Electronics Forum | Thu Jul 09 13:04:19 EDT 1998 | Phil
I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. Thanks for any and all help given
Electronics Forum | Wed Aug 22 09:17:15 EDT 2001 | steven
if do not have x-ray inspection machine, how to verify the 1st board out from the smt placer that the BGA is placed accurately onto the solder pads. the diameter of the solder ball is 1mm. could it self align during reflow?
Electronics Forum | Fri Nov 09 10:25:43 EST 2001 | steven
is it all right to reflow a BGA using a rework station but without applying a layer of solder paste on pcb. the diameter of the solder ball is 0.75 and the pitch is 1.5mm.
Electronics Forum | Tue Nov 27 19:52:08 EST 2001 | davef
Search the fine SMTnet Archives on the topic to get started. For instance: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=1861&#Message7671&
Electronics Forum | Mon Jan 14 16:25:35 EST 2002 | bentzen
Hi Yannick A lot of things can cause solder balls and spattering. Such as a to steep preheat profile and to much solder present. Check out more info on: http://www.smtinfocus.com/smt_failure_list.html
Electronics Forum | Mon Aug 26 09:02:53 EDT 2002 | blnorman
Our requirement is 2 hours after printing before the board needs to go through the oven. Course we're in the humid south where on those 95%+ RH days we do get solder balling.
Electronics Forum | Thu Jul 29 17:25:43 EDT 2004 | russ
Have you contacted any paste manufacturers? they would most likely be the ones that can help you. Here are a few Kester AIM AlphaFrye FCT
Electronics Forum | Thu Jul 29 20:41:47 EDT 2004 | davef
Too bad you can't use no-lead. Mitsubishi Materials Corp makes very low alpha [spec'd at
Electronics Forum | Thu Aug 05 13:33:22 EDT 2004 | davef
For the �The Chip Wave Dilemma", look here: http://www.alphametals.com/products/fluxes/PDF/dilemma1.pdf
Electronics Forum | Thu Jan 13 09:18:28 EST 2005 | davef
We agree that coating BGA solder balls with conformal coat is a bad idea due to differences between the z-dimension thermal expansion between the conformal coat and solder.
