Electronics Forum | Thu May 30 20:09:58 EDT 2002 | myu
Thank you very much, Dave and Steve. I got paste and wire from Indium and Qualitek. Are there anybody with high-temperature reflow experience (330 degree C)? Is it OK to use Regular Convection Reflow Oven (We have a Conceptronic HVC 70, 5 zones) ?
Electronics Forum | Fri Oct 01 16:21:15 EDT 2004 | sarah104
I second that one Glenn. I have had really solid support from my paste company. Our guy is Kevin with Aimsolder. He is quick to respond and very knowledgable. We used a cheaper paste a while back, but never ever got any support. I wont make that mist
Electronics Forum | Mon Nov 08 15:14:46 EST 2004 | russ
In addition to type of paste, it is also dependant on the enviroment conditions. When you say open jar are you implying that the jar is left open all day and then at the end of shift it is closed back up? Jars should only bve open for about 30 secs
Electronics Forum | Tue Dec 07 05:16:12 EST 2004 | kanwal324
We are using solder paste of Alpha Metals 390DH4. As per manufacturer guidelines the viscosity of paste after 1/2 hr. conditioning and after mixing in paste mixer,it shoule be between 800-1250KCP. Our customer is asking for viscosity to be maintained
Electronics Forum | Fri Dec 16 08:11:39 EST 2005 | rlackey
Hi Dave, Sorry, blonde moment. For our prototype line we decant the paste into a cleaned out pot, that goes under the printer hood, with the lid left on, the rest stays in the fridge until it starts to run down. If we get it wrong we definitely
Electronics Forum | Mon Jan 09 05:14:56 EST 2006 | abhinavajmera
Hi all, I want to know the possible causes of poor paste release in stencil printing process if the same brand and part number of solder paste that has been used successfully is being used with a set of process parameters which worked before. Other t
Electronics Forum | Wed Mar 15 09:36:43 EST 2006 | vicknesh28
Thanks Marc. I will try the things that u have mentioned. I am guessing if the flux can find its way between the bottom foot of the lead and the paste, there has to be a gap between the solder paste and the lead when reflow takes place. As u have sai
Electronics Forum | Fri Jan 12 07:00:27 EST 2007 | GDO
Hi guys, Pin in Paste guidelines will be included in the IPC-7525A "Stencil Design Guidelines". This draft is being reviewed now and is scheduled to be released by February, (March at the latest). There are many other sources for these guidelines
Electronics Forum | Fri Jun 08 12:05:17 EDT 2007 | bbl
If you're not doing any fine pitch or BGA's, it's a "nice to have". With manual screen printing any paste height measurement tool you got would likely generate more fails than you could deal with unless you set the parameters so wide that almost any
Electronics Forum | Fri Feb 29 08:14:33 EST 2008 | cyber_wolf
Thats funny that you mention the WS609. That is the exact same paste we used back in the early 90's. That formulation is notorious for drying out and getting chunky. That is a very dated flux chemistry. I would advise looking into some of the twenty
