Electronics Forum: solder ball test (Page 176 of 418)

CSP and BGA soldering difference.

Electronics Forum | Wed Apr 04 18:27:53 EDT 2007 | Guest

Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results

Void

Electronics Forum | Mon Sep 17 19:33:27 EDT 2007 | davef

We have never studied this, but here's what we'd guess. If there are void in BGA solder balls at inbound: * A proper reflow recipe will eliminate the void. * A poor recipe will allow the void to remain and possibly generate additional void.

BGAs not reflowing??

Electronics Forum | Tue Nov 06 10:44:09 EST 2007 | tzawaide

Hi All, We are using BGAs from a new supplier, and the BGA solder balls are not collpasing properly. Can someone out there shed some light on what could be the root cause? Any help is greatly appreciated. Thanks!

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Jan 02 15:32:27 EST 2008 | shrek

HA-HA-HA... Krikies. What are ya mate? A slavakian?

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Jan 09 19:04:48 EST 2008 | pnguyvu

5 mil thick is the max and no reduction Any question feel free give me a call @ 714-636-6211 or email me Steve@usastencils.com Regards Steve

Solder balls

Electronics Forum | Fri Jul 18 16:29:30 EDT 2008 | grics

Thats it. 6 mils works great with a 10% reduction. We had also had some issues with our p&p placing the parts to hard and smashing out paste causing a bead to form in the middle of our 0805 packages.

Solder balls

Electronics Forum | Mon Jul 28 06:13:35 EDT 2008 | cobar

Your problem is being caused by to much paste being printed.Reduce apeture size on stencil. http://www.shanelo.co.za/technical_paper_about_stencil_de.htm or http://www.shanelo.co.za/SMD%20Assist.htm

BGA thermal reflowing issue

Electronics Forum | Fri Sep 26 01:15:05 EDT 2008 | scauter

Can anyone take a look on the cross sectional diagram of this reflowed BGA ball? Any idea on what has happened to this? The PCB surface finsihing is OSP with regular lead-free 305/405 solder paste. Thanks SC

Humidity question

Electronics Forum | Thu Oct 16 12:12:16 EDT 2008 | slthomas

"We don't associate solder balls with no-clean flux and humidity." I'll let the former speak for itself, but on the latter, not even spatters?

Stencil Cutters

Electronics Forum | Thu Nov 20 10:59:39 EST 2008 | elias67

Don't forget the value of being able to blame everything from bridging, solder balls,tombstoneing , traffic jams, the price of gas, the demise of the american auto industry and everything else on your stencil supplier. That would now be you!


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