Electronics Forum | Tue Dec 14 08:01:14 EST 2004 | paul_fisher
Our paste is no new we have used it before [Cobar no-clean paste]. The solder joints look like they are bursting out salty looking crystals. Maybe the board cleaning is a red herring in that if the boards are clean it stops this crystalisation travel
Electronics Forum | Thu Mar 06 22:34:55 EST 2003 | davef
O' Connor: Are you saying that: * You solder fine in the areas where you print paste * You solder poorly in the areas where you don't print paste Aside from that, the gold on these pads seems to be less bright than previous lots. [if that's not it
Electronics Forum | Sun Feb 26 17:40:35 EST 2006 | GS
Hi, just my comment, theoretically No Clean means no Ion Contaminants from Flux, but it some some case ion contamination (Cl-Br-F) could come out from raw PCBs, from Components, from fingerprints, etc. To incorporate a ROSE step in the pro
Electronics Forum | Thu Mar 17 09:53:20 EDT 2011 | rperkins
Hi Graham, I've worked in the industry selling EnSolv, Lenium, and now ENTRON solvents, which are all based on stabilized NPB. These solvents do not always clean the no lead pastes. The problem is that the pastes are becoming more like adhesives,
Electronics Forum | Wed Mar 21 20:40:28 EST 2001 | dblsixes
We are building a monster ... Dimensions are 10" x 7" ... 12 layers ... A Logic Assembly with a Power Supply all rolled into one ... The Power Supply is in one section of the board, the logic in the other section ... The Power Supply obviously has a
Electronics Forum | Thu Dec 16 11:27:39 EST 1999 | C.K.
Hey Folks: I just want to get an idea how many of you use in-line or off-line visual inspection for solder paste deposition? At my company, we have one off-line, and it inspects for paste height. It's not always consistent either. Sometimes, it g
Electronics Forum | Thu Dec 16 20:41:56 EST 1999 | TNT
Hey C.K, If you are looking for inspection of the solder paste before reflow, there are many types of inspection: 1.Paste height measurements at random positions 2.3D inspection with shadow contrast capabilities based on an autocad format 3.3D inspec
Electronics Forum | Thu Aug 26 10:28:07 EDT 1999 | Stuart Adams
What are the key steps to achieving high yield with CSP ??? (We are trying qualify vendors for volume fab/assembly of some products which use several CSP devices on each side of the board. (Some with 0.5mm ball pitch)) Looking through the forum I
Electronics Forum | Fri Aug 27 13:24:19 EDT 1999 | swsng
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Fri Jul 09 19:35:05 EDT 1999 | Earl Moon
| Hi Carol- | What you are asking for can be done. Variables you must account for include the paste viscosity, dispensing head speed, dispenser height relative to board surface, and needle size. You can use most any semi-automated system such as Ca