solder ball test

"solder ball test" search results in the Electronics Forums



4066 results found for "solder ball test" in the Electronics Forums

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soldermask color change around vias

Jun 7, 2019 | OK good if you get really close to the two small solder balls trapped in that greasy waxy residue an

CSP assembly compliance to IPC-A-610 minimum electrical clearance

Sep 12, 2018 | Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder

Poor Wetting On The BGA.

Oct 20, 2016 |

Poor Wetting On The BGA.

Oct 19, 2016 | Hi All, Currently im seeing a cold solder/ poor wetting underneath the BGA Ball as i shown in the

SMT Reflow temp

Feb 25, 2015 | Hi Bartel , 1.1 Profile Solution to Cold Soldering Cause for Cold soldering The peak temp of refl

paste quality

Feb 10, 2014 | It is sort of a self answering question if you come in from the solder paste angle. First....st

BGA REWORK ISSUE

Jul 3, 2013 | My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluatio

BGA Reflow

Jun 13, 2011 | Had you check the temperature difference of outer balls and inner balls? Solder short in corners mig

BGA Corner

Jun 10, 2011 |

BGA Reflow

Jun 9, 2011 | You might want to check the components as well, I've seen a similar problem with re-balled parts usi

BGA

May 19, 2010 | HI Im new to this but i thought i would have a go at fixing my xbox 360 be re balling it,ive man

BGA post SMT reflow?

Aug 14, 2009 |

BGA post SMT reflow?

Aug 13, 2009 | I'm new to all this... we have a board with one BGA blue tooth device. one test for the board is

Humidity question

Oct 16, 2008 | We don't associate solder balls with no-clean flux and humidity. For solder balls with no-clean flux

Lead Free De-Wetting...

Apr 25, 2008 |

High Power Reliability

Aug 15, 2007 |

BGA dropping off underside of board

Aug 13, 2007 | Would I be correct in assuming that the solder used to attach the BGA ball to the device body should

High Power Reliability

Aug 6, 2007 | Anyone of you tested your boards in high power reliability test? I am just wondering whether there i

Homeplate design

Jul 25, 2007 | Hi Lloyd, Homeplates will get rid of solder balling. They are only recommended "backwards" for 0

Reflow Profile Design

Jun 19, 2007 | Hi folks. If the solder is on the BGA but is not soldered at all on the pads, then you can discard

Head in Pillow effect BGA

Apr 13, 2007 | All, I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure

ICT bare board

Mar 12, 2007 | Q1.� is it mondatory to test all components and paths in the PCBA; and check all soldering joints?

Lead free rework of BGA

Jan 17, 2007 |

BGA adapter boad?

Jan 5, 2007 |

Copper migration

Dec 6, 2006 |

Local Fiducials

Oct 20, 2006 | mid chip solder balls we had that trouble for awhile we went from a 8 mil thick stencil to 6 mil st

BGA Repair Medium

Aug 25, 2006 |

BGA Reflow Issue

Apr 19, 2006 | So, your solder ball didn't collapse. What is the ball material? More and more BGA are shipped lea

BGA pad size

Jun 18, 2005 | kenscj: Responding to your points of interest: * On the smoothness of BGA solder balls causing sol

Plating Integrity

Jun 16, 2005 | Chris As you imply, testing board and component solderability prior to assembly is preferred. *

Bga question??

Jun 12, 2005 |

CCGA

Apr 3, 2005 | In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and col

pb free component leads

Feb 17, 2005 | Have you tried doing solder dip test on these components? Or a Leaching Test, to see if the solder c

Pasteproblemater aftersoldering

Feb 7, 2005 | This paste does tend to solder ball - but short of changing paste you can change your stencil to acc

Un-Reflowed Paste

Jul 28, 2004 | Both temperature and humidity can cause solder paste to behave in a way to cause these formations.

Un-Reflowed Paste

Jul 26, 2004 | How do you know that those specks of solder have not been reflowed? Could it be that what you are s

BGA, stress on the PCB

Apr 16, 2004 | We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found t

PCB equipment

Conformal Coating Machine under 40000