Electronics Forum | Tue Feb 26 17:00:15 EST 2008 | slthomas
I haven't had the luxury of machine based pth assembly in quite a while, but when I did, given that the machines control which parts are inserted (and to a lesser degree where they are inserted) we decided not to perform inspection on that part of th
Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon
ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that
Electronics Forum | Wed Jun 18 12:56:31 EDT 2008 | ampearl
I need to find a qualified candidate to join a communications company in the SMT department. The project calls for an individual who has worked with product development building prototypes and testing them in an R&D environment, as well as workin
Electronics Forum | Wed Sep 10 14:14:03 EDT 2008 | gregoryyork
Yes why did the Electroless Nickel layer split this is the ROOT cause. My guess is still that the resist was slightly miss registered over the copper and therefore poor adhesion of the Nickel ensued OR like I said originally the resist had contaminat
Electronics Forum | Tue Oct 14 09:26:15 EDT 2008 | bickt
Hi, I have been at both ends of this business. I installed lines and have been in manufacturing for some 25 years. Do not go by the test boards that the installer or OEM uses. these boards are too broad and loose for any kind of guide line to est
Electronics Forum | Tue Oct 28 20:26:53 EDT 2008 | fishingfool
Dominik, Pixel size should not be the main criteria for selecting an AOI. I have a customer that has 2 MVP and they say the solder test are good but part reconigtion is not so good. You also say you need some flexibility on software. I also have
Electronics Forum | Tue Mar 03 03:02:17 EST 2009 | emmanueldavid
25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role for these defects. 4. Placement: P
Electronics Forum | Wed Aug 26 12:38:31 EDT 2009 | smtirl
Folks, discovered an issue this morning where solder joints on PCBs that came out of wash system have turned BLUE! Bare pads and test points also contaminated but not as obvious visually. Looks like it could be a chemical reaction between wash
Electronics Forum | Mon Apr 19 11:26:32 EDT 2010 | davef
Independent Labs * American Competitiveness Institute; One International Plaza Suite 600, Philadelphia, PA 19113; 610-362-1200 F1290 info@aciusa.org * Bodycote Materials Testing , 847-676-2100, na.bodycote-mt.com * Foresite 765-457-8095, http://www
Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman
Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages
