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The Last Will And Testament of the BGA Void

http://www.hellerindustries.com/last-will-of-bga-void.pdf

] Investigation Specifics:  Variety of BGAs and CSPs, daisy chained, various solder ball diameters  SnPb and SAC solder pastes  Test vehicle one: 2.36mm thick (93 mil), FR-4, 6 internal planes , 1.0mm pitch, various solder ball diameters  SnPb solder paste  Test vehicle one: 2.36mm thick (93 mil), FR-4, 8 internal planes, OSP finish  Thermal cycling: 0°C-100 :  A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area  Solder crack path typically found at solder joint / BGA package interface  Via in Pad (VIP joints is visible. Figure 11 (bottom) shows an oblique view X-ray image of a BGA ball with 30% void. It also shows the interfaces of the solder joint as ellipses above and below the ball. Figure 11. X-ray Examination of Test Vehicle Revealing: Top - Voids @nordsondage.com ABSTRACT The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion

1809 fan speed

http://www.hellerindustries.com/search.php?zoom_query=1809+fan+speed&zoom_page=9&zoom_per_page=10&zoom_and=0&zoom_sort=2

... inch thick stainless steel stencil applied solder paste to the test vehicles (Figure 9). The solder paste was Alpha tin/lead solder alloy WS- 609 . 167 The test vehicles were allowed to air cool after reflow and area is then compared to the total ball area to determine the then placed in the Electrovert Aquastorm 200 in-line percentage level of voiding within each solder ball. cleaning system for removal ... 9 Jan 2017   -   URL: http://www.hellerindustries.com/last-will-of-bga-void.pdf . The components were placed using the Universal Advantis machine. Figure 8. As-Assembled Test Vehicle Figure 9. MPM Stencil Printer The test vehicle was reflowed in a Heller 1912EXL Convection Reflow Oven

The Last Will And Testament of the BGA Void

http://www.hellerindustries.com.cn/last-will-of-bga-void.pdf

] Investigation Specifics:  Variety of BGAs and CSPs, daisy chained, various solder ball diameters  SnPb and SAC solder pastes  Test vehicle one: 2.36mm thick (93 mil), FR-4, 6 internal planes , 1.0mm pitch, various solder ball diameters  SnPb solder paste  Test vehicle one: 2.36mm thick (93 mil), FR-4, 8 internal planes, OSP finish  Thermal cycling: 0°C-100 :  A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area  Solder crack path typically found at solder joint / BGA package interface  Via in Pad (VIP joints is visible. Figure 11 (bottom) shows an oblique view X-ray image of a BGA ball with 30% void. It also shows the interfaces of the solder joint as ellipses above and below the ball. Figure 11. X-ray Examination of Test Vehicle Revealing: Top - Voids @nordsondage.com ABSTRACT The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

http://www.hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance . Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints . Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing . The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles ]. Thus even with vacuum reflow, the debate remains regarding the effect of voiding on solder joint reliability. This paper reports the results from a test To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL

How to make a good PCB solder ball

https://www.ourpcb.com/solder-ball.html

ball joint reliability. The subject of the study was electroless Ni/Pd/Au plating on an Sn-3.0Ag-0.5Cu (SAC305) solder ball joint. The study used a solder ball shear test. The Pd film thickness between 0.05-0.02 microns was found to be the optimum How to make a good PCB solder ball Skip to content Call Us Today:+86-311-87874960 | info@ourpcb.com Home About us Payment terms and conditions Custom Wiring Harmess PCB Manufacturing Manufacturing PCB Prototyping PCB Capabilities PCB Equipment PCB Gerbers PCB Assembly PCB Assembly PCBA Equipment Contact Us Home / How To Make a Good PCB Solder Ball How To Make a Good PCB Solder Ball A solder ball is a glob of solder that can serve to connect a chip package and a PCB . A solder ball placed within 0.13mm of traces, or that is wider than 0.13mm in diameter violates the principle of minimum electrical clearance . The errors that can cause a solder ball to bring about defects in an assembled PCB are innumerable. According to IPC, solder balls do not cause defects so long

capabilities - PCB Assembly,PCB Manufacturing,PCB design - OURPCB

https://www.ourpcb.com/capabilities

&Space 3mil Qualifications ISO14001:2015, ISO9001:2015, Certified IATF16949: 2016,Certified Technology: On-Across Blindried Vias, Characteristic Impedance Control, Rigid-flex Board etc Solder Mask Color : ► Single Point Source: No need to order bare board PCB from one supplier, solder stencil from another supplier and PCB assembly from yet another supplier ≥1 Minimum width/space of QFP  0.15mm/0.3mm, Minimum Diameter /Space of BGA: 0.2mm/0.35mm  Reliability Test Flying Probe Test/Fixture test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, and Micor Metallographic Section Analysis, etc ) Min Distance between Pads 4 mil (Ultimate:3 mil) Minimum Laser Hole 0.1mm Minimum PTH 0.3mm Min NPTH Tolerance ±2 mil(Ultimate +0,-2 mil or +2 mil,-0) Solder Bridge Min Width (bottom copper<2OZ) 4 mil(Green),8 mil Solder Bridge Min Width(bottom copper 2-4OZ) 6 mil,8 mil Overlay Colour White、Yellow(printed character:White) Type of Surface Treatment OSP HASL, Lead free HASL, Immersion gold, Hard gold, Immersion silver, OSP Selective Surface Treatment ENIG

Microsoft Word - Sn100E_700LF_TDS_e.doc

https://qualitek.com/wp-content/uploads/2017/06/p700lf_sn100e_tds.pdf

2.4.34.3 modified Thixotropic Index 0.50-0.60 Slump Test Pass IPC-TM-650 2.4.35 Solder Ball Test Pass IPC-TM-650 2.4.43 Tack Initial 120 gm JIS Z 3284 Tack retention ) LEAD FREE WATER SOLUBLE SOLDER PASTE Sn100E 700LF Rev. E., 2/17 Description Delta® Solder Paste 700LF is a unique water soluble flux system designed specifically for Sn100E (Sn/Cu/Co) alloy . Main Features Excellent wettability Cost savings compared to SAC alloys Yield shiny joints Technical Data Specification Test Method Flux Classification ORH0 IPC-J-STD-004B Copper Mirror >50 @ 24 hr 95 gm JIS Z 3284 Stencil Life 4-8 hrs QIT 3.44.5 Sn100E 700LF Rev. E., 2/17 Physical Properties Solder Composition Qualitek® Sn100E (Sn99.5/Cu0.5/Co . Solder powder distribution is measured utilizing laser diffraction, optical analysis and sieve analysis. Careful control of solder powder manufacturing processes ensures the particles’ shape are 95% spherical minimum (aspect ratio < 1.5

Ecolloy_798LF_TDS __TD mod-Rev. 0_20160223.pdf

https://qualitek.com/wp-content/uploads/2017/06/ecolloy_798lf.pdf

0.20/0.20 IPC-TM-650 2.4.35 Solder Ball Test Pass IPC-TM-650 2.4.43 Tack Initial 62 gm JIS Z 3284 Tack retention @ 24 hr 47.2 gm JIS Z 3284 Tack retention @ 48 hr ™) LEAD FREE WATER SOLUBLE SOLDER PASTE Ecolloy™, 798LF, Rev. 0, 01/16 Description Qualitek has developed a new patented lead free alloy, Ecolloy ™ that performs better than SAC305 in the drop test. Ecolloy has a melting point range in between SAC305 and Sn/Cu alloys for better performance during reflow . Ecolloy is available in both no clean and water soluble solder paste types. DSP 798LF lead-free solder paste with Ecolloy exhibits superior joint strength, excellent wettability and print definition . DSP 798LF residues are easily removed so yields bright, shiny solder joints. Main Features Ecolloy has greater tensile strength than SAC alloys Ecolloy has better workability during reflow than Sn/Cu alloys Bright, shiny joints Extended stencil life Excellent wettability

Seika Machinery Introduces PR1 Pocket Handy BGA Solder Ball Checker | Seika Machinery, Inc

http://seikausa.com/news/seika-machinery-introduces-pr1-pocket-handy-bga-solder-ball-checker

Seika Machinery Introduces PR1 Pocket Handy BGA Solder Ball Checker | Seika Machinery, Inc Skip to Navigation ↓ Torrance, CA  Phone: (310) 540-7310  | Atlanta, GA  Phone: (770) 446-3116 San Francisco, CA  Phone: (510) 293-0580 | 24-hour Answering Service: (888) 734-5278 Search form Search Main menu Home Products Rubber Testing SEIKA TV News Representatives Company Info RFQ Seika Machinery Introduces PR1 Pocket Handy BGA Solder Ball Checker Seika Machinery, Inc ., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections . With an expanded lens, the PR1 is capable of up to 7X magnification. For more information about the PR1 BGA Solder Ball Checker, contact Seika Machinery at 310-540-7310 or e-mail info@seikausa.com Ovens Automatic Test Equipment HIOKI In-Circuit and Flying Probe Testers Green Technology Solder Paste Recycling System Sawa Eco-Roll

June 2010 | Seika Machinery, Inc

http://seikausa.com/archive/201006

| 24-hour Answering Service: (888) 734-5278 Search form Search Main menu Home Products Rubber Testing SEIKA TV News Representatives Company Info RFQ June 2010 05 Jun 2010 Seika Machinery Introduces PR1 Pocket Handy BGA Solder Ball Checker Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections Ovens Automatic Test Equipment HIOKI In-Circuit and Flying Probe Testers Green Technology Solder Paste Recycling System Sawa Eco-Roll Unitech PCB Cleaners Malcom SMT & Solder Process Control SMT Products Sayaka PCB Router Nihon Superior Solder AI-TEC PCB Conformal Coating and Curing System Seitec Selective Solder Andes Eightech Reflow Ovens Tamura iLead-Free Reflow

EMPF PP0005 - Mini-Ball Grid Array(mBGA) A Direct Chip Attach BGA (Oct 1994)

https://store.aciusa.org/EMPF-PP0005-Mini-Ball-Grid-ArraymBGA-A-Direct-Chip-Attach-BGA-Oct-1994-P90.aspx

EMPF PP0005 - Mini-Ball Grid Array(mBGA) A Direct Chip Attach BGA (Oct 1994) Login Account Wishlist Cart Toggle navigation Account Home Product Finder Advanced Search Contact Us Login Home  >  Publications  >  Digital Downloads  >  EMPF White Papers EMPF PP0005 - Mini-Ball Grid Array(mBGA) A Direct Chip Attach BGA (Oct 1994) Item #: 400010 Our Price: $0.00 Quantity:   Description Reviews Also in EMPF White Papers Description .  The repatterned die is called a mini-Ball Grid Array (mBGA).  The geometries of the repatterning allow current SMT equipment and processes to be used to assemble the repatterned die + Add to Cart EMPF PP0006 - An Overview of Manufacturing BGA Technology (Oct 1994) Price: $0.00 + Add to Cart EMPF PP0003 - Manufacturing Surface Mount Assemblies Using Lead Solder Replacements (June 1994) Price: $0.00 + Add to Cart Categories There are no subcategories. Share Tweet Pin It Recently Viewed IPC J-STD 001 - CIS/CIT - Certification Solder Training Kit (ENIG) 80081000 Price: $40.00

ACI Technologies, Inc

https://store.aciusa.org/courses/bga_insp-rwk-rep.pdf

ACI Technologies, Inc Overview Manufacturing with Ball Grid Array (BGA) packages generally offers high, first-pass process yields . However, process errors do occur and there is the likelihood of a solder joint defect (insufficient solder, bridging, solder balling, etc . Proper rework techniques covered will include the development of a removal and replacement profile, component removal, PWB site preparation, solder paste application, component placement and reattachment

Best Papers - Award Winners | SMTA International

https://www.smta.org/smtai/best_papers.cfm

to +125 Thermal Cycle Test Results" 2009: Paul Vianco, Ph.D., Sandia National Laboratories "Pb-Free Solder and Beyond - Trends and Challenges . Goetz and Marc Papageorge, ASAT, Inc. "BGA Performance, Characteristics: A User’s Design Guide" 1994: Andrew J. Mawer, Motorola Semiconductor Division "Plastic Ball Grid Array Solder Joint Reliability Considerations" 1993: Dr. Ning-Cheng Lee, Dr and Test Process for a Server Complexity PCBA" 2006: Heather McCormick, Celestica, Inc., Canada "Mixing Metallurgy: Reliability of SAC Balled Area Array Packages Assembled Using SnPb Solder" 2005: Lars Boettcher, Fraunhofer IZM Berlin "Integration of Active " 2015: Cong Zhao, Auburn University "Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments" 2014: Jie Gong, Ph.D., Georgia Institute of Technology "Non-Destructive . The award is based on the conference attendees' rating of each speaker at the technical session. 2018: Kazuhiro Nogita, The University of Queensland " The Role of Nickel in Solder Alloys - Part 2

Journal of SMT Articles

https://www.smta.org/knowledge/journal.cfm

Abstract 20-4 0.4 mm SOLDER BALL PITCH CHIP SCALE PACKAGING AND DROP TEST PERFORMANCE Geun Sik Kim and Dong Sik Kim Abstract 20-4 AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS G JOINT MICROSTRUCTURE OF VARIOUS SnAgCu CERAMIC BALL GRID ARRAY (CBGA) GEOMETRIES AND ALLOYS Marie Cole, Matthew Kelly, Mario Interrante, Grego Abstract 19-4 AGING EFFECTS ON DYNAMIC BEND TEST PERFORMANCE OF PB-FREE SOLDER JOINTS ON NI/AU FINISH Min Ding Adhesives Geoff Rivers, Pearl Lee-Sullivan, Boxin Zhao, Alex Chen, John Persic and Robert Lyn Abstract 30-3 Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating -Influence of Electroless Pd – On – Low Temperature Co-Fired Ceramic (LTCC) Technology for High Temperature Electronics P. Vianco, J. Rejent, M. Grazier, A. Kilgo, B. McKenzie, A. Allen, E. Guerrero and W. Price Abstract 29-2 Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Arrangements Cong Zhao, Chaobo Shen, Zhou Hai . Abstract 28-4 Assessment of the Effect Of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure Pradeep Lall, Ph.D., and Kazi Mirza Abstract 28-3 Non-destructive Evaluation of Solder Ball Quality under

EMS_Metcal.qxp

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/EMS_Metcal.pdf

EMS_Metcal.qxp Reprinted with permission from the February, 2015 issue of ... Solder Ball Replacement Kit Eases PCB Rework By Paul Wood, Metcal, Garden Grove, CA Component miniaturization poses many challenges forglobal printed-circuit-board (PCB when replacing these small components. The approach is sup- ported by a tool kit, the Solder Ball Placement Kit from Metcal , that includes all the tools needed to rework small chip components . Solder Ball Kits The kit is based on the use of solder balls that can be dispensed into flux with special tools capable of picking up a single solder ball and placing it on a pad next to a compo- nent to be mounted . Each Solder Ball Placement Kit includes the tools required for placing individual solder balls where needed. The kit also contains four different sizes of solder balls, 2000 of each, for use with four different component sizes . The versatile Solder Ball Placement Kit features a glue scraper for reworking PCBs with glued components, such as found in cellular telephones and portable computer products

EMS_Metcal.qxp

http://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/EMS_Metcal.pdf

EMS_Metcal.qxp Reprinted with permission from the February, 2015 issue of ... Solder Ball Replacement Kit Eases PCB Rework By Paul Wood, Metcal, Garden Grove, CA Component miniaturization poses many challenges forglobal printed-circuit-board (PCB when replacing these small components. The approach is sup- ported by a tool kit, the Solder Ball Placement Kit from Metcal , that includes all the tools needed to rework small chip components . Solder Ball Kits The kit is based on the use of solder balls that can be dispensed into flux with special tools capable of picking up a single solder ball and placing it on a pad next to a compo- nent to be mounted . Each Solder Ball Placement Kit includes the tools required for placing individual solder balls where needed. The kit also contains four different sizes of solder balls, 2000 of each, for use with four different component sizes . The versatile Solder Ball Placement Kit features a glue scraper for reworking PCBs with glued components, such as found in cellular telephones and portable computer products

E112721-solder-ball-feeder_uk.pdf

https://www.europlacer.com/es/special-feeders/?attachment_id=1468&download_file=5b88037ea3932

P R O D U C T I N F O R M AT I O N europlacer.com 1 F E AT U R E S Europlacer’s solder ball feeders provide a low-cost solution for solder ball assembly . By using exclusively licensed patent-protected techniques, the innovative feeders enable reliable assembly of solder balls as part of the standard surface mount pick-and-place process . The feeder has been designed to fit as standard on all Europlacer pick-and-place machines so that ball assembly can be seamlessly integrated into existing surface mount lines, presenting significant . This opens new possibilities in terms of design, including higher density, lower cost, smaller electronic modules and more. B E N E F I T S • High-yield automatic assembly of solder balls • Single or multiple ball nozzle capability • Ball reservoir replenishment is fast and easy • Fast product changeover • Placement on PCBs or other substrates and pallets A P P L I C AT I O N S Traditionally used as a PCB interconnection medium

E112721-solder-ball-feeder_uk.pdf

https://www.europlacer.com/it/alimentatori-speciali/?attachment_id=1468&download_file=5b88037ea3932

P R O D U C T I N F O R M AT I O N europlacer.com 1 F E AT U R E S Europlacer’s solder ball feeders provide a low-cost solution for solder ball assembly . By using exclusively licensed patent-protected techniques, the innovative feeders enable reliable assembly of solder balls as part of the standard surface mount pick-and-place process . The feeder has been designed to fit as standard on all Europlacer pick-and-place machines so that ball assembly can be seamlessly integrated into existing surface mount lines, presenting significant . This opens new possibilities in terms of design, including higher density, lower cost, smaller electronic modules and more. B E N E F I T S • High-yield automatic assembly of solder balls • Single or multiple ball nozzle capability • Ball reservoir replenishment is fast and easy • Fast product changeover • Placement on PCBs or other substrates and pallets A P P L I C AT I O N S Traditionally used as a PCB interconnection medium

http://www.testcoach.com/wp-content/uploads/2016/04/Flying-Probe-DFT.pdf

.), and steep solder joints (see guideline #8). Not available: Targets under 10 mils by 10 mils will not be probed. GUIDELINE #FP-2: Calculate the Keep-out Area A keep-out area around components must be maintained so that the angled probes can access test points . In some cases several hundred arm movements to access these nets can now be eliminated. GUIDELINE #FP-8: Avoid probing steep solder joints Reducing witness marks Probing a steep solder joint will cause the test probes to slide off of the intended target . Preferred solder joints used as test targets should have a length to height ratio of at least 2 to 1. Also consider the amount of solder applied . The solder joint should level out near the edge of the pad to ensure that the probes don’t slide off. On test targets with steep solder joints and small traces attached, consider using thicker traces or tapering the trace to create a wider area where the trace meets the component probe tester can perform many of the same tests that are provided with In- circuit Test (ICT) using bed-of-nails fixturing. The flying probe tester is a fixtureless tester that utilizes several moving arms with test probes to access the test points on a PC board

Chapter 3: Printed-Wiring Boards (PWBs)

http://www.testcoach.com/wp-content/uploads/2016/04/In-Circuit_DFT.pdf

; the test probe strikes either the solder that fills via holes during processing or the outer edges of the empty via barrel. • A test pad is a solid area of exposed metallization in which there is no through-hole, and therefore the test probe strikes the flat surface of the feature . However, the combination of IR reflowed OSP boards also placed through a solder wave may create problems when attempting to probe Test Pads, but not Test Vias . It is intended for the test probe to strike either the solder that fills the via hole during processing or the outer edge of the empty via barrel . IPC and other specs state that a component can be placed a percentage off its pads and still be acceptable. NOTE 2: Clearance required from test point to gold or carbon fingers may vary depending on the method used to prevent solder build up . The measurement shall be taken from the inner most edge of the gold finger to edge of the test point. • If the gold fingers are shielded using protectors mounted on the wave solder machine the clearance must be 0.200”. • If the gold fingers are protected using

Lead-Free Wave Soldering System - KTU-450 - QYSMT

https://www.qy-smt.com/product-item/lead-free-wave-soldering-system-ktu-450/

℃(by RM board test standard) Driving type Mechanical pump; Oven: iron titanium/ball milling cast iron Heater power Iron:14.5kw Titanium 15kw Pot capacity Lead free © Qinyi Electronics CO.,Ltd. | All Rights Reserved Lead-Free Wave Soldering System – KTU-350 High Speed Solder Optical Visual Inspection System

Universal GUIDE, JAW - 51447302 - QYSMT

https://www.qy-smt.com/product-item/universal-guide-jaw-51447302/

, we accept the customer’s shipping request T/T before shipment, after we shipped the goods, we will email you the shipping information INQUIRY NOW Share This Product Others Spare Parts Part Number Description Part Number Description 30662202 PC CARD, DUAL DAC FDBR ASSY 30690906 TEST HD CABLE 6 ASSY 30664701 BALL SCREW – .300D 6-PK MM 30685901 WRENCH, SERVICE 30701623 MAG ASSY – .300D 6-PK UM 30690902 TEST HD CABLE 2 ASM 30701638 .300 D5PK MAG ASSY You Might Like These UNIVERSAL OTHC (WFOV

Pemtron TROI-5500H 3D Solder Paste Inspection… | LEL International

https://www.wearelel.com/semi/buy/pcb-smt-assembly/pemtron-troi-5500h-3d-solder-paste-inspection

Pemtron TROI-5500H 3D Solder Paste Inspection… | LEL International LEL semi HOME LEL DECOM LEL CRITICAL LEL SEMI About LEL Inventory PCB/SMT Assembly Equipment Semiconductor Processing Equipment Automated Test Equipment Lab & Analysis Equipment Pumps / Chillers / Power Supplies Environmental Test Equipment Plastics & CNC Sell Your Equipment Blog Call 864.249.0943 Contact Us Semi > Buy > PCB/SMT Assembly Equipment > Pemtron TROI-5500H 3D Solder Paste Inspection Pemtron TROI-5500H 3D Solder Paste Inspection Inquire Status sold Share : Year 2010 Manufacturer Pemtron Model TROI-5500H Lot Number L4765 Notes Pemtron TROI-5500H 3D Solder Paste Inspection Machine Vintage 5.4 8mm Feeders L-014-1321 PCB/SMT Assembly Equipment 2006 NUTEK LIFO Buffer PCB/SMT Assembly Equipment Vi Technology 3D SPI Solder Paste Inspection System View All PCB/SMT Assembly Equipment Learn More

Novastar (Lead-Free) 12S-HT Wave Solder Machine | LEL International

https://www.wearelel.com/semi/buy/pcb-smt-assembly/novastar-lead-free-12s-ht-wave-solder-machine

Novastar (Lead-Free) 12S-HT Wave Solder Machine | LEL International LEL semi HOME LEL DECOM LEL CRITICAL LEL SEMI About LEL Inventory PCB/SMT Assembly Equipment Semiconductor Processing Equipment Automated Test Equipment Lab & Analysis Equipment Pumps / Chillers / Power Supplies Environmental Test Equipment Plastics & CNC Sell Your Equipment Blog Call 864.249.0943 Contact Us Semi > Buy > PCB/SMT Assembly Equipment > Novastar (Lead-Free) 12S-HT Wave Solder Machine Novastar (Lead-Free) 12S-HT Wave Solder Machine Inquire Status Available Share : Year 2008 Manufacturer Novastar Model 12S-HT Serial Number NTI-S12SLF08021233 Quantity 1 Notes Lead-Free Wave Solder Machine Fully Operational Available Immediately Share This Product More PCB/SMT ) 12S-HT Wave Solder Machine View All PCB/SMT Assembly Equipment Learn More Driving Technology Through Quality Equipment Learn More All Semi Categories PCB/SMT Assembly Equipment Cleaning Conveyors

Dispense Systems Specs

http://www.gpd-global.com/co_website/fluiddispense-prod-dsseries-specs.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER (adhesive) Linear Speed 20 inches/second (508 mm/second) Positioning Accuracy** ±0.0015” (±0,038 mm) Repeatability*** ±0.0006” (±0,0152 mm) Z Axis Travel 3” (76,2 mm) Resolution (per axis) ±0.0002” (±0,0051 mm) XYZ Drive Precision Ball Screw Drive with Linear Rails and closed-loop encoder feedback Valve Stations *Based on speed test of 1,000 dot pattern at 0.050” (1,27 mm) spacing with certain SMT adhesive materials, at 0.020” (0,508 mm) dot diameter. **With System Mapping over complete system work area

Dispense Systems Specs

https://www.gpd-global.com/co_website/fluiddispense-prod-dsseries-specs.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER (adhesive) Linear Speed 20 inches/second (508 mm/second) Positioning Accuracy** ±0.0015” (±0,038 mm) Repeatability*** ±0.0006” (±0,0152 mm) Z Axis Travel 3” (76,2 mm) Resolution (per axis) ±0.0002” (±0,0051 mm) XYZ Drive Precision Ball Screw Drive with Linear Rails and closed-loop encoder feedback Valve Stations *Based on speed test of 1,000 dot pattern at 0.050” (1,27 mm) spacing with certain SMT adhesive materials, at 0.020” (0,508 mm) dot diameter. **With System Mapping over complete system work area

True 3D X-ray Vision Inspection Systems - Saki America

https://www.sakiglobal.com/automated-x-ray-inspection-axi.html

. Saki's AXI systems address 3 market segments: Printed circuit board (PCB) – usually part of the PCB assembly process after reflow Solder ball joint inspection of BGAs Solder joint inspection on the back face of QFNs Solder joint inspection for all parts such as chips . Saki's PCT technology utilizes a high-resolution image composed from 200 imaging slices acquired through the board, solder joints, and components, whereas other AXI machines only use about five slices for imaging , connectors, and insert parts on the PCB Power module High power X-ray tubes (225kV) Void inspection inside the solder joint of an insulated gate bipolar transistor (IGBT ) soldering inspection AXI is the best technology for accurately reconstructing the shape of solder balls and fillets to perform reliable solder inspection representation of continuous 3D images without joints. Saki's BF-X3 system offers a programmable resolution from 13–30 microns. Reconstruction of images is done on-the-fly, for every solder joint, creating 3D data for the entire sample

3D Automated X-ray Inspection Systems - Saki Products

https://www.sakiglobal.com/automated-x-ray-inspection-axi-3d-products.html

. It is the ideal inspection platform for various test applications, including a wide range of solutions for non-destructive testing (NDT). Its customized solutions can be used in the semiconductor industry to inspect electronic components and solder in applications such as flip chip attachment, laser through-hole (LTH . Saki's PCT technology utilizes a high-resolution image composed from 200 imaging slices acquired through the board, solder joints, and components, whereas other AXI machines only use about five slices for imaging of continuous 3D images without joints. Reconstruction of images is done on-the-fly, for every solder joint, creating 3D data for the entire sample for: Absence of solder Bridging Dry joints Fillet defects Foreign material Head-in-pillow and non-wetted defects Insufficient solder Lifted bump Lifted chips Lifted leads Misalignment Opens Presence or absence of components Shorts Tombstones Voids Components and packages that are usually inspected are: Aluminum electrolytic capacitors Ball grid arrays (BGAs

ZESTRON Coating Layer Test

https://www.zestron.com/en/zestron-coating-layer-test.html

ZESTRON Coating Layer Test Contact us log in english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 日本語 한국어 русский Compare Machines Machine Test Center Global Technical Centers Analytical Center Cleanliness and Surface Qualification Bath Analysis Cleaning Process Support Cleaning Trials Process Development Process       ZESTRON Coating Layer Test ZESTRON Coating Layer Test Chemical test for localized detection of protective coating layer defects on PCBs The reliability of protective PCB assembly coatings . In particular, common trouble areas such as solder joint edges and pore channels in coating pooling areas, when lacking a proper coating layer, have detrimental effects on the final board assembly. The ZESTRON ® Coating Layer Test utilizes a black color reaction as a visual indicator of the defects in the protective coating, even in the case of μ-coatings. The test thus adds the standardized methods for coating thickness measurement by enabling rapid detection of closed and dense coatings

ZESTRON Coating Layer Test

https://www.zestron.com/zestron-coating-layer-test.html

ZESTRON Coating Layer Test Contact us log in english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 日本語 한국어 русский Compare Machines Machine Test Center Global Technical Centers Analytical Center Cleanliness and Surface Qualification Bath Analysis Cleaning Process Support Cleaning Trials Process Development Process       ZESTRON Coating Layer Test ZESTRON Coating Layer Test Chemical test for localized detection of protective coating layer defects on PCBs The reliability of protective PCB assembly coatings . In particular, common trouble areas such as solder joint edges and pore channels in coating pooling areas, when lacking a proper coating layer, have detrimental effects on the final board assembly. The ZESTRON ® Coating Layer Test utilizes a black color reaction as a visual indicator of the defects in the protective coating, even in the case of μ-coatings. The test thus adds the standardized methods for coating thickness measurement by enabling rapid detection of closed and dense coatings

Products – Page 2 – Precision PCB Services, Inc.

https://precision-pcb-services-inc.com/collections/all?page=2

Technology SMD SMD Removal SMD Rework Smoke Absorber Smoke Extractor SMT SMT Rework Solder Solder Ball Solder Balls Solder Bumping Solder Certification solder fume extractor Solder Sphere Solder Training Forensics Fume Extractor Gold Finger Plating Gold Finger Repair Gold Finger Rework hakko solder fume extractor Hand Solder Certification Hand Solder Training Hand Soldering Training and Certification & BGA Rework Station, Chip Off-600 $7,500.00 SMD & BGA Rework Station, Chip Off-620 $9,500.00 Smoke Absorber $56.00 Solder Balls - Lead Free .20mm $75.00 Solder Balls - Lead Free .25mm $75.00 Solder Balls - Lead Free .30mm $75.00 Solder Balls - Lead Free .35mm $75.00 Solder Balls - Lead Free .40mm $75.00 Solder Balls - Lead Free .45mm $75.00 Solder Balls - Lead Free .50mm $75.00 Solder Balls - Lead Free .55mm $75.00 Solder Balls - Lead Free .60mm

Products – Precision PCB Services, Inc.

https://precision-pcb-services-inc.com/collections/all

Technology SMD SMD Removal SMD Rework Smoke Absorber Smoke Extractor SMT SMT Rework Solder Solder Ball Solder Balls Solder Bumping Solder Certification solder fume extractor Solder Sphere Solder Training Forensics Fume Extractor Gold Finger Plating Gold Finger Repair Gold Finger Rework hakko solder fume extractor Hand Solder Certification Hand Solder Training Hand Soldering Training and Certification

c5-catalogprnt.qxd

http://versatecsolutions.com/pdfs/C5d-catalog.pdf

. That’s because with dual beams, while one head is picking, the other is placing, virtually non-sstop. Although competitive single beam machines may yield high placement rates on test boards, their actual throughput on production boards is significantly less, because while they are gathering . Advanced gantry design uses linear motors and encoders in both the X and Y axes --- Unlike ball screw systems, linear motors have zero backlash and require no maintenance....ever ) Minimum Ball Size Diameter (micro BGA) Placement Accuracy 0201 (0603 1) - 0603 (1608 1) 0805 (2012 1) - 1206 (3016 1) >1206 (3016 1) Fine Pitch 0.3mm - 12mil BGA Ball Size resolution DC Servo Motors with .005 O resolution 100% vision alignment on the y with full lead/ball inspection CCD Telecentric Strobe backlighting Strobe frontlighting for bottom leaded devices, i.e. BGA’s/micro BGA’s 2,300mm 1,650mm (with feeders) 1,828mm (with status light) 1588 kg / 3500 lb

http://versatecsolutions.com/pdfs/brochure_cs400e.pdf

. ■ Simple Lead Forming ■ No Component Spillage or Pop-up During Wave Soldering ■ Improved Solderability ■ No Post-Solder Lead Trimming Cut & Clinch BENEFITS Touch Pads The Component The CS-400EV Component Verifier Option is used to test components before insertion. The unit is capable of detecting an incorrect part at the point of insertion (resistance, capacitance, inductance and diode polarity) and actually halt the Component Locator if the error occured. The Component Verifier consists of the tester, test pads and cable set. RLC Accuracy: ± 0.1% Power requirements: 90-250 VAC; 50 or 60 Hz; 60W max In operation, the display on the CS-400E Component Locator will display the message “Press Footswitch for Manual Test” for each component that is to be tested. The Operator must touch the leads of the components to the test pads mounted directly above the insertion area. The Verifier will then test or “sample” the value on the screen. The user has the option to test any or all components of a component group. With a simple keyboard command the Verifier can be turned off so that no components are tested. With this flexibility the user can do 100% inspection of applicable

Auto inline PCB inspection machine-PCB magazine loader,PCB loader,PCB conveyor,PCB Multi Magazine Lo

https://www.ascen.ltd/Products/auto_optical_inspection/520.html

it’s a non-contact test method. auto PCB optical inspection machine has primarily been used after solder reflow or in post-production : Missing, misalignment, skewed, billboard, mounting on side, overturn, wrong part (OCV), damaged, reversed etc. Solder defects: Overflow, insufficient, pseudo soldering, bridge , contamination etc Special Features Support auto change program test, multi boards and multi programs test, two sides of programs test Minimum Component &pitch 8µm:01005 chip Skype:supplier889 PCB Handling conveyor PCB conveyor PCB loader and unloader Solder paste printer PCB buffer Smart Production equipment PCB depaneling machine Axial component lead forming PCB auto optical &unloader PCB custom conveyor pcb cutting machine solder dross recovery system Industrial air purification Conformal coating machine PCB auto optical inspection Home > Products . Post-reflow optical inspection systems inspect for many kinds of defects, including component placement issues, solder shorts, or missing solder

automatic optical inspection machine -PCB magazine loader,PCB loader,PCB conveyor,PCB Multi Magazine

https://www.ascen.ltd/Products/auto_optical_inspection/515.html

. A500 model is able to test HASL and red glue efficiently to improve solder image quality of after reflow and inspection results. It helps to solve the solder joints problems caused by PCB with different background , excessive glue, solder void, solder-covering pin Special Features Multiple program running simultaneously(support auto change program); Checking 0-359°components(unit:1°) Minimum Component &pitch 8µm:01005 chip &0.3pitch IC SPC and program control Statistic and analysis of all test data ,check production and quality analysis anywhere, can output Excel, Txt file Bar code System Skype:supplier889 PCB Handling conveyor PCB conveyor PCB loader and unloader Solder paste printer PCB buffer Smart Production equipment PCB depaneling machine Axial component lead forming PCB auto optical &unloader PCB custom conveyor pcb cutting machine solder dross recovery system Industrial air purification Conformal coating machine PCB auto optical inspection Home > Products . Send Enquiry Download brochure Product Details Automatic optical inspection machine, AOI, is a key technique used in the manufacture and test of electronics printed circuit boards, PCBs

Press Releases

http://mirtecusa.com/news-pressreleases-2013voteformirtec.php

! TOP FINALIST FOR 2014 BEST IN TEST AWARDS   November 2013 – MIRTEC ,MIRTEC, “The Global Leader in Inspection Technology,” announces that it has been selected as a finalist for the 2014 Best in Test Awards in the Machine Vision/Inspection category for its MV-9 2D/3D CoaXPress In-Line AOI Series . Since 1991, the Best in Test Awards have recognized the best in test products and test professionals. Finalists first are selected by the editors of EDN Magazine and then the EDN community can vote online to determine the final winners . This proprietary system yields precise height measurement data necessary to detect lifted component and lifted lead defects as well as solder volume post reflow . MIRTEC’s technologically advanced Six Phase Lighting System uses multi-color LEDs to illuminate inspection areas from six different angles providing superior solder joint characterization and co-planarity . solder joint inspection for J-Leaded devices. The system also provides defect review from four camera angles for efficient defect analysis and classification

Press Releases

http://mirtecusa.com/news-pressreleases-2015-semiWest.php

:   - Solder Ball/Bump – Presence, Pitch, Offset, Height, Co-Planarity and Bridging - Bond Wire - Short, Broken, Shift and Loop Height - Chip Bond - Offset, Height, Crack and Chip - Discrete Device . Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. As one can imagine, this complex arrangement of advanced packaging presents a challenge to the inspection environment.” MIRTEC’s MP-520 – Presence, Offset, Height, Co-Planarity and Solder Fillet - Heat Sink - Presence, Offset and Height - Under-Fill – Presence, Fillet and Height - PCB - Scratch, Contamination and Bridging - Package - Warpage, Crack, Marking, Dimensions and Chipping

Robo-Tek

http://robo-tek.com/products.htm

) axial inserters, radial inserters, jumper wire inserters, sequencers, tape & reel, component prep,     REFLOW OVENS/WAVE SOLDER/SELECTIVE SOLDERING                 AOI/TEST ) solder paste (screen) printers, epoxy (glue) dispensers, high speed chipshooters, flexible (IC) mounters     FEEDERS/SPARE PARTS fixed pitch feeders, vibratory feeders, mechanical/electrical, tube feeders, trolleys, drivers, placement heads, nozzles, cutters, clinches, motors,                 AI (automatic insertion (automated optical inspection/in-circuit test) pre/post inspection and testing, x-ray imaging inspection, re-work,     CLEANING/CONVEYORS/MISC board/batch/stencil cleaners, connecting/inspection/hand assembly conveyors, loaders, un-loaders, miscellaneous. Copyright © 2007 www.robo-tek.com

Robo-Tek

http://robo-tek.com/aoi.htm

Robo-Tek   North American Toll Free: 1-877-360-PCBA International/Instant Connect: 1-416-450-6026 Fax : 1-416-369-0515 sales@robo-tek.com   Products   SMT AI AOI / TEST REFLOW OVEN WAVE SOLDER SELECTIVE SOLDERING CLEANING CONVEYORS MISC

Yellow metal SMT Spare Parts Ingun Test Probes GKS-100-214-150-A-2000 Test Fixtures

https://www.smtspare-parts.com/sale-9375345-yellow-metal-smt-spare-parts-ingun-test-probes-gks-100-214-150-a-2000-test-fixtures.html

Yellow metal SMT Spare Parts Ingun Test Probes GKS-100-214-150-A-2000 Test Fixtures Professional Supplier Of SMT Spare Part , as Feeder, Nozzle, Filter, Motor, Laser, etc Polish Home Products About Us Factory Tour Quality Control Contact Us Request A Quote Home Products SMT Spare Parts Yellow metal SMT Spare Parts Ingun Test Probes GKS-100-214-150-A-2000 Test Fixtures . Vicki I'm Online Chat Now Yellow metal SMT Spare Parts Ingun Test Probes GKS-100-214-150-A-2000 Test Fixtures Large Image :  Yellow metal SMT Spare Parts Ingun Test Probes GKS-100-214-150-A-2000 Test Fixtures Product Details: Place of Origin: German Brand Name: Ingun Model Number : T/T, Western Union Supply Ability: 10000pcs Contact Now Chat Now Detailed Product Description Part Name: Test Probes Model: GKS-100-214-150-A-2000 Origin: German Warranty: 1 Year Condition: Original New Brand : Ingun Yellow metal Ingun Test Probes GKS-100-214-150-A-2000 SMT Spare Parts Test Fixtures   Brand:Ingun Model:GKS-100-214-150-A-2000

smt machine parts – Quality Supplier from China of page 7

http://www.smtspare-parts.com/buy-smt_machine_parts-page7.html

:05 Yellow metal SMT Spare Parts Ingun Test Probes GKS-100-214-150-A-2000 Test Fixtures Contact Now Yellow metal Ingun Test Probes GKS-100-214-150-A-2000 SMT Spare Parts Test Fixtures Brand:Ingun :07 JUKI 2070 FX3 Spline Unit 40063959 SMT Spare Parts Black Metal Ball Spline Original Contact Now JUKI 2070 FX3 Spline Unit 40063959 SMT Spare Parts black metal ball Spline original From Japan JUKI

Auctions | Baja Bid LLC - Page 6

http://bajabid.com/auctions/page/6/

: Home Auctions Page 6 Current Auctions Online Auction Semiconductor Test Supply Current Auctions By BajaBid January 26, 2019 Auction Dates, February 25 – 28 2019 Preview, February 19 : ERSA Selective Solder; DEK 265 Screen Printer; Speedline Omni 7 Reflow Oven; Quad SMT Pick & Place; Environmental Chamber; Marantz AOI; Conveyors and More…. Read more SMT Exchange Auction August 17 ; Yestech YTV-BX Bench Top AOI; Universal 4688A “GSM2” Machines & Feeders; Mancorp “Lead-Free” Wave Solder; Vitronics Reflow Oven; BTU Paragon 150 Reflow Oven ; Seho 3250 Selective Solder; PAS Ultrasonic Welders; Air-Vac & Amistar Rework Stations; QMT 100 Tape & Reel; Austin American Stencil Cleaner; Dry Storage Boxes; Conveyors : DEK Horizon 01 Screen Printer; Vitronics 6747 Selective Solder; Fuji IP-III and CP-643 SMT Pick & Place Machines; Research International Reflow Oven; Conveyors; Thermotron Ovens; Microscopes; Oscilloscopes

Previous Auctions | Baja Bid LLC - Page 3

https://bajabid.com/category/previous-auctions/page/3/

; Senju Ecopascal 400 Lead-Free Wave Solder; Senju SSF-400 External Fluxer; Hemel Checkmaster Coordinate Measuring Machine; Panasonic Conveyors +) Thermotron Temperature and Humidity Chambers; DEK Horizon Screen Printer; Heller 1808 EXL Reflow Oven; Ling Electronics A540 Shaker; Royce Model 550 Gold Bond Test Instrument ; Plus much more test and measurement equipment and SMT equipment; Also, FULL MACHINE SHOP including Bridgeport Mills; Cincinnati Horizontal Milling Machine ; Siemens Siplace S-25 SMT Machine; Siemens Siplace F4 SMT Machine; Siemens SMT Feeders & Carts; VJ Electronix Vertex X-Ray; ASC International Solder Paste Inspection ; Thermal Product Solutions Environmental Chambers; Workbenches; Material Handling Equipment; Soltec 6622 Wave Solder; Heller 1707EXL Reflow Ovens

Axial Inserter | Used SMT and Through Hole PCB Assembly Equipment

http://alpha1technologies.com/axial-inserter/

Axial Inserter | Used SMT and Through Hole PCB Assembly Equipment Alpha 1 Technologies About New Machines Axial Inserter Radial Lead Inserter Laser Marking Systems Odd Form Placement Reflow Ovens Wave Solder Terminal or counter clockwise, reducing cycle time High precision ball screw and AC servo motor deliver positioning system accuracy to 0.001mm Fiducial pattern correction with machine vision UPS power interruption protection Standard jumper wire dispenser attaches directly to the insertion head to reduce waste Online or offline programming (CSV and CAD support)   A30D

Axial Inserter | Used SMT and Through Hole PCB Assembly Equipment

http://alpha1technologies.com/new-machines/axial-inserter/

Axial Inserter | Used SMT and Through Hole PCB Assembly Equipment Alpha 1 Technologies About New Machines Axial Inserter Radial Lead Inserter Laser Marking Systems Odd Form Placement Reflow Ovens Wave Solder Terminal or counter clockwise, reducing cycle time High precision ball screw and AC servo motor deliver positioning system accuracy to 0.001mm Fiducial pattern correction with machine vision UPS power interruption protection Standard jumper wire dispenser attaches directly to the insertion head to reduce waste Online or offline programming (CSV and CAD support)   A30D

https://essemtec.com/fileadmin/user_upload/produkt/smt-assembly/fox/pdf/Essemtec-Fox_Brochure_EN_Druckboegen.pdf

. Expandable in any direction. l Placing & dispensing in single pass-through l Jet dispensing of solder paste or glue l Up to 7‘000 – 18‘800 cph per module l Up Increase Boardsize Table extension to increase the processable board size Additional: Electrical component test system, vision box to increase component size to be placed, clean room cover and more l Fast, reliable double drive linear motors l No maintenance, longest lifetime Configurable heads with 1-4 placement-axis. 2,5D and 3D dispensing and jetting, High resolu- tion digital vision system with auto component teach-in and irregular ball recognition

https://essemtec.com/fileadmin/user_upload/produkt/pdf/EN/Essemtec_-_Fox_Brochure_EN_Druckboegen.pdf

. Expandable in any direction. l Placing & dispensing in single pass-through l Jet dispensing of solder paste or glue l Up to 7‘000 – 18‘800 cph per module l Up to 150‘000 dots/h Increase Boardsize Table extension to increase the processable board size Additional: Electrical component test system, vision box to increase component size to be placed, clean room cover and more l Fast, reliable double drive linear motors l No maintenance, longest lifetime Configurable heads with 1-4 placement-axis. 2,5D and 3D dispensing and jetting, High resolu- tion digital vision system with auto component teach-in and irregular ball recognition

Technical Sessions | SMTA International

http://smta.org/smtai/tech.cfm

. Application needs, field use simulation conditions, and resulting failure analysis will be discussed. Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, John Evans, Ph.D : Keith Sweatman, Nihon Superior Co., Ltd. Monday, September 28 | 11:00am - 12:30pm Long Term Aging Effects on the Reliability of Lead Free Solder Joints In Ball Grid Array Packages With Various Pitch Sizes and Ball Alignments Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, M.J. Bozack, and J. L. Evans, Ph.D ., Auburn University Factors Impacting the Reliability of Ultra-Low Silver Lead-Free Alloys Brian Toleno, Ph.D., Neil Poole, Ph.D., Mark Curie, Ph.D., Henkel Electronic Materials LLC Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Ball BGAs with BiSnAg and Resin Reinforced and solder alloy combination, the impact of copper roughness on surface finish and the effect of P content on the solder and wire bond reliability. Influence of Surface Finishes and Solder Alloys on Solder Ball Joint Reliability Yoshinori Ejiri, Takaaki Noudou . Session tracks and symposiums: Advanced Packaging Technology (APT) Evolving Technologies (ET) Lean Initiatives (EMS) Flux, Solder, Adhesives (FSA

Symposia | SMTA International

http://smta.org/smtai/symposium.cfm

. Application needs, field use simulation conditions, and resulting failure analysis will be discussed. Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, John Evans, Ph.D : Keith Sweatman, Nihon Superior Co., Ltd. Monday, September 28 | 11:00am - 12:30pm Long Term Aging Effects on the Reliability of Lead Free Solder Joints In Ball Grid Array Packages With Various Pitch Sizes and Ball Alignments Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, M.J. Bozack, and J. L. Evans, Ph.D ., Auburn University Factors Impacting the Reliability of Ultra-Low Silver Lead-Free Alloys Brian Toleno, Ph.D., Neil Poole, Ph.D., Mark Curie, Ph.D., Henkel Electronic Materials LLC Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Ball BGAs with BiSnAg and Resin Reinforced to be discussed include: the impact of test specimens on fracture properties; the effect of bismuth additions to SnCu alloys on solder joint reliability; and the effect of pre-conditioning and thermal cycling profiles on the reliability of test vehicles assembled with varied SAC solder compositions. Effect of Test Specimen on Fracture Behavior of Lead-free Solder Joints Amir Nourani, Saeed Akbari and Jan K. Spelt, University of Toronto A New Method of Increasing the Reliability of Lead-free Solder Takatoshi Nishimura

Beau Tech - MilProbes

http://www.beautech.com/mil.cfm

. Their specific benefits are: Mechanically test fine pitch solder joints. Align fine pitch (below 25 mil) component leads and pads (For larger pitch and TH applications, please consider our 25 Milprobes . 25 MilProbe used to test solder joint of 30 mil pitch QFP.   Overall dimensions of all 25 MilProbes. Their specific benefits are: Mechanically test SMT solder joints position that needs repair or rework. The hex-shaped handle guarantees easy grip and control when operating under a microscope. The stainless steel probe sheds solder and allows effective use while soldering or desoldering + mil Through-Hole Testing Solder Joint & Wire Bonding Strength A A, B B B, C C C Straightening Leads & Wires A A, B B B, C C C Cleaning Leads

Beau Tech - MilProbes

https://www.beautech.com/mil.cfm

. Their specific benefits are: Mechanically test fine pitch solder joints. Align fine pitch (below 25 mil) component leads and pads (For larger pitch and TH applications, please consider our 25 MilProbes . 25 MilProbe used to test solder joint of 30 mil pitch QFP.   Overall dimensions of all 25 MilProbes. Their specific benefits are: Mechanically test SMT solder joints position that needs repair or rework. The hex-shaped handle guarantees easy grip and control when operating under a microscope. The stainless steel probe sheds solder and allows effective use while soldering or desoldering + mil Through-Hole Testing Solder Joint & Wire Bonding Strength A A, B B B, C C C Straightening Leads & Wires A A, B B B, C C C Cleaning Leads

PowerSpector GTAz_Desktop_r2.pub

http://islandsmt.com/wp-content/uploads/2017/11/Brochure-PowerSpectorGTAz-Desktop.pdf

. Pin Height measurement Component Presence Absence, Polarity, Value, Angle, Offset, Colour, Extra part detection, Solder ball detection, Solder profile analysis and short detection % reduction of cycle time.  Multi-color 4 angle lighting with Line Source Coaxial Lighting and Meniscus Profiler reliable solder joint meniscus and pad surface analysis .)  Component Height and Coplanarity  Solder Paste and CIP (Components in Paste; pre-reflow)  Soldering: Post Reflow, Post Wave, Selective, Manual use inspection in all stages of the production process (Direct On Axis Lighting) coaxial lighting system with high resolution Telecentric Optics……………… inspect solder joints without shadow effects from tall components nearby and accurate inspection model building ⁰co-axial light through prism Good solder Bad solder 65⁰ main light Good solder Bad solder 45⁰ side light Good solder Bad solder Good solder Bad solder 8x Angular Side Sensors

PowerSpector GTAz_Inline_r2.pub

http://islandsmt.com/wp-content/uploads/2017/11/Brochure-PowerSpectorGTAz-Inline.pdf

. Pin Height measurement Component Presence Absence, Polarity, Value, Angle, Offset, Colour, Extra part detection, Solder ball detection, Solder profile analysis and short detection % reduction of cycle time.  Multi-color 4 angle lighting with Line Source Coaxial Lighting and Meniscus Profiler reliable solder joint meniscus and pad surface analysis .)  Component Height and Coplanarity  Solder Paste and CIP (Components in Paste; pre-reflow)  Soldering: Post Reflow, Post Wave, Selective, Manual use inspection in all stages of the production process (Direct On Axis Lighting) coaxial lighting system with high resolution Telecentric Optics……………… inspect solder joints without shadow effects from tall components nearby and accurate inspection model building ⁰co-axial light through prism Good solder Bad solder 65⁰ main light Good solder Bad solder 45⁰ side light Good solder Bad solder Good solder Bad solder 8x Angular Side Sensors

Unisoft - Programming ATE Software for electronic manufacturing service EMS, OEM - PCB assembly / PC

https://www.unisoft-cim.com/pcbtest.htm

Trial Software CAD Translation CAD to CAD Translations Assembly Machines AOI Inspection ATE Test & Fixture GERBER Translations Other Services Testimonials Overview Pricing Private Label Training & Support Partners Links About Us Contact Us Download Software Pronto TEST-FIXTURE Try it FREE! Click here for software download! Unisoft Pronto TEST-FIXTURE Software Overview Diagram Savings / Benefits 10 minutes to program your Test Equipment — contact us now & we will show you using your data or ours Save time on NPI, faster time to market Reduced Test Equipment Usage Time Reduced Test Equipment Time Reduced employee stress Outputs to most popular In-Circuit, Flying Probe and MDA ATE equipment. Designs and creates circuit description and test fixture fabrication files. CAD Viewer & Gerber Viewer for PCB assembly / PCBA troubleshooting aid technicians to find components, pins, shorted traces, schematic hyper-linked to the assembly, etc . Also outputs to Gencad, Fabmaster, PADS, Mentor Graphics, ipc-d-356, ipc-2581, etc. to frontend to other test fixturing software. DEMONSTRATIONS: The fastest way to learn about the Unisoft software is usually to go online with us and we can process one of your PC Boards or use our data files to show you the software

Unisoft - Programming ATE Software for electronic manufacturing service EMS, OEM - PCB assembly / PC

https://www.unisoft-cim.com/pcbtest.php

Trial Software CAD Translation CAD to CAD Translations Assembly Machines AOI Inspection ATE Test & Fixture GERBER Translations Other Services Testimonials Overview Pricing Private Label Training & Support Partners Links About Us Contact Us Download Software Pronto TEST-FIXTURE Try it FREE! Click here for software download! Unisoft Pronto TEST-FIXTURE Software Overview Diagram Savings / Benefits 10 minutes to program your Test Equipment — contact us now & we will show you using your data or ours Save time on NPI, faster time to market Reduced Test Equipment Usage Time Reduced Test Equipment Time Reduced employee stress Outputs to most popular In-Circuit, Flying Probe and MDA ATE equipment. Designs and creates circuit description and test fixture fabrication files. CAD Viewer & Gerber Viewer for PCB assembly / PCBA troubleshooting aid technicians to find components, pins, shorted traces, schematic hyper-linked to the assembly, etc . Also outputs to Gencad, Fabmaster, PADS, Mentor Graphics, ipc-d-356, ipc-2581, etc. to frontend to other test fixturing software. DEMONSTRATIONS: The fastest way to learn about the Unisoft software is usually to go online with us and we can process one of your PC Boards or use our data files to show you the software

Q-Pad II Q-Pad 3

http://orionindustries.com/pdfs/qpad2.pdf

. Q-Pad II eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Q-Pad II can be used prior to these operations unlike grease . • Under electrically isolated power modules or devices such as resistors, transformers and solid state relays. Q-PAD 3® The new Bergquist Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths ® Grease Replacement Materials without Electrical Isolation Physical Properties Q-PAD II Q-PAD 3 Test Method Color Black Black Visual Thickness Inches .006/.0065 w/ac ±.001.005/.0055 (w/ac) ASTM D374 (mm) .152 ±.025 (.15 ) ASTM D374 Service Temperature °C 180 wo/ac -- 150 w/ac Thermal Properties Q-PAD II Q-PAD 3 Test Method Thermal Resistance, °C-in2/W 0.10 w/o ac 0.10 w/o ac 0.20 w/ac 0.14 w/ac Metric (cm2-K/w) .65 w/o ac .65 w/o ac 1.3 w/ac 0.9 w/ac Thermal Conductivity, W/m-K 2.5 wo/ac 2.0 w/o ac 1.3 w/ac 1.6 w/ac ASTM D5470 Electrical Properties Q-PAD II Q-PAD 3 Test Method Volume Resistivity, Ohm Metre

Dr. Mike Bixenman to Present at Electronics in Harsh Environments Conference | Kyzen: Eco-Friendly C

https://www.kyzen.com/main-pages/dr-mike-bixenman-to-present-at-electronics-in-harsh-environments-conference/

.” Experts from industry and academia will present on predicting component life, solder alloys that can withstand high operating temperatures, test methods for harsh environments, electrochemical reliability and coatings ” and will discuss the results from his research to qualify and validate assembly processes as it relates to materials and cleaning using alternative test board design features to determine the risk of failure . Miniaturization and environment play major roles in the electronics life cycle. The failure mechanisms for SAC solder joints, LEDs and Electrochemical Migration will be studied and reviewed, with particular attention paid to the automotive end-use environment. Dr

KYZEN to Present New Research on Solder Paste Release at the SMTA China East Vendor Conference | Kyz

https://www.kyzen.com/main-pages/kyzen-present-new-research-solder-paste-release-smta-china-east-vendor-conference/

KYZEN to Present New Research on Solder Paste Release at the SMTA China East Vendor Conference | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions English | 简体中文 English English 简体中文 > KYZEN to Present New Research on Solder Paste Release at the SMTA China East Vendor Conference KYZEN to Present New Research on Solder Paste Release at the SMTA China East Vendor Conference NASHVILLE — April 4, 2016 , “Video Analysis of Solder Paste Release from Stencils.” Daniel Gao, Sales Manager – Northern China Gao will discuss why solder paste release from the stencil is a critical factor in print quality, and ultimately, overall electronic product quality and reliability . The experiment incorporates different aperture area ratios, solder pastes, stencil nano-coatings and under wipe solvents to visualize their effects on paste release . This study builds on previous research that developed the test setup and recording methods, and incorporates some modifications to the original experimental configuration to improve image quality

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2019-Pocket-Guide.pdf

Sober, Essex Technologies Group Inc. 10 High Frequency Test Methods Task Group: Frequency-Domain Methods D-24C 3:15 pm 5:00 pm Chair: John Coonrod, Rogers Corporation 16B 5-22A Rose Working Group 5-22A ROSE WORKING GROUP 3:15 pm 5:00 pm 7A Solder Alloy , Continental Automotive Systems 2 PCB/Microvia Reliability S07 3:30 pm 5:00 pm Bhanu Sood, NASA Goddard Space Flight Center 6C Solder Paste/ Reliability I S08 3:30 pm 5:00 pm Udo Welzel, Robert Bosch GmbH 1A Test/Inspection II S09 3:30 pm 5:00 pm Steve Butkovich : Jonathon Vermillion, Ball Aerospace & Technologies Corp.; Milea Kammer, Honeywell Aerospace 15A Printed Electronics Final Assembly Subcommittee — A-team D-64 9:00 am 4:00 pm Co-chairs & IPC-A-610 Task Groups 5-22A/ 7-31B 8:00 am 5:00 pm Co-chairs: Jonathon Vermillion, Ball Aerospace & Technologies Corp.; Mary Muller; Milea Kammer, Honeywell Aerospace : Rick Shanks, Pratt & Whitney; Walter Jager, ECD Compliance 6F Thermal Stress Test Methodology Subcommittee D-32 8:00 am 10:00 am Chair: James Monarchio, TTM Technologies 7A Ion Chromatography/ Ionic Conductivity Task Group 5-32A 8

IPC APEX EXPO 2019 - Conference Brochure

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2019-Conference-Brochure.pdf

/MICROVIA RELIABILITY Tuesday | January 29 | 3:30 pm–5:00 pm Moderator: Bhanu Sood, NASA Goddard Space Flight Center S08 | SOLDER PASTE/RELIABILITY I Tuesday | January 29 | 3:30 pm–5:00 pm Moderator: Udo Welzel, Robert Bosch GmbH S09 | TEST/INSPECTION II • Korea Printed Circuit Association (KPCA) • Mesago Messe Frankfurt Group • MicroElectronics Packaging and Test Engineering Council (MEPTEC) • Taiwan Printed Circuit Association | JANUARY 31 8:00 am–2:00 pm Free Buzz Session: iNemi Next Generation Solder Materials Workshop 8:00 am–5:00 pm IPC Standards Development Committee Meetings 9:00 am–10 | January 29 and 30 Competitors will be presented with a soldered assembly that will be partially populated with components. Contestants will be required to remove six specific components, remove the old solder and clean the area of removed components AIM Solder ...............................3225 AIM, Inc. ..........................Supporter Air & Water Systems, LLC ........................2407 Airtech International, Inc. ........ 700 AIR-VAC Engineering ............... 1625 Akrometrix, LLC

GENERAL DESCRIPTION:

http://www.soldertools.net/product_images/stencilmate/StencilMate-Bumping.pdf

# Kraft release liner. The StencilMate™ stencils are pre-scored to allow for easy removal from the release liner. Intended for use as a ”bumping” stencil for the application of solder paste or flux on printed circuit boards (Results in a solder print thickness of 0.004”) Stainless Steel 72.00 oz/in 790.00 N/m Fiberglass 28.98 oz/in 317.32 N/m Phenolic 29.97 oz/in 328.17 N/m Nylon 40.55 oz/in 444.01 N/m (Adhesive performance after a 72 hour dwell ) 1-40 minutes 572°F 300°C 2-4 minutes 617°F 325°C 1-9 seconds 842°F 450°C 1-3 seconds 1000°F 538°C Minimum 50°F 10°C Test should be conducted at room temperature after 24 hour dwell

HeatShieldGel

http://www.soldertools.net/heatshield-gel-16-oz-jar/

™ Preform Engineer My Pattern Training Materials All Training Materials Standards and Documents Solder Training Kits PCB Repair Materials All PCB Repair Materials PCB Repair Inst'n Manual Pad Repair . This material prevents solder joints on protected devices from growing too thick of intermetallic layers which could impact solder joint reliability ™ tape by a factor of 4X (See test report of various material shielding effectiveness here )!      It has shown (see cleanliness test report here ™ Preform Engineer My Pattern Training Materials All Training Materials Standards and Documents Solder Training Kits PCB Repair Materials All PCB Repair Materials PCB Repair Inst'n Manual Pad Repair

Register Today for the Solder Reflow Fundamentals Workshop during SMTAI | BTU

https://www.btu.com/news-events/news-item/register-today-for-the-solder-reflow-fundamentals-workshop-during-smtai/

Register Today for the Solder Reflow Fundamentals Workshop during SMTAI | BTU Home Contact Us Parts Locator Menu Why BTU Products Reflow Ovens Pyramax Pyramax Vacuum Pyramax ZeroTurn Pyramax TrueFlat Advanced Technologies Custom Furnaces Controlled Atmosphere Furnaces Fast & Events Press Releases Events In the News Careers Career Opportunities Benefits News & Events Press Releases Events In the News Register Today for the Solder Reflow Fundamentals Workshop during SMTAI NORTH BILLERICA, Mass., August 25, 2016 a reflow workshop during SMTA International at the Donald Stephens Convention Center in Rosemont, Ill. The workshop, entitled, “Solder Reflow Fundamentals of Electronic Assembly and A Guide to SMTA Certification by Ron Lasky etc. This class will focus on the fundamentals of solder reflow and reflow oven operation . profiles, heat transfer and oven control, why profiles are shaped the way they are and how to obtain profiles. Additional topics of discussion will include TC accuracy and mounting, profilers, test vehicles, eutectic vs

Knowledge Center of Our Thermal Processing Expertise | BTU

https://www.btu.com/about-us/knowledge-center/

. profiles, material properties, TC acccuracy, profilers and test vehicles, process window, heat transfer and oven control. Mechanistic Study of Forming Gas Annealing of c-Si Solar Cell Electrodes (369.5 KB firing and in-line diffusion. Oven Adjustment Effects on a Solder Reflow Profile (1.3 MB) Circuits Assembly Magazine - Aug 2009 ---- This paper ivestigates the effects of variations on belt speed, static pressures, and zone temperatures on peak temperature, time above liquidus (TAL . Effect of High-Temperature Requirements for Lead-Free Solder (381.3 KB) Circuits Assembly - July 2004 --- The transition to lead-free processing is discussed including the lead-free process impact and whether a new reflow oven is required . Lead Free Solder Wafer Bumping – Oven Control and Solder Material Consistency Are Critical (150.9 KB) Advanced Packaging - Sept 2004 --- A discussion on the transition to lead-free processing for wafer bump reflow with a focus on process control . Oven Selection and Lead-Free Solder (634.5 KB) Global SMT & Packaging - Oct 2004 --- A discussion on the oven requirements for lead free solder

PCBL - PCB Library Expert

http://www.pcblibraries.com/LibraryExpert/Lite/

= 115 total families 26 major Through-hole component families and 39 sub-families = 65 total families Preference Options include:      - Terminal Settings for Pad Place Round-off, Solder and Paste Mask, Fabrication and Assembly Tolerances, 3 Density Levels, Courtyard to Body & Courtyard to Pad, Toe Heel and Side solder joint goals      - Rules for minimum Pad to Pad, Pad to Thermal, Minimum Solder mask Web, Gang Mask, Minimum Stand-off Pad Trimming, Rounded Rectangular Radius Settings, Thermal Pad Solder & Paste Mask & Bottom layers Add Keep-outs for Top. Bottom or All Layers for Placement & Height, Trace, Copper, Via, Test Point and round, rectangle, square or map to courtyard shapes, any size and location Turn Layers on/off to display any layer to the top Footprint features for Panning, Zoom

PCB Libraries Forum

http://www.pcblibraries.com/forum/RSS_pcb-libraries-forum.xml

. does this, but how do you know which one did. Since IPC never created any test boards to validate the 7351 guideline for solder joint goals there is no conclusive evidence that the solder joint goals in the guideline are optimized for the best assembly attachment : Tom HSubject: Nominal Epad vs Max EpadPosted: 27 Nov 2019 at 9:06amThe component mfr. creates a reference design to test the circuitry and heat flow . However, there was a lot of highly educated guesses but after taking the IPC-J-STD-001 training course and CIT certification, I found out that 7351 does not adhere to the J-STD-001 solder joint goal

HOME | Screen Printing Technology | Speedprint UK

https://www.speedprint-tech.com/page/2/

+ SOLDER PASTE INSPECTION STENCIL AUTO LOAD AND UNLOAD SPEED ENHANCEMENT STENCIL PASTE DISPENSE INTEGRATED STENCIL CLEANER MAINTENANCE ADVANTAGE SOLDER PASTE MANAGEMENT STENCIL ADJUST SYSTEM SNUGGER at this year’s Productronica exhibition on stand A2.461. The company’s flagship SP710AVi machine will feature on- [...] Exciting Test Drive Opportunities with Speedprint at Productronica . Exciting Test Drive Opportunities with Speedprint at Productronica. Exciting Test Drive Opportunities with Speedprint at Productronica . admin 2019-11-01T12:45:54+00:00 October 24th, 2019 | Speedprint’s award-winning SP710AVi and SP1550 screen printers are not the only exciting things you can test drive on stand

PR: Speedprint to Demonstrate Small to Large at APEX 2019 | Speedprint UK

https://www.speedprint-tech.com/apex-2019/

: Speedprint to Demonstrate Small to Large at APEX 2019 View Larger Image Speedprint Technology will use the 2019 APEX Expo to promote its range of screen printer platforms that address solder paste the company’s unique, dual-head ADu+ (Automatic Dispense Unit). This allows adhesive or extra solder paste to be dispensed in the printer during the printing process, providing added flexibility and opportunities to improve productivity | 0 Comments Exciting Test Drive Opportunities with Speedprint at Productronica. Exciting Test Drive Opportunities with Speedprint at Productronica . February 4th, 2020 Exciting Test Drive Opportunities with Speedprint at Productronica. October 24th, 2019 Speedprint Demonstrates the ART of Printing at APEX 2020 January 23rd, 2020 Seventh Service Excellence Award for Speedprint

Wave solder for PCB assembly

http://ce-exchange.com/category/wave-soldering.cfm

Wave solder for PCB assembly Your Professional Remarketing Connection 815.363.0800 sales@ce-exchange.com About Us Contact Us Directions FAQ's Services Used SMT for Sale Sell your SMT Equipment Auction Services Attention Lessors Consignment Sales Used PCB Assembly Panasonic OEM Solutions Pick and Place Screen Printer Fluid Dispenser Reflow Oven Wave Soldering PCB Wash & Stencil Cleaner AOI - SMT Inspection ICT Test & SMT Rework Thru-Hole -exchange.com Wave Soldering Wave solder machines accept a PCB or pallet with through hole or glued SMT components.  After preheating the PCB, the board travels over a molten fountain of solder (wave ) soldering the leads and components to the board. read more... Much like reflow ovens, wave solder machines vary in length (primarily due to additional preheats . Common considerations for wave soldering is leaded or lead-free, N2 (inert) environment or air, and number and type of preheats.  Some common brands for wave solder machines include

Pillarhouse Jade S-200

http://ce-exchange.com/detail/pillarhouse-jade-s-200-selective-soldering-6163.cfm

and Place Screen Printer Fluid Dispenser Reflow Oven Wave Soldering PCB Wash & Stencil Cleaner AOI - SMT Inspection ICT Test & SMT Rework Thru-Hole • Universally Adjustable Tooling Carrier • Inerted Nitrogen System • Lead Free Capability (Titanium solder pot and pump assembly) • Solder Wire Feeder with Solder bath level sensor • Drop Jet Fluxer . • Process viewing Camera • PillarPAD Offline Programming • Manual Fiducial correction As part of the entry-level philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential ) Edge clearance: Above / below 3mm Height clearance: Above / below 40mm nominal Above 190mm – special application Solder : Most commonly used solder types

Crimp Tools

http://fknsystek.com/Wire%20Crimp.htm

die.The correct location for the leaf is set by a ball detent. The operator places the wire into the crimp housing and steps on the foot pedal for a quick and reliable  crimp connection . Using the crimp height caliper, this is measured from the bottom of the claws to the highest point in the crimp. Test measurements have indicated that the optimum electrical conductivity (point E, Fig II

IPC - Association Connecting Electronics Industries

http://ipc.org/default.aspx

Materials Quality/Test Design Printed Electronics Lead Free Market Research Management Roadmap Artwork/Test Vehicles/Solder Kits Presentation Revision Table Specification Tree (PDF) IPC TM-650 Test Methods Manual IPC Free Documents Technical Activities Executive Committee IPC Standards Policies/ Position Statements IPC Printed Electronics Initiative Data Transfer Website IPC Training & Certification Training & Certification Certification Quality Initiative (CQI) CQI Overview Certification Portal User's Guide Online Print Test Waiver Form Retrieve Login Information Sign Up as a New Contact IPC Cert Stats by Company IPC Certification Policies and Procedures & Publications Electronics Assembly Acceptance Advanced Cleaning Components General Material Process Support Quality/Test Rework/Repair Solderability Printed Board Fabrication Acceptance Flex HDI HS/HF . The change, part of IPC's Certification Quality Initiative, will improve security, shorten turnaround time for test results and improve the overall quality of questions

IPC TM-650 Test Methods Manual | IPC

http://ipc.org/test-methods.aspx

- Solder Ball Test - 1/95 TM 2.4.44 Solder Paste - Tack Test - 3/98 TM 2.4.45 Solder Paste - Wetting Test - 1/95 TM 2.4.46A Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms - 6/04 TM 2.4.47 Flux Residue Dryness Materials Quality/Test Design Printed Electronics Lead Free Market Research Management Roadmap Artwork/Test Vehicles/Solder Kits Presentation 2.3.42 Solder Mask - Resistance to Solvents and Cleaning Agents - 3/07 SECTION 2.4 - Mechanical Test Methods TM 2.4.1E Adhesion, Tape Testing - 5/04 TM 2.4.1.2 Adhesion of Conductors on Hybrid Substrates - 12/87 TM 2.4.1.3 Adhesion, Resistors (Hybrid - Tape Test Method - 3/07 TM 2.4.29C Adhesion, Solder Mask, Flexible Circuit - 3/07 TM 2.4.30 Impact Resistance, Polymer Film - 10/86 TM 2.4.31A Folding, Flexible Flat Cable - 4/86 TM 2.4.32A Fold Temperature Testing, Flexible Flat Cable - 4/86 TM 2.4.33C Viscosity - T-Bar Spindle Method - 1/95 TM 2.4.35 Solder Paste - Slump Test - 1/95 TM 2.4.36C Rework Simulation, Plated-Through Holes for Leaded Components - 5/04 TM 2.4.37A Evaluation of Hand Soldering Tools for Terminal Connections - 7/91 TM 2.4.37.1A

Universal motor driver and control board version 2- Sponsor - PCBWay

https://www.pcbway.com/project/sponsor/Universal_motor_driver_and_control_board_version_2.html

. The USB can help to debug the code I will test on the MCU. The previous version was designed to be easily programable by those who can only use the Arduino IDE . TECHNICAL DETAILS The 2-layer PCB is 86x90 (in mm) with 1 oz Cu, green solder mask and white silkscreen.   Words to PCBWay You sponsored the previous version of this motor driver and I was satisfied with the quality of the PCB ****ita from ROMANIA FPGA Test Board By j******zar from MEXICO PCB Instant Quote x mm Quantity Choose Num (pcs) 5 10 15 20 25 30 40 50 75 100 100+ Quote Now Earn a $5 Welcome Bonus

4 layer PCB Fabricator in China --- PCBWay.com

https://www.pcbway.com/prototype_pcb/4-layer-PCB-Proto-in-China.html

& Layout Printed circuit board materials PCB Design & Layout Layer Orientation Panel Creation BGA PCB Price Composition Gold fingers Surface Surface finish Solder mask Via Covering Silkscreen Drills Quality Design Rule Check A.O.I. E-Test X-RAY Impedance Control ROHS-Lead Free UL Certification Manufacturing tolerances 4 layer PCB Fabricator --- PCBWay.com 4-layers PCB board is our most advantageous product at PCBWay.com. We electronically test every boards to ensure the quality

Hordaphos 145

https://www.clariant.com/de/Solutions/Products/2014/01/16/15/30/Hordaphos-145

(20% in mineral oil) 2 mm 2 Four ball wear test (DIN 51350) 0.48 mm TGA infrection point 291°C TGA deposits 9.8% Applications Metal working fluids Technical Data Applications Life Cycle EcoTain® Technical Data Product group Phosphoric acid ester Phosphorus content 4.3 - 5.7% Acid value (mg KOH/g) 160 pH (1% in water) 3  Pour point 15°C Reichert test (5% in mineral oil) 8 mm 2 Reichert test ) Less effects to the aquatic environment (LC50 100-1000 mg/l) Biogredable (biodegradation >70% in 25 days according to beaker test

Hordaphos 145

https://www.clariant.com/en/Solutions/Products/2014/01/16/15/30/Hordaphos-145

(20% in mineral oil) 2 mm 2 Four ball wear test (DIN 51350) 0.48 mm TGA infrection point 291°C TGA deposits 9.8% Applications Metal working fluids Data Applications Life Cycle EcoTain® Technical Data Product group Phosphoric acid ester Phosphorus content 4.3 - 5.7% Acid value (mg KOH/g) 160 pH (1% in water) 3  Pour point 15°C Reichert test (5% in mineral oil) 8 mm 2 Reichert test ) Less effects to the aquatic environment (LC50 100-1000 mg/l) Biogredable (biodegradation >70% in 25 days according to beaker test

Proskill CTG Awareness Workshop - Blackfox.com

https://www.blackfox.com/blackfox-services/counterfeit/workshop/

level solder training to thousands of engineers, test technicians, production assemblers and quality control personnel. Rick has presented counterfeit component detection programs at the IPC APEX Expo, SMTA and SMTA International conferences and at the SMCBA 2011 International conference in Australia . process and quality control engineers,) test technicians, in-process inspectors, outwards goods inspectors, test engineers, supply chain managers, manufacturing and production managers, test technicians, purchasing managers and officers

Proskill CTG Certified Inspection Course PRO-STD-001-Blackfox

https://www.blackfox.com/blackfox-courses/counterfeit/certification/

. • X-ray images of semiconductor defective and non defective internal wires and ball bonds per MIL-STD-883. • How to implement a robust internal counterfeit component prevention procedure .) Final Exam administered, consist of 60 Questions, open notes/placard set allowed during test. The Exams are corrected, PRO-STD-001 serialized competency certificates are awarded to all those who successfully pass this final examination

Products – Precision PCB Services, Inc.

https://precision-pcb-services-inc.myshopify.com/collections/all

PCB Rework PF-400 REballing Reflow Oven ROHS RW-B400C Selective Plating Shuttle Star Shuttle Star BGA Rework Nozzles Shuttle Star Hot Air Nozzles SMD SMD Rework SMT SMT Rework Solder Solder Ball Finger Repair Gold Finger Rework Hand Solder Certification Hand Solder Training Hand Soldering Training and Certification Hand Soldering Training Classes Hot Air Nozzle Hot Air Rework i-Chips Image Solder Balls Solder Bumping Solder Certification Solder Sphere Solder Training soldering SP-360C SRT SRT 1000 SRT 1000 SRT 1000 BGA Rework Station SRT 1100 SRT 1100 HR SRt Calibration SRT Maintenance SRT $6,000.00 Solder Balls - Lead Free .20mm $75.00 Solder Balls - Lead Free .25mm $75.00 Solder Balls - Lead Free .30mm $75.00 Solder Balls - Lead Free .35mm $75.00 Solder Balls - Lead Free .40mm $75.00 Solder Balls - Lead Free .45mm $75.00 Solder Balls - Lead Free .50mm $75.00 Solder Balls - Lead Free .55mm

Products – Page 2 – Precision PCB Services, Inc.

https://precision-pcb-services-inc.myshopify.com/collections/all?page=2

PCB Rework PF-400 REballing Reflow Oven ROHS RW-B400C Selective Plating Shuttle Star Shuttle Star BGA Rework Nozzles Shuttle Star Hot Air Nozzles SMD SMD Rework SMT SMT Rework Solder Solder Ball Finger Repair Gold Finger Rework Hand Solder Certification Hand Solder Training Hand Soldering Training and Certification Hand Soldering Training Classes Hot Air Nozzle Hot Air Rework i-Chips Image Solder Balls Solder Bumping Solder Certification Solder Sphere Solder Training soldering SP-360C SRT SRT 1000 SRT 1000 SRT 1000 BGA Rework Station SRT 1100 SRT 1100 HR SRt Calibration SRT Maintenance SRT

Tech Tools

http://www.nordson.com/en-us/divisions/asymtek/support/Pages/Tech-Tools.aspx

. To utilize the analyzer, the user simply inputs dispense profile data. Key profile dimensions include height of wire bonds, dimensions of cavity volume and solder ball height chip in package and flip chip on board dispensing processes. To utilize the application, the user simply inputs parameters including die proportions, fillet width and solder bump profiles, then selects a specific underfill material from the list of industry

CSP and BGA Underfill

http://www.nordson.com/en-us/divisions/asymtek/solutions/PCB-Assembly/Pages/CSP-and-BGA-Underfill.aspx

Adhesive Solder Paste Dispensing CSP and BGA Underfill Selective Flux Jetting Conductive Adhesives Solder Mask Dispensing Corner and Edge Bonding Package on Package (PoP ) Embedded Assemblies No-Flow Underfill Board Level CSP and BGA Underfill Underfill dispensing to Ball Grid Array and Chip-Scale Packages has been shown to improve package reliability ), ball grid array assembly (BGA) and package-on-package (PoP) assembly.   Beyond board density changes, mobile electronics need greater durability at the individual part level than traditional desktop motherboard applications

26594_OK int_techon brochure

http://www.techconsystems.com/images/companies/pdf/Techcon-Catalog102015-EN-Web.pdf

. TS1212 pinch tube valve (page 22), TS350 controller (page 3), TS5000DMP valve (page 16), TS500R controller (page 15) 8. Solder Paste Dispensing Solder paste is the most difficult material to dispense . The TS5000 Series rotary valve is designed specifically to dispense solder paste without clogging and separation. Dot size as small as 0.010" (0.254mm) can be dispensed consistently . A majority of automated dispensing systems incorporate the TS5000 Series valve for solder paste dispensing. TS5000 Series rotary valve (page 16) 3 TS 25 0/ TS 35 0 D is pe ns er /C on tr ol le r TS250 Series Digital Dispenser/Controller The TS250 Series Dispenser/Controller dispenses low, medium and high-viscosity fluids accurately Stiff Bristle 16 BT16-SOFTPK BT16-STIFFPK 18 BT18-SOFTPK BT18-STIFFPK 22 BT22-SOFTPK BT22-STIFFPK Dispensing Tip Kit Decide for yourself which tip to use. This kit contains a variety of the most popular 700 Series tips to let you test different tips of solder paste • Form-in-place gasket • Filling • Potting • Encapsulation • Bonding • CoatingSpecifications: TSR2201 TSR2301 TSR2401 Power Supply 100V ~ 240V AC Power Consumption 80W Number of Controllable Axis 3 axis Moving Range X axis 200mm 300mm 400mm Y

J.M.W. - ADMIN Inventory Listing

http://www.jmw-inc.com/Listing.asp?FindThis=

with 4GN30KA Gear Head SMT Spare Parts N/A 4RK25GN-AMUL Oriental Motor AC Magnetic Brake Motor SMT Spare Parts N/A 5IK40GN-SH-230 Oriental Motor Induction Motor SMT Spare Parts N/A SWA-1 SWPC Solder Wave Electromagnetics DC Motor SMT Spare Parts N/A 145817 DEK Camera X Servo Motor SMT Spare Parts N/A 107319-2 DEK Servo Motor SMT Spare Parts N/A 2-5001-372-00-0 Electrovert Solder Bar Feeder Motor (Dayton 4Z06A INLINE SMT GBC-460-1000-NL Workstation Conveyor SMT Conveyors WO-460-EXL INLINE SMT WO-460-EXL Wave Solder Unloader SMT Conveyors GBC-460-500-IC INLINE SMT GBC-460-500-IC Connecting Conveyor SMT Conveyors 120601 AirVac PCBRM-12 Rework Station Rework Parts N/A KT-33-VCP100 Sporlan Valve Co. Thermostatic Expansion Valve SMT Spare Parts N/A 20815160 Sensbey Brush SMT Spare Parts N/A 2-6004-356-01-0 Electrovert Bearing Ball SMT Spare Parts N/A 3-0606-371-01-2 Electrovert Brush, Wiper, Finger SMT Spare Spare Parts N/A 3-0616-113-01-2 Electrovert N/A Solder Nozzle Plate SMT Spare Parts N/A Panadac941A Panasonic N/A Enclosure SMT Spare Parts N/A 110QD-QDP-20-A1 Jonathan Mfg. Co. N/A Drawer Slide SMT Spare Parts N/A 110QD-QDP-16-A1 Jonathan Mfg. Co. N

SMT Spare Parts - Electrovert, DEK, MPM

http://www.jmw-inc.com/SMT_Spare_Parts.asp

/A Pump SMT Spare Parts N/A CM34D25FC2A Leeson N/A Motor 130V, 2500RPM, 2.3 Amps, 1/3 HP SMT Spare Parts N/A Chaintensioner1 Electrovert N/A Conveyor Drive Chain Tensioner SMT Spare Parts N/A Solderlevelfloat Electrovert N/A Solder Level Float, Missing parts SMT Spare Parts Head SMT Spare Parts N/A SWA-1 SWPC Solder Wave Analyzer SMT Spare Parts N/A P21NRXD-LNN-NS-00 Pacific Scientific 1.8 Step Motor SMT Spare Parts N/A M61A6GD4W Panasonic Motor with M6GA12.5B Gear Head SMT Spare Parts N/A 24A2BEPM-D3 Bodine DC Motor SMT /A 2-5001-372-00-0 Electrovert Solder Bar Feeder Motor (Dayton 4Z06A) SMT Spare Parts N/A 10-PSSH-0 Baldor DC Motor SMT Spare Parts N/A 2-5001-196-01-4 Electrovert DC Motor SMT Spare Parts N/A USAREM-03DE2K Yaskawa AC Servo Motor SMT Spare Parts N/A 125

Global Technology Award | productronica

http://productronica.com/trade-fair/exhibition-profile/events/awards/global-technology-awards/index.html

—Programming Rework and Repair Software—Process Control Software—Production Solder Paste Soldering Equipment—Other Stencils Storage Systems Test Equipment Test Services Judging Panel Adjudicated by an international panel of judges from China, Europe and USA

Global Technology Award | productronica

http://productronica.com/trade-fair/exhibition-profile/events/awards/global-technology-awards/

—Programming Rework and Repair Software—Process Control Software—Production Solder Paste Soldering Equipment—Other Stencils Storage Systems Test Equipment Test Services Judging Panel Adjudicated by an international panel of judges from China, Europe and USA

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Dual Lane Reflow Oven