Electronics Forum | Mon Jan 14 06:28:18 EST 2008 | gregoryyork
Hi its normally down to the state of cure of the resist type not the actual type be it matt or gloss. If its not cured correctly it will produce solder balls. Pending where you are you could try our 35-41 or new 35-41-30 flux this will reduce the pro
Electronics Forum | Tue Feb 12 18:48:48 EST 2008 | larryd
Thanks for the spare change. Questions are good and I did miss one item. Process has 100% solder paste inspection with a 3D inspection machine that has very few false calls or accepts. Ramp to peak is less than 1.5C/sec. Profile looks good, solder
Electronics Forum | Wed Aug 19 18:28:01 EDT 2009 | ratsalad
I'd like to ask a question. Have you determined where all those solder balls are coming from? I even see them on top of U40 and U15. This seems like a dumb question to me considering the size of the part (and having seen pictures of only one boa
Electronics Forum | Wed Aug 26 05:13:01 EDT 2009 | grahamcooper22
Hi, as you are using Vapour phase reflow what temperature is the boiling point of the solvent you are using ? If it is @ 250 C then you should be getting everything hot enough to melt the ball and solder paste together. If this is the case then your
Electronics Forum | Mon Jan 10 16:58:48 EST 2011 | piter
Hi Ripal it seems that you have problem with compatibility of alloy and quality of solder balls. First check solder alloy form BGA balls what is it?(SAC105,SAC305, etc.) what type of solder paste you use?? third thing is what type of finishing you h
Electronics Forum | Tue Apr 03 08:38:34 EDT 2012 | tombstonesmt
Yesterday morning wasn't the first time I noticed this condition. We remove the dross from the pot twice a day and once a week we remove the pump assembly and it still produces this type of dross. I googled this situation and some factors of this par
Electronics Forum | Mon Jan 09 15:49:50 EST 2006 | GS
You can find some good idea by reading IPC-J-STD-002B (or later review ) Solderability test and also the JEDEC Standard (free down load) JESD22-B102D solderability test. A suggestion, first of all check how old are the chips (read data Code on Label
Electronics Forum | Mon Oct 06 12:37:18 EDT 2003 | ramanandkini
It was a nice discussion. What I did here was a thermal shock test 1 hour@ +90 deg.c and immediately 1 hour @ -40 deg.c. The second test I did was a high humudity test for a week. After each test, I carried out a peel test with scotch tape. Those bo
Electronics Forum | Wed Jun 19 05:16:21 EDT 2002 | hany_khoga
Dear all: I wonder how to avoid cracking the BGA if I want to remove it from the PCB assembly, re-ball it and solder it again. I need an answer considering: 1- The assembly could have been exposed to the ambient humidity for a long time. 2- The as
Electronics Forum | Fri Jul 12 03:05:30 EDT 2002 | Dreamsniper
Is there a standard with regards to the height of a PBGA ball diameter that will say that it has undergone a double drop ? What is the criteria of identifying that a PBGA solder ball has done a double drop and that it is acceptable or not acceptable.
