Electronics Forum: solder ball test (Page 361 of 418)

Reflow Profile Design

Electronics Forum | Fri Jun 15 11:05:17 EDT 2007 | grantp

Hi, This is a little embarrassing asking this question, as I think I am profiling our oven incorrectly. I have been using the profile based on the solder paste specification, however we have been getting a large BGA chip coming more unreliable, and

In search of knowledge

Electronics Forum | Tue Oct 16 10:06:46 EDT 2012 | jackofallmasterofnone

Hello all, First off let me start by introducing myself. My name is Dan and I work for a contract manufacturer. During a job search I had heard from a previous co-worker that there was a packing job available at the facility where he now worked. I

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

Re: voc free flux

Electronics Forum | Mon Apr 05 08:25:31 EDT 1999 | ADRIANO FERNANDES

| | | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | | What disadvantages are there when using this flux? | | | Do you have any contact

Re: Why does everyone want to x-ray BGA?

Electronics Forum | Fri Apr 17 21:34:02 EDT 1998 | D.Lange

| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu

What caused this reflow issue?

Electronics Forum | Mon Apr 14 13:24:32 EDT 2008 | mmjm_1099

We had an order using a 2up PCB (same manufacturer) with same components and same board layout without any problems. Perfect run. The next order ran on the same day with same paste using same parts, same layout, same profile, but different 2up PCB h

BGA Placement Process

Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala

Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u

Re: RF applications..aqueos vs. no clean..HELP!!!!

Electronics Forum | Sat Mar 27 12:36:34 EST 1999 | Scott Cook

| Hi, | I have a customer who's electronic assemblies produce RF. He is insisting upon aqueuos cleaning. We switched to a no clean solder years ago and no longer have an aqueous system. | Is aqueous cleaning necessary to eliminate 'cross talk' of

Re: haloing on SMT PCBs

Electronics Forum | Mon Jun 08 15:00:08 EDT 1998 | Earl Moon

| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot

Soldering issues lately!!

Electronics Forum | Thu Sep 11 11:34:52 EDT 2008 | patrickbruneel

Interesting observation Manuel. I will be blamed again for crying wolf but look below a lot more defects will soon see the daylight all related to lead-free. This information was posted at the tin whisker forum by Bob Landman of H&L Instruments.


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