Electronics Forum: solder and paste (Page 601 of 752)

CLEANING OXIDIZATION OFF OF WHITE TIN PADS

Electronics Forum | Wed Jul 23 08:21:55 EDT 2003 | James

Here we go again. I tried changing paste and that did nothing. Literally solder balled up and flew to the next pad. What would be a short term fix to use up all baards with white tin. Is there a fix if the board house did not manufacturer the boards

Acceptable level of defects for Wave Soldering

Electronics Forum | Tue Sep 28 05:04:10 EDT 2004 | grayman

In obtaining almost zero defect in solder wave. I would like to suggest the following: First,We must consider changing machine if it is more than 5 years old. second, use the right tools for the right job. Most of the traditional engineers will us

Immersion White Tin

Electronics Forum | Mon May 14 13:33:36 EDT 2007 | jax

Solderability!!! The CM in question has probably seen too many solder problems with White Tin in the past. We have had the same issues. To save us from spending too much time and money(verifying pure Tin plating thickness, Chemical leaching from th

Soldering to Immersion Tin surface finish

Electronics Forum | Fri May 11 10:30:26 EDT 2001 | rkevin

I am looking for info. (pro and con) and/or 1st hand knowledge processing PCB's with Immersion Tin finish through SMT and Wave. Do profiles need to be different? Solderpaste considerations? Anything else? In the past I have experienced selective non

Re: reflowing through hole components

Electronics Forum | Tue Apr 07 05:46:15 EDT 1998 | bob willis

| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. For information on PIHR soldering there is a report, vid

QFP rework

Electronics Forum | Thu Apr 01 12:05:21 EST 2004 | babe

Heat guns scare me, hot air scares me too. Just the heck of it why not apply high temp paste to the center and eutectic 63/37 standard solder to the outside pads. The outside reflows first allowing proper seating of the component and with a proper pr

Solder balls

Electronics Forum | Wed Nov 20 09:23:53 EST 2019 | alpha1

We had a board we fought with for a while with solder balls. Checked everything, Stencil thickness at .004, reduced apertures, changed paste 3 times, changed profile 3 times. Finally changed board vendors. Went from HASL to Emersion Gold. Problem sol

Wavesoldering Preheat

Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude

What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co

PCB Design Question - Hard gold or ENIG for keypad button contacts

Electronics Forum | Tue Feb 21 01:32:49 EST 2017 | soldertraining

Looking for advice on soldering lead free paste to a board with very heavy gold plating, In my opinion, Gold contact surfaces are often used on circuit boards with membrane switches which is a choice of technology for industrial, commercial and consu

low volume /semi-automatic solutions

Electronics Forum | Wed Jun 18 16:03:03 EDT 2003 | mkehoe

Orrrrr, just buy a small reflow oven, 5K to 7K, and eliminate the paste printing by using solid solder deposition. No shorts, no opens, no cleaning, and no voids. www.sipad.com If you decide to print your own paste later you can invest the extra 30


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