Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Thu Oct 16 08:41:21 EDT 2008 | davef
We don't associate solder balls with no-clean flux and humidity. For solder balls with no-clean flux, we'd rather have you thinking about: * Paste selection * Aperature size * Paste print process * Reflow recipe
Electronics Forum | Mon Mar 16 01:57:54 EDT 2009 | ivalerio
Hi Guys Could you give me the standard criteria that is being followed for solder ball in PCBA. I am aware that we have an IPC standard but still that is generic in nature. I need a one that is applicable for automotive industry.
Electronics Forum | Fri Apr 29 14:24:25 EDT 2011 | ppcbs
I am looking for immediate stock of a high temp lead free solder ball. 0.60 mm dia. and an Alloy of 95.5% Sn 4.0% Ag 0.5% Cu Any suggestions.
Electronics Forum | Tue May 14 22:19:53 EDT 2013 | ultimatejoker
Hi, anyone know how the oxidation of SAC Solder Ball behave? How does the amount of Ag and Cu content affect the formation of oxide layer? Thank you
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
Electronics Forum | Fri Jun 07 11:08:34 EDT 2019 | gregoryyork
OK good if you get really close to the two small solder balls trapped in that greasy waxy residue and carefully turn the balls over you should see that they are flat on the side stuck to the solder resist.
Electronics Forum | Mon Nov 18 04:04:43 EST 2019 | ramesh_10377
hi initially, as per PCB design and gerber file of PCB we got 5 mil stencil, during process observed lot of solder balls (70-80%), then we decided to go for 4 mil stencil with c-cut. now the problem is reduced and still solderball exists which is a
Electronics Forum | Tue Apr 27 18:43:29 EDT 2021 | reem1993
Hi, I encounter the phenomenon of Solder Ball on pads after printing useing DEK, is someone encounter the same problem? How may i fix it? best regards,
Electronics Forum | Tue Oct 11 09:30:17 EDT 2011 | davef
UL746 Standard for Polymeric Materials is used for testing plastic enclosures used in electronic assemblies. Look here http://www.ul.com/global/eng/pages/corporate/contactus/faq/industries/plastics/ We're unaware of UL involvement in solder. Bare b
