Electronics Forum | Sat Mar 25 10:13:18 EST 2000 | Robert Hutton-Squire
I am assembling a board with 2 x ALTERA FineLine PBGA devices. (256-pin and 100-pin) These devices have: surface pad size = 0.41mm (16) ball size = 0.48mm (18.9) ball pitch = 1.0mm (40) For my FIRST attempt I screen printed a fine pitch water solub
Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
Electronics Forum | Fri Mar 23 09:28:46 EST 2001 | PeteC
Well, it's hard to say what it started out as, a smear, splash or ball cause the solder formation on the finger after reflow is spread out ya know. I looked at an archive for possible causes and one was printer operators with paste on their fingers.
Electronics Forum | Mon Aug 12 12:58:16 EDT 2002 | pjc
What I've done w/ eutectic ball BGA devices is after removing the BGA from the PCB, solder-suck the lands- get em nice a flat, apply a thin coat of gel flux to the solder lands and then a thin coat to only the bottom of the solder balls on the new BG
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
Electronics Forum | Mon Jan 16 09:15:40 EST 2006 | russ
I can't see why it would be any different, You are melting the balls into reflow to the pad. In my opinion, paste is only useful in this situation to keep the part on the board during placement along with some planarity concerns in some instances.
Electronics Forum | Thu Apr 24 20:52:03 EDT 2008 | davef
Use of a hot air gun to reflow solder that passes tests [after failing those tests] seems to indicate the standard process reflow was inadequate. To understand this better, we'd want to measure temperatures at various points on the board during reflo
Electronics Forum | Tue Apr 04 10:08:33 EDT 2000 | Russ
Neil, IPC 610 has the criteria for solder balls re. quantity and size per sq./in. These are acheivable requirements but no-clean is not necessarily a drop in process. You need to review stencil /pad /component design to ensure that "midship" solde
Electronics Forum | Tue Oct 28 10:45:22 EST 2003 | Gabriele
After following the suggestions above, and where it would not be possible to mask BGA by soldering fixture, a Kapton tape (pre-punched) can be placed under BGA ( wave solder source side ) it can help to keep temperature low enough avoiding "seconda
Electronics Forum | Fri Sep 03 14:20:38 EDT 1999 | David
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | You must have been in the same meeting I was in earlier today. We are currently having some opens on BGAs. The problem joints are all on the perimeter of