Wed Aug 08 14:57:20 EDT 2018 | tey422
If you happen to have the Solder Paste Height Measurement System, it would able to do the works for you. That's only if the leads are not long.
Electronics Forum | Fri Aug 24 12:59:03 EDT 2018 | cupet
Dear davef, but this LED is skip component, that's a blank footprint and one of its pad is badly wetted...this is the reason for my thinking about contamination. Do you mean different solder paste with more aggressive flux?
Electronics Forum | Fri Jan 03 02:03:58 EST 2020 | sssamw
What's your target for voiding? I cannot see it violate 25% of solder joint area. Process setting and PCB design can impact the voiding, many factors, such as PCB pad, stencil aperture and thickness, re-flow profile, solder paste, etc.
Electronics Forum | Fri Jun 26 14:08:49 EDT 2020 | indhu
Hi, I am having a issue that SMT nut drop after reflow. The solder height all in specifications. Had tried adding flux inand the solder paste. But shows no improvement. Is the nut easily oxidize? Can anyone help me on this?
Electronics Forum | Tue Aug 08 12:57:52 EDT 2023 | serge_pirog
Good afternoon. If you provide more data, I think you can find the problem. Could you provide: part of the Gerber file, namely the stencil and BGA pad and photo of solder paste on the board after print.
Electronics Forum | Fri Sep 22 12:11:31 EDT 2023 | wippsen
Hi there, if there is insufficient Volume you may optimize the design of your stencil. Its not the goal to decrease the tolerances. Take the PCB and take a look at the printing Shapes with microscope or use the zoom in 3D Function. If there is too l
Electronics Forum | Mon Apr 04 18:23:35 EDT 2005 | GS
Solder volumes is very important parameter to keep under control in order to get a good and reliable CCGA solder joint, and an automatic 3D paste volume inspection is strongly recommended practice to use. Questions: - what Column pitch do your CCGA h
