Electronics Forum | Mon Feb 15 15:43:06 EST 1999 | Dave Jurena
Hope some of you out there can help me with this one. I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they do
Electronics Forum | Tue Jun 16 15:13:31 EDT 1998 | Bob Willis
There have now been over 100 people take the quiz and the best scores have been in the Dallas area. Keep it up and what about the European visitors ? | Here is a chance to test your knowledge on reflow soldering twenty questions you should know abou
Electronics Forum | Tue Jun 16 15:13:13 EDT 1998 | Bob Willis
There have now been over 100 people take the quiz and the best scores have been in the Dallas area. Keep it up and what about the European visitors ? | Here is a chance to test your knowledge on reflow soldering twenty questions you should know abou
Electronics Forum | Fri May 17 22:25:51 EDT 2002 | xzinxzin
*the other components are 0402 and SOIC 16, the solderability were good. *the protection on the terminations of microleadframe package is Cu(copper),somebody call that leadless leadframe package(LLP). *the time above 210 deg C is about 10 sec. *I us
Electronics Forum | Thu Jun 20 04:41:47 EDT 2002 | redmary
thanks, but I also encounter the solderability problem. because these boards are HASL or Ni/Au finish, and we print the solder paste and reflow, the result shows the some non-wetting area. and the reliability test also proves to be bad. so the critic
Electronics Forum | Mon Apr 21 06:26:28 EDT 2003 | Grant
Hi, We have a SMT production like, however we have very little experience with through hole assembly. We design everything to be completly SMT based, however connectors are the only part of our product that still requires through hole assembly. Cur
Electronics Forum | Mon Jul 19 19:39:06 EDT 2004 | KEN
I once had a forced convection oven (insert brand here)...and the top 220VAC heater (reflow zone) had shorted to the frame ground, blowing the branch line fuses. THe machine had no idea the heater was out because the lower heater was heating the upp
Electronics Forum | Tue Jul 27 11:32:20 EDT 2004 | dwanzek
Thanks for the input guys. One problem with this theory, we see the same failure using Omni 5000 solder paste. We also see this problem across 4 production lines, suggesting it is not oven related. The profile meets recomendations and we have tried
Electronics Forum | Wed Aug 04 15:27:03 EDT 2004 | Rush Fan
I might suggest that you check with your solder paste manufacturer to see what is recommended for time over reflow. Typically, I think most are between 60 and 90 seconds over 183. Also, consider the rate of cooling. The faster you cool the solder, th
Electronics Forum | Sat Aug 07 17:27:00 EDT 2004 | celldude
We use ssd on all components, from 0201 to very large fine pitch and bga's. With some very small micro bga's , if there is a problem with bridging, we will tape off the stencil during the ssd process and just use bare pads...along with the solder fr
