Electronics Forum | Tue Aug 29 06:00:47 EDT 2006 | bwet
Ladies and Gents: There have been several studies including (http://www.solder.net/PDFs/LeadFree_BGATesting_InitialCycling_BEST.pdf) which have shown lower fast pass yields with solder paste. Based on internal projects of 1000+ of the same BGAs we a
Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef
Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b
Electronics Forum | Sat Aug 18 11:23:10 EDT 2007 | Learn From U
Hi All, Via X-rays, we found solder voids appear on PTH location, especially on Dimm connectors area. We think this should be related to PCB issue as we found solder unable to fill up the PTH hole during bare board testing at wave soldering machi
Electronics Forum | Thu Sep 11 04:59:24 EDT 2008 | mun4o
10x , davef, about LEDs - the problem is , that about 1% of all leds wich we soldering have some defect - not blinking, when I make functional test.I chek 300 leds before solderinig - all is ok.After reflow 1 led not blinking, after SW 3 leds not bli
Electronics Forum | Tue Sep 01 11:30:28 EDT 2009 | rgduval
Is the solder wetting to the pad, and not to the part? If so, and all other things being true (same process, profile, solder), we'd suspect some contamination on the part preventing solder from wetting to the part. This could be tested by attemptin
Electronics Forum | Tue Feb 01 21:48:12 EST 2000 | Dave F
Guo: You want to know: 1 Can I use water as the solvent in an ultrasonic machine to remove solder paste from PCB? Continuing from Jason�s comments: Sure you can use water as the solvent to remove solder paste from PCB, but recognize that some flu
Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
Electronics Forum | Thu Dec 29 09:20:30 EST 2005 | Cmiller
We have tested SN100C and SAC305 in our selective solder machine (Ersa Versaflow). We wanted to test both alloys in the selective first because the investment in filling the pots is minimal. In our initial tests the SN100C alloy appears to be the bes
Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F
Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm
Electronics Forum | Thu Jan 21 15:24:18 EST 1999 | Terry Burnette
| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h
