Order by: Relevancy | Date
Jun 7, 2019 | Unfortunately for me, I can't say whether those balls were flat on 1 side or not -- sent this board
Sep 16, 2017 | An assembly with this improperly solder joints will have functional issues. We have encountered this
Mar 11, 2015 | Hi its undercured solder resist which leaves a clear waxy/oily residue and can be seen as brown tar/
Jun 10, 2014 | this is a Class II product. If I increase the openings... will I have random solder balls?
May 23, 2014 |
Apr 5, 2014 | The middle picture shows what looks to be solder balls littered across the surface. Turn-up the heat
Jul 8, 2013 | The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via.
Sep 7, 2011 |
Jan 27, 2011 |
Jan 10, 2011 | Hi Ripal it seems that you have problem with compatibility of alloy and quality of solder balls.
Sep 14, 2010 | There is problem with the alignment of BGA Balls. Check for any vibration. http://hubpages.com/hub/S
May 19, 2010 | Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like
Feb 8, 2010 | Woody: Consider using test BGA with no chip in, but daisy chains that you can monitor. After solderi
Oct 30, 2009 | Hi, I see a huge solder mask shift on chip comp pads. This would result in mid-chip solder balls or
Jul 2, 2009 |
Apr 27, 2009 | Remember that the 25% is a reduction in cross sectional area. A void in the middle of the ball that
Sep 11, 2008 | Depending on the assembly, I have applied balls on LGA's and reflowed them on using the rework hot a
Mar 4, 2008 | Available on the web, JEDEC PUBLICATION 95, DESIGN GUIDE 4.14, Ball Grid Array Package (BGA), Figure
Feb 12, 2008 | Thanks for the spare change. Questions are good and I did miss one item. Process has 100% solder p
Jan 23, 2008 |
Dec 4, 2007 |
Sep 6, 2007 | Can voids be carried over from original voids in solder balls during reflow?
Jun 15, 2007 |
Mar 29, 2007 | We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using
Jan 28, 2007 |
Jan 24, 2007 |
Nov 28, 2006 | J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has gi
Oct 31, 2006 | We never run raw solder paste through our board cleaner, because: * Flux floats on the water in the
Oct 18, 2006 | Have you tested the solderability of the inbound components per ANSI/J-STD-002, Solderability Tests
Jul 29, 2006 | Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board
Feb 1, 2006 | Hi, What's the difference between soldering a lead free solder ball BGA onto a footprint with lea
Jan 16, 2006 | Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding o
Jan 16, 2006 | I can't see why it would be any different, You are melting the balls into reflow to the pad. In my
Dec 28, 2005 | I have lots of experience with thermosonic gold ball bonding. You can read the literature and you w
Dec 11, 2005 | Hi, As far as I know soldering a lead free BGA in a lead process is similar to soldering down som
Aug 22, 2005 | There's a lot of sources of solder balls. Search the fine SMTnet Archives for previous discussions.
Aug 22, 2005 | Sample Profile to avoid solder balls.
Jun 8, 2005 | You will have to machine the part off down to the top of the balls. Wick solder off from individual
Apr 6, 2005 | Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? Thi
Feb 18, 2005 | Lead Free Ball Grid Array packages are expected to be increasing the shipment numbers by 2006. How m
Feb 16, 2005 | Greg: As we understand it, in your situation: * One 0805 lead solders to board properly * Another
Feb 7, 2005 | Search the fine SMTnet Archives for previous discussions on the issues driving solder balling.
Feb 7, 2005 | Reducing the Printing Speed helps to reduce solder balls. Try it.
Feb 6, 2005 |
Dec 15, 2004 |
Oct 20, 2004 |
Aug 5, 2004 | We're using a RC filter network that we're having solderability problems with. There are 4 RC pairs
Jun 16, 2004 |
May 12, 2004 | You say you have lots of problems with a BGA, tell us about: * Specific problems you see. * Solder
Jan 21, 2004 | Hi, Are you testing bare boards or soldered boards. Are the test probes in contact with soldered