Electronics Forum | Mon May 26 04:02:13 EDT 2003 | Franky
Dear sir, I think so with every idea , everyone is correct , paste , pattern of pad design ,profiling or solder mask on PCB ,and one of the cause of tombstone that I found is alignment of machine placing and solder printing , from my experience many
Electronics Forum | Tue Jun 17 09:24:43 EDT 2008 | rgduval
Could it be from a dirty stencil, rather than from the pick and place operation? We've seen a number of occurences recently with solder balls near some of our fine pitch components...we eventually diagnosed as dirty stencils...excess solder on the b
Electronics Forum | Tue Feb 23 09:21:15 EST 1999 | Steve Schrader
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Mon May 24 04:01:10 EDT 1999 | Joe Manzur
John, We are using a well known solder paste, begining with the letter "H". (I don't want to be accused of advertising). Also, we are now using a board inverter. In the early day's however, before we purchased a board inverter, we were having to
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
Electronics Forum | Sun Apr 25 11:30:12 EDT 1999 | Earl Moon
| Hello all, | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profi
Electronics Forum | Fri Jun 12 15:24:30 EDT 1998 | Steve A
| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on
Electronics Forum | Sun Apr 05 18:59:15 EDT 1998 | Graham Naisbitt
Jaqueline There are so many variables in the electronic assembly manufacturing process involving more than 12 different chemistries, that it is impossible to easily identify and determine the nature and reason of such residues. GEC Hirst Research in
Electronics Forum | Wed Apr 28 11:47:34 EDT 1999 | Frank Boyko
| | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | We are considering trying boards with White Tin solderable
Electronics Forum | Mon Aug 30 10:17:16 EDT 2010 | markgray
We currently use this devise in one of our designs with no issues. We are using a 3mil stencil and a 45% apperature reduction. It is virtually impossible to eliminate voids but they are in an acceptable range. Solder balls are caused on this componen
