Electronics Forum | Thu Sep 15 11:16:20 EDT 2005 | pjc
Thanks Steve, good point about warped boards, which are common with doube-sided reflow. Centerboard support helps minimize on reflow. We did do modification to the workboard holders to ensure boards are secured. The boards where small enough that war
Electronics Forum | Tue Feb 13 14:39:52 EST 2018 | horchak
Your profile reflow temps are too low. Omnix338 has a melting temp of 217-221C. Your right on the edge, and your soak temps should be closer to 150 than 180C. Bottom line too high a soak, too low a reflow. Take it or leave it.1874
Electronics Forum | Fri Feb 09 13:28:24 EST 2018 | jmedernach
Pin holes in the solder joints on various devices can be an indicator of something amiss with the solder paste itself. Solder paste storage may be a concern. Do you possibly have someone putting paste back in the refrigerator after use? Are you tr
Electronics Forum | Tue Feb 13 05:11:58 EST 2018 | ameenullakhan
Hi, We are using 10+2 reflow oven ( BTU Pyramax 150 ). We have tried with short TAL ( RTS profile too ). As of Now we are using the attached profile, which has given us lot better results. But the issue is not eliminated. Thanks
Electronics Forum | Tue Feb 13 06:43:39 EST 2018 | ameenullakhan
Attached is one more profile we have tried with high reflow time. The issue with before and this profile is reduced a lot. But not eliminated.
Electronics Forum | Thu Sep 15 17:55:18 EDT 2005 | slthomas
Are they worried about the top side SMDs too, or just the bottom side? If it's just the bottom, maybe you can just glue them without reflowing. That way they won't be at risk of cracked solder fillets after AI. Granted, you'll probably be glueing pa
Electronics Forum | Tue Aug 24 12:20:33 EDT 2004 | davef
The methods Terry mentioned are good, but our operators are too impatient. Here's how they do site prep, after removing the BGA: * Use a soldering iron to melt the solder at the base of the ball. * Flick the ball[s] from the pad[s] with the solderin
Electronics Forum | Thu Oct 23 23:38:48 EDT 2008 | pathakvj
We have 8 layer HASL PCB. We saw molten solder blobs / balls on op side of assembled PCB. (to check, if this was a bare board problem), We passed bare board as received thru, SMT reflow oven and saw solder balls on top side of board. What could be th
Electronics Forum | Wed Dec 13 19:40:38 EST 2000 | Jerry Wetzel, SME, EM/SME
Your profile must be precise, your stencil aperture sizes and shapes are very important, and the size of the pads on the boards should be very close to what the part manufacturer recommends. We had some trouble with hi-temp paste, and discovered tha
Electronics Forum | Thu Sep 15 11:44:27 EDT 2005 | LeeHoMa
hi Pete, By the way, in your successful example, what kind of soldering method is being used after the Auto-Insertion?
