Electronics Forum | Thu Jul 12 16:17:59 EDT 2007 | bandjwet
We are looking for: 1. A company that sells inspection equipment that can measure the height of solder balls (relative to the plane of the interposer or bottom of the device) OR 2. A service provider who can make some measurements for a user. Any
Electronics Forum | Tue May 05 11:08:43 EDT 2009 | timo
Check out the attached and compare your issue w/ the issue in the attached. If it's 'beading' versus 'balling' - check thru the punch list and if you've addressed all those potential causes - then it may be paste specific. The Sn/Ag alloy choice is
Electronics Forum | Thu Jun 09 13:38:16 EDT 2011 | rdubya
You might want to check the components as well, I've seen a similar problem with re-balled parts using the wrong diameter ball. that would also contribute to added solder. good luck
Electronics Forum | Mon Jun 13 01:35:22 EDT 2011 | kenneth0
Had you check the temperature difference of outer balls and inner balls? Solder short in corners might be caused by high delta T causing BGA warping.
Electronics Forum | Sat Jul 11 03:01:29 EDT 2020 | researchmfg
The bubble inside BGA ball locate at via in pad and apply the resin plug hole.You shall check the cooper plating quality on PCB pad. If there is thin plating or broken on the pad then air will come from the resin plugged via and be trapped inside the
Electronics Forum | Fri Dec 11 13:06:54 EST 2020 | johndep7
I haven't, that is a good idea, I was reading about the chance of that earlier but I was not sure. The best way to eliminate is to bake the board?
Electronics Forum | Wed Sep 08 17:31:58 EDT 1999 | Earl Moon
| I am wave soldering a single sided through hole PCB array with (6) .040" round diameter pins that sit .5" off the PCB, and .080" apart. The problem being experienced is that solderballs are appearing on the end of the pins. I have tried decreasin
Electronics Forum | Wed Mar 20 16:10:27 EDT 2013 | woodsmt
Most pots have a drain system, but that is a scary thing to use. I have seen places that have plumbed it nicely with ball valves and such to control the flow into small containers, but still fraught with danger. I use small metal bread pans. I lad
Electronics Forum | Wed Jun 26 08:52:03 EDT 2002 | davef
There is no industry standard for reballing BGA. Search the fine SMTnet Archives for a reference to Motorola�s reasoning behind their not shipping product with reworked BGA. As background: * JEDEC is the semiconductor engineering standardization gr
Electronics Forum | Wed Nov 19 22:39:10 EST 2003 | davef
SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments
