Electronics Forum | Tue Sep 14 13:38:33 EDT 2010 | rayguide
There is problem with the alignment of BGA Balls. Check for any vibration. http://hubpages.com/hub/SMT-Reflow-Soldering-Equipment
Electronics Forum | Fri Sep 23 11:08:36 EDT 2011 | kahrpr
Put the ball in their court and ask them to send you what specifications they are inspecting to.
Electronics Forum | Tue Sep 18 12:37:21 EDT 2012 | mark25y2001
msg - delete because picture posted not viewed.
Electronics Forum | Thu Apr 25 12:46:53 EDT 2013 | emeto
Hi, I attach two pictures for you. Hope they help
Electronics Forum | Fri Apr 26 08:04:16 EDT 2013 | emeto
These numbers show liquidus temperature in C for each alloy combination.
Electronics Forum | Mon May 20 09:24:32 EDT 2013 | davef
SAC / Ni interface is the IMC (Cu, Ni)6Sn5
Electronics Forum | Mon May 20 22:13:45 EDT 2013 | ultimatejoker
So u mean it is to form the intermetallic compound which is (Cu,Ni)6Sn5?
Electronics Forum | Sat Apr 05 17:34:53 EDT 2014 | davef
The middle picture shows what looks to be solder balls littered across the surface. Turn-up the heat knob!!!
Electronics Forum | Tue Jun 10 12:11:03 EDT 2014 | jorge_quijano
this is a Class II product. If I increase the openings... will I have random solder balls?
Electronics Forum | Mon Sep 19 09:31:28 EDT 2016 | emeto
Whatever the cause is, will be fixed by applying less paste. So Homeplate it is.