Electronics Forum | Sat Aug 15 13:26:05 EDT 1998 | Bob Willis
| Electrical Eng. is looking for 5 micrograms per sq centimeter. After the board has been cleaned. Is this possible on a fully assembled bd? The European standard often quoted is 1.5 mg/cm which ia achievable on a board assembly please remember one
Electronics Forum | Thu May 16 22:37:22 EDT 2002 | xzinxzin
anyone experience to solve the non-wetting on Microleadframe packages component terminal sides. 1)I test the components solderbility in dip and look test, in solder pot at 240 deg C,the wetting on the sides is ok. but I run on mass production in refl
Electronics Forum | Thu Jun 20 04:41:47 EDT 2002 | redmary
thanks, but I also encounter the solderability problem. because these boards are HASL or Ni/Au finish, and we print the solder paste and reflow, the result shows the some non-wetting area. and the reliability test also proves to be bad. so the critic
Electronics Forum | Wed Apr 16 01:40:17 EDT 2003 | praveen
Hi , We are using water wash solder paste to solder the SMT LED's manufactured by Chicago Miniature lamp (CMD93-21 & 22)and Kingbright. Achieving the solder fillet , wetting has no issue but we observe high fallout at the functional testing. If we do
Electronics Forum | Fri Apr 30 12:34:12 EDT 2004 | Bryan She
Hello all, these days I've met an OSP board testability issue. 1.OSP board 2.Solder paste:Kester R244 no clean paste 3.Print solder paste on test pad. Issue: There's brone(light yellow)flux residue on test pad,and the probe can't penetrate the residu
Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph
Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP
Electronics Forum | Mon Nov 08 12:12:21 EST 2004 | davef
Your customer's cost will increase. Consider: * The majority of no-lead components have matte tin solderability protection. Bright tin, as mentioned by an earlier poster, has had reliability issues. Many component suppliers have documented their re
Electronics Forum | Wed Aug 30 23:45:23 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Electronics Forum | Wed Aug 30 23:45:40 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Electronics Forum | Wed Aug 13 00:09:27 EDT 2008 | diesel_1t
Hi there. We have had troubles with pogo contamination on ICT fixtures causing false failures (Pictures attached). Currently we're spending about 10k on pogo replacement but still having problems. I recomended to clean pogos with a defluxer but Test
