Electronics Forum | Sat Sep 18 08:26:10 EDT 2004 | davef
Carol: If you would have problems both covering the via and keeping mask from the BGA pads, maybe you via are too close to the pads. Maybe some of the IPC pad design guidelines would help.
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F
Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.
Electronics Forum | Sun Oct 10 17:57:48 EDT 1999 | JohnW
Folk's, I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. I was wanting to do a straw poll on you guy's as to the type of resist's you are using Glos
Electronics Forum | Mon Oct 11 13:08:29 EDT 1999 | Dave F
| Folk's, | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | I was wanting to do a straw poll on you guy's as to the type of resist's you are us
Electronics Forum | Thu Jun 22 15:05:55 EDT 2017 | solderingpro
There are several different technologies in the industry today to assist in the out-gassing of flux cores. On automated soldering systems, there are two main types of perforating solder feeders: - Hole Drilling - "V" Scoring By perforating the so
Electronics Forum | Thu Jul 06 03:43:22 EDT 2017 | jamesbarnhart
Electronic devices required higher speed, I/O capability, and density to meet standard requirements. Automated robotic soldering solutions that meet the demands of applications are too challenging for hand soldering. Manual soldering, even with the m
Electronics Forum | Mon Jun 26 08:57:17 EDT 2017 | capse
If N2 is not an option, the cut wire feeder or drilled wire are your best bet for now. You need to optimize wire feed rate as well. The solder joint on the robot takes about the same time to form as in manual soldering. If you need to speed the solde
Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Thu Nov 19 08:20:04 EST 1998 | Earl Moon
| | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave so
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