Electronics Forum: solder ball test (Page 171 of 418)

Re: Skewing chip components

Electronics Forum | Fri Jun 23 11:49:29 EDT 2000 | Big H

Is it just like that "smart" golf ball - where you tell it, "stop!!! stop!!!" ....or "go further!" go further! So this smart solder, you can tell it "don't skip!! don't skew!!"

Home plate or bow tie?

Electronics Forum | Sat May 27 11:13:27 EDT 2000 | Steve Thomas

Subject line pretty much says it all. We're going to try some stencil design changes to reduce midship solder balls. Anyone have some comments on pros or cons for either?

Re: Fluxes

Electronics Forum | Wed Mar 22 18:28:39 EST 2000 | Russ

I agree with Steve, Ultra Sonic fluxing with positive displacement instead of air pressure is key (at least in my experience). You might want to try the NR330 instead. It seems to give less solder balls and fills holes very well. Russ

Controlling Solder Ball Contamination

Electronics Forum | Mon Feb 19 13:21:01 EST 2001 | billschreiber

Thank you for giving me an easy one. Cleaning populated PCBs in a stencil cleaner can be a nightmare! Please see my response to the question by MartyS on "Fine-pitch Apertures". If this doesn't answer your question, let me know.

Controlling Solder Ball Contamination

Electronics Forum | Wed Feb 21 09:55:45 EST 2001 | ramigary

Hi! We are a low production contract manufacturer company, We have few stencils and low productions, but we have a lot of problems with misprintered pcbs, my question is �is there some machine to clean only pcbs?� Excuse my english.. Ram�n I

Screen printing

Electronics Forum | Wed Jun 21 17:45:32 EDT 2000 | dmunro

My Process Eng. left the Co. and I'm left with a screen printer not set up,profiles are perfect, PNP is fantastic, solder ball city! Please HELP Disgrunteld Tec.

Solder joint srength

Electronics Forum | Mon Jun 18 13:33:46 EDT 2001 | nifhail

Thanx Dave. What about the ball park figure for 20 & 16 mil pitch pull strength. Appreciate your input and thank you in advance.

Re: BGA voids

Electronics Forum | Wed Feb 09 06:35:18 EST 2000 | Mark Williams

Hi We use 2 criteria... maximum void size is 10% of the solderable surface and a maximum area of voids of 10% of the maximum cross-sectional area of the ball. Any views Mark

Re: Contamination causing shorts.

Electronics Forum | Wed Sep 29 07:52:41 EDT 1999 | Brian

| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | Sorry, forgot one in my previous message: solder balls :-) Brian

rework of bgas and csps

Electronics Forum | Fri Mar 26 19:32:05 EST 1999 | Martin Dunning

I am a student doing a project on rework os BGAS and CSPS and Im looking for information on it especially rework of csps Has anyone got x-ray images of csps after rework or of BGAS to show csps with solder balls Appreciate any help Urgent!!!!


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