Electronics Forum | Tue Feb 03 10:10:27 EST 2009 | milroy
Hi, There is one thing missing still, you must put a TC from the bottom side of the BGA by making a hold on the test board at the TC can measure the temperature at exactly the middle of the BGA. You should be able to the dual time and peak temperatu
Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78
I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m
Electronics Forum | Thu Aug 06 17:56:29 EDT 2009 | stevea
Don't forget about ASC International. Having the largest supported installed base of benchtop SPI systems in the world, I'm surprised we were missed. If you have any further questions, I woudl be happy to assist. We have performed hundreds of test
Electronics Forum | Tue Aug 25 10:38:03 EDT 2009 | grahamcooper22
Hi Sergey, Do you know the Moisture Sensitivity Level of the component ? This is normally recorded on the DRY PACK that the device comes in. It is not unusual for a device to POP CORN and still work in test. It depends how much damage there is to th
Electronics Forum | Tue Jun 22 00:20:21 EDT 2010 | leadthree
Pick & Place > Wave-solder > other parts > test > conformal coating Is there any production error that could make a ceramic cap conductive? PS: want to add one point: The caps don't seem to be cracked. We changed a few 100 and didn't notice any bro
Electronics Forum | Mon Oct 04 00:26:07 EDT 2010 | mskler
I want to check this becuase we are exporting the PCB & there is problem of components missing at customer end in some PCB while we are doing 100% AOI & then ICT testing. These components are checked by both. there is no possiblities that the compone
Electronics Forum | Mon Sep 12 07:03:26 EDT 2011 | mosborne1
Can you post a picture? There are many reasons why they probably don't fill. There needs to be a larger surface area on the ring on top. There could be debris in the via holes from not properly drilled or cleaned before plating process. Your customer
Electronics Forum | Thu Aug 01 19:03:30 EDT 2013 | joeherz
I am sick of Kapton. We have varying levels of leftover residues on multiple brands and I'm done chasing this thing. We have tested some wave tapes that were total garbage in years past. Really don't want to go there. Peelable liquid masks - Who
Electronics Forum | Thu May 31 06:25:23 EDT 2018 | cyber_wolf
Diego, In my opinion you are wasting your time testing. Set the squeegee pressure until its just cleaning the stencil off. That is the correct pressure. Unless you are getting failures at SPI (if you have SPI) or getting solder defects don't worr
Electronics Forum | Fri Jul 06 08:10:50 EDT 2018 | davef
ACCELERATION FACTORS AND THERMAL CYCLING TEST EFFICIENCY FOR LEAD-FREE SN-AG-CU ASSEMBLIES [http://www.jpclech.com/CLECH_SMTAI2005_PAPER.pdf] Jean-Paul Clech EPSI Inc. Montclair, New-Jersey, USA jpclech@aol.com Paper (copyright EPSI Inc. © 2005) was
