Electronics Forum: solder and paste (Page 561 of 752)

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon

| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following

Squegge Angle for Fine pitch?

Electronics Forum | Thu Dec 18 21:36:03 EST 2003 | pdeuel

Blade angle, print speed, squeegee pressure, should be used in conjenction with one another. The more parellel the blade is to the stencel the more it will tend to float over the solder and the more paste is forced thru the appature. Contrary the gre

Soldering Lead-Free Components with Leaded Paste

Electronics Forum | Fri Aug 08 08:41:24 EDT 2003 | Kris

Some good info here on the motorola website hope this helps http://www.mot.co.jp/about/ehs/green/ENV_PBFREEOV.pdf Thanks

Soldering Lead-Free Components with Leaded Paste

Electronics Forum | Fri Aug 08 09:41:42 EDT 2003 | gdstanton

Thanks Phil, Yes this is a Lead-free BGA. Not sure of the alloy yet. Looking into it.

Paste-in-Hole reflow soldering

Electronics Forum | Wed Aug 09 04:20:19 EDT 2006 | Rob

If you kink the leads will you be able to insert it without flexing the board/moving any of the other components? Also these pin headers aren't always designed for this process so have you checked that it will take the elevated temperatures?

Paste-in-Hole reflow soldering

Electronics Forum | Wed Aug 09 08:59:52 EDT 2006 | zanolli

I agree with verifing this part is even high temp reflow compatible. The age of the original dwg release, 1986, and as there is no mention of high temp reflow compatibility, only a mat'l call out of nylon, leads me to think it is not.

Lead Free Alloy

Electronics Forum | Fri Nov 09 12:42:08 EST 2007 | wayne123

Smt paste= SAC305 Wave Solder= SN100C no real problems with either of these. good luck

Pogo Contamination

Electronics Forum | Thu Aug 14 07:44:59 EDT 2008 | davef

Comments are: * Link you posted to your brush actually connects to a general catalog page. * Not sure what solders your friend was using, but pastes leave different residues that affect probing. Some are soft and gooey, others are hard and brittle.

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Thu Mar 19 20:12:32 EDT 2020 | slthomas

Stephen, you are spot on with your description. Here's a .jpg with paste layer, copper, and solder mask.

Questions about SMT Process Control

Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef

Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr


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