solder ball test

"solder ball test" search results in the Electronics Forums

4066 results found for "solder ball test" in the Electronics Forums

Order by: Relevancy |   Date

soldermask color change around vias

Jun 7, 2019 | Unfortunately for me, I can't say whether those balls were flat on 1 side or not -- sent this board

Poor Wetting On The BGA.

Sep 16, 2017 | An assembly with this improperly solder joints will have functional issues. We have encountered this

Flux wave on PCBs

Mar 11, 2015 | Hi its undercured solder resist which leaves a clear waxy/oily residue and can be seen as brown tar/

PIHR... what do you think...?

Jun 10, 2014 | this is a Class II product. If I increase the openings... will I have random solder balls?

Incomplete reflow

Apr 5, 2014 | The middle picture shows what looks to be solder balls littered across the surface. Turn-up the heat


Jul 8, 2013 | The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via.

BGA pad size too large??

Sep 7, 2011 |


Jan 27, 2011 |


Jan 10, 2011 | Hi Ripal it seems that you have problem with compatibility of alloy and quality of solder balls.

Reflow problem

Sep 14, 2010 | There is problem with the alignment of BGA Balls. Check for any vibration.

BGA Voids

May 19, 2010 | Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like

detecting BGA micro cracks

Feb 8, 2010 | Woody: Consider using test BGA with no chip in, but daisy chains that you can monitor. After solderi

defects in pcb manufacturing

Oct 30, 2009 | Hi, I see a huge solder mask shift on chip comp pads. This would result in mid-chip solder balls or

BGA voids

Apr 27, 2009 | Remember that the 25% is a reduction in cross sectional area. A void in the middle of the ball that

Land Grid Array (LGA) Rework

Sep 11, 2008 | Depending on the assembly, I have applied balls on LGA's and reflowed them on using the rework hot a

Component Pin 1 marking

Mar 4, 2008 | Available on the web, JEDEC PUBLICATION 95, DESIGN GUIDE 4.14, Ball Grid Array Package (BGA), Figure

BGA Voids

Feb 12, 2008 | Thanks for the spare change. Questions are good and I did miss one item. Process has 100% solder p


Sep 6, 2007 | Can voids be carried over from original voids in solder balls during reflow?

Reflow Profile Design

Jun 15, 2007 |

To use a mini stencil, or not to use a mini stencil.

Mar 29, 2007 | We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using

BGA opens

Jan 28, 2007 |

BGA opens / cracks

Jan 24, 2007 |

LGA and Solderballs

Nov 28, 2006 | J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has gi

Cleaning Paste from 2nd Side Print

Oct 31, 2006 | We never run raw solder paste through our board cleaner, because: * Flux floats on the water in the

MELF's falling off

Oct 18, 2006 | Have you tested the solderability of the inbound components per ANSI/J-STD-002, Solderability Tests


Jul 29, 2006 | Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board


Feb 1, 2006 | Hi, What's the difference between soldering a lead free solder ball BGA onto a footprint with lea

BGA rework using Tacky Flux

Jan 16, 2006 | Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding o

BGA rework using Tacky Flux

Jan 16, 2006 | I can't see why it would be any different, You are melting the balls into reflow to the pad. In my

gold wire bonding

Dec 28, 2005 | I have lots of experience with thermosonic gold ball bonding. You can read the literature and you w


Dec 11, 2005 | Hi, As far as I know soldering a lead free BGA in a lead process is similar to soldering down som

Reflow Profile

Aug 22, 2005 | There's a lot of sources of solder balls. Search the fine SMTnet Archives for previous discussions.

Reflow Profile

Aug 22, 2005 | Sample Profile to avoid solder balls.

Rework units with parylene coating

Jun 8, 2005 | You will have to machine the part off down to the top of the balls. Wick solder off from individual

Non-wetting: PTH on double-side reflow

Apr 6, 2005 | Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? Thi

Does this forum covers BGA's

Feb 18, 2005 | Lead Free Ball Grid Array packages are expected to be increasing the shipment numbers by 2006. How m

pb free component leads

Feb 16, 2005 | Greg: As we understand it, in your situation: * One 0805 lead solders to board properly * Another

Pasteproblemater aftersoldering

Feb 7, 2005 | Search the fine SMTnet Archives for previous discussions on the issues driving solder balling.

Pasteproblemater aftersoldering

Feb 7, 2005 | Reducing the Printing Speed helps to reduce solder balls. Try it.

RC Filter

Aug 5, 2004 | We're using a RC filter network that we're having solderability problems with. There are 4 RC pairs


May 12, 2004 | You say you have lots of problems with a BGA, tell us about: * Specific problems you see. * Solder

osp finish

Jan 21, 2004 | Hi, Are you testing bare boards or soldered boards. Are the test probes in contact with soldered

On-board Dispensing of Dots & Lines

Manufacturing Software