Electronics Forum | Thu Aug 05 11:51:44 EDT 1999 | Wolfgang Busko
| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi
Electronics Forum | Thu Apr 10 19:21:02 EDT 2003 | tony_sauve
Kevin, One point that I'd like to make is that in order to get an accurate reading of the solder joint temp's you need to have the thermocouple right at the ball/PCB interface. I'd recommend precision drilling a mechanical sample of the unpopulated P
Electronics Forum | Thu Jun 06 02:15:05 EDT 2002 | Sam
Hi. I'm checkin up needs for AOI or AXI in our SMT lines, and advantages and weak points between AOI and AXI (=automatical x-ray inspection). Our case is high mix low volume production 24h in 5 days of a week, so there are no online time to spend pr
Electronics Forum | Tue Jul 27 16:22:17 EDT 1999 | Earl Moon
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Tue Oct 22 13:11:07 EDT 2002 | slthomas
After considerable hemming and hawing, we decided to drop the bomb on 'em....give us ORL0 (which we use here) AND no bottom side solder balls or belly up to the bar with some favorable Appendix B test results on their preferred flux. As usual, Mr. F
Electronics Forum | Mon Sep 17 05:48:10 EDT 2012 | stivais
Hi Ben, Yes, this could be the reason but have you ever seen solderability issues for (new) boards with LF-HAL surface finish? I have seen this only if there are surface finish quality issues for bare boards (exposed copper etc.). In this case we di
Electronics Forum | Wed Jul 06 15:29:01 EDT 2022 | glasscake
Also I should mention, I've ditched the formulas for getting the "optimal" solder amount after being bit by them once. Now I just design a PCB with 4-10 spots for the connector then order a stencil with a range of aperture sizes. Figure out what give
Electronics Forum | Thu Oct 05 13:48:20 EDT 2023 | tommy_magyar
Whatever the cleaning process is or will be, after cleaning make sure you check on X-Ray for any solder balls/debris in microphones. This is a friendly reminder to check, unless you want to receive customer complaints. Been there, seen that - we went
Electronics Forum | Wed Jun 13 16:13:54 EDT 2001 | Igmar
Have anyone seen this problem: Capacitors (100nF 0805) placed on PCB and then appear cracked after reflow. After reflow, the solder joints look visualy acceptable. Then capacitors fail during testing. When attempting to remove capacitor with hot sol
Electronics Forum | Tue Jul 27 15:15:48 EDT 2004 | JSTARKEY
We have recently encountered a problem that we haven't seen before: The solder joint appears to be wetting ok and the solder is re-flowing but the appearance of the solder after re-flow is pitted. Using Kester 531, humidity around 41% temperature aro
