Electronics Forum | Wed Jun 13 03:37:06 EDT 2001 | ianchan
Hi mates, I did a recent shear test (destructive test), on a uBGA liken product, and noted the post-shear solder joint, had clean "smooth" visual appearance under the uBGA pad, however the matching pcb pad was clearly lifted clean. Question: 1) how
Electronics Forum | Fri Apr 26 12:35:05 EDT 2002 | blnorman
Sounds like the mask wasn't properly cured. What kind of solder mask is it? We use a photoimageable mask on our boards. The secondary cure is ~ 90 minutes @ 150�C. One of the cured mask tests is solder bath resistance where it has to resist degra
Electronics Forum | Tue Dec 07 17:38:50 EST 2004 | davef
ANSI/J-STD-003 - Solderability Tests for Printed Boards is widely accepted. That's it, that's the list. If you email us your email address, we'll give you someone to call. Without knowing the number of boards that you plan to run across your wave,
Electronics Forum | Thu Mar 31 19:41:36 EST 2005 | Dreamsniper
Can anyone guide me to what test do I need to be able to identify the strength of my fine pitch component solder joint? What value is available that I can use as a reference? Say 1.5 kg, 2.0 kg, 2.5 kg etc. I would like to have my fine pitch compone
Electronics Forum | Tue Apr 12 12:08:06 EDT 2005 | Dave G
I use the solder sample pcb that comes w/ each batch of boards. We ask our pcb vendor to send 1 pcb for solder testing w/ each batch. This is usually a pcb that is completely done it just didn't pass electrical test @ the final stage. I kill two bird
Electronics Forum | Fri Oct 29 11:23:51 EDT 2010 | pfloh
Just for your reference. If you need to check for surface contamination, then we shall go for microscope inspection at different modes. But this will not reflect on actual PCB performance. Solderability test will still a good option if PCBA is expe
Electronics Forum | Thu Apr 10 09:28:14 EDT 2003 | chrissieneale
Thanks for your replies guys, there's some good info there. Dave, answers to your questions: The stencil was initially a big problem as with the Egineering Model's (EM's) and Engineering Qualifing model (EQM's) we kept getting short circuits due to
Electronics Forum | Thu Oct 15 14:33:37 EDT 1998 | Earl Moon
| | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | Q: Can you get away with spending
Electronics Forum | Thu Oct 15 17:20:25 EDT 1998 | Justin Medernach
| | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | Q: Can you get away with sp
Electronics Forum | Thu Oct 26 07:24:01 EDT 2000 | gdandrea
PLEASE COULD YOU TELL ME IF THERE IS A WAY TO AVALUATE CORE FLUXED WIRES IN TERMS OF WETTABILITY/SOLDERABILITY (SOMETHING LIKE MENISCOGRAPH TEST) .I NEED A LAB TEST ALSO ONLY TO COMPARE DIFFERENT WIRES.... REALLY THANK YOU
