Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Fri Apr 26 10:42:28 EDT 2002 | Jim M.
I worked for a telecom company that had sites in the deserts, jungles, mountains and regular built up area's. All boards were built using Aim 291/293 No clean solder paste. (all boards built to Bellcore standard) The boards were coated with Dymax ur
Electronics Forum | Fri Apr 23 12:26:27 EDT 1999 | Jeff Anweiler
| | I would like to known what�s MESH SIZE mean in the solder paste specification ? | | | | | Check out the thread from 4/14/99 on solder FINES vs. solder balls. The info you're looking for is in there. | "Mesh Size" is a term that is commonly use
Electronics Forum | Tue Dec 06 06:14:38 EST 2005 | bwet
Try using some of those new polyimide stencils. They are 8mils thick and can prevent shorting if it is due to solder mask problems or too much paste. http://www.solder.net/technical/tips.asp BWET
Electronics Forum | Thu Feb 27 12:23:47 EST 2003 | woodsmt
James, Have you considered going to a No-clean process? BGA's can be difficult to impossible to clean using an aqueous process. The water just won't penetrate under the entire BGA and efficiantly remove your flux residues. The tighter the pitch
Electronics Forum | Thu Oct 15 15:34:16 EDT 1998 | Andrew
We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are currently
Electronics Forum | Fri Jun 11 08:38:55 EDT 2004 | davef
We figured you were going to say that. Pay me now, or pay me later, you call it. As an alternative: * Cover the backside of the via with masking tape that will take soldering temperature, like Kapon, or a temporary solder mask * Enlarge the apertur
Electronics Forum | Tue Nov 15 22:27:21 EST 2011 | Jacki
Hi Zaza Thanks. Again, very appreciate if you advise me where I can get the SN100C solder bar that is water soluable. Now I'm checking Nihon Superior(Singapore) whether they have or not. As our customer's preference, we have to use the watersoluab
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Wed Mar 22 14:46:54 EDT 2017 | solderingpro
Laser Soldering by nature is a very dialed in process. - Requiring specially formulated flux and solder paste applications that will perform while absorbing a massive amount of energy. What I believe "Gary" is attempting to say is: Laser Soldering c
