Electronics Forum | Fri May 21 15:23:24 EDT 1999 | JohnW
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup
| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
Electronics Forum | Fri Jun 25 13:52:51 EDT 2010 | tate350
Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.
Electronics Forum | Mon Jul 06 18:00:16 EDT 2015 | jwqc
Does any one know how to calculate BGA height change after reflow oven? I guess the calculation will be based on the component size, weight, ball diameter and ball count of the BGA, but how to get the actual height?
Electronics Forum | Mon Jun 21 08:01:38 EDT 2010 | jm
Hello, need some help if anyone has any insight on this issue. Ran first side and ex-ray indicates BGA parts look normal. Ran the second side and now the BGA balls on first side appear to have broken free and moved under part. This board has BGA's
Electronics Forum | Fri Jun 25 07:33:23 EDT 2010 | CL
Good Morning JM, Does anything come into physical contact with the BGA in question during the reflow event? Is this a RoHS process? If so, is the BGA in question also a RoHS part? Thanks Chris
Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef
Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse
Electronics Forum | Tue Sep 11 10:13:58 EDT 2001 | davef
Yes, you cannot change the "subject" that you enter when first beginning a tread. This is what will appear on the Main Conference. You can change the very same "subject" as it appears when the thread is selected in one of the Forums with "edit" or
Electronics Forum | Mon Aug 06 09:15:01 EDT 2001 | gdstanton
|120 |140 |160 |180 |180 |190 |260 | with a belt speed of about 28 IPM. The uBGAs are placed parallel to each other along the smallest side. The small edges closest to each other are raised slightly and form a "hill" when looking from the horizon o
