Electronics Forum | Mon Dec 06 06:06:44 EST 1999 | Glen brian
Recently, my plant met the problem of bridging, a metallic link, lying on the solder mask and joining nearby joints. It is very diffcult to observe by our inspector and may be only discovered with ICT testing. This defect ocurrs randomly around the
Electronics Forum | Fri Oct 08 11:48:23 EDT 1999 | Jim Prestridge
I'm searching for a source for surface mount socket savers that accept a hand test socket (Yamaichi, Nepenthe etc...). Barring availibity of an SMT socket saver does anyone know a good technique for soldering socket savers into a .250" thick, 20+ lay
Electronics Forum | Fri Jul 23 06:44:33 EDT 1999 | George Verboven
| First of all, I'm a young Spanish so sorry for my English | | I'm looking for a smd single pin connector. I need it to solder it in a alumina's substrate. | | Please. can anybody help me ? | Go to the following adress: http://www.keyelco.com/ke
Electronics Forum | Mon Jun 21 12:06:56 EDT 1999 | Scott Cook
| Since Vic posted me privately and asked for the SIR test parameters I spoke of in my other post, I thought I'd respond on the forum. | | Ok, here they are, per Joe Keller--Solder / process consultant AKA Manko..... This SHOULD have read "ALA Man
Electronics Forum | Thu Apr 01 14:00:17 EST 1999 | Ron Beasley
| | Has anyone heard of a problem with catastrophic failure of | | large value (200uF) solid tantulum capacitors that have been | | exsposed to high humdity. | | | I suppose that with water moisture seep in the capacitor, the risk is very high tha
Electronics Forum | Wed Jun 16 04:18:53 EDT 1999 | forrest xie
| | | we encounter BGA soldering issue. there is always some dry joint or unclear defects after reflow and the board can't pass electrical test, but if we resoldering it through hot air gun, every thing is ok. we use the "dog bone" surface pad ,that
Electronics Forum | Fri Nov 13 03:57:41 EST 1998 | Steve Cheung
We are experiencing 'lifting' on one or more sides of a QFP. Poor lead co-planarity has been ruled out by independent tests. Please tell me which of the two remaining failure modes is the most probrable? 1. Expansion of gases in vias underneath devi
Electronics Forum | Thu Aug 29 07:21:28 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Wed Apr 01 11:35:24 EST 1998 | Big Manny
I've had some field reliability and Accelerated Life Test (ALT) issues with BGAs on Entek coated Cu. > The best results so far are with Atotech coated Gold electroplate finish. > Solderability, for factory process, seems to be as described by Justin
Electronics Forum | Thu Nov 01 17:36:20 EST 2001 | davef
We don�t bake between routine washing between soldering cycles. We bake when we immediately go to test or box-build. Certainly, it all depends on your process, materials, and boards. So, how did you determine that you needed to spend the money? I
