solder ball test

"solder ball test" search results in the Electronics Forums

4071 results found for "solder ball test" in the Electronics Forums

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soldermask color change around vias

Jun 7, 2019 | The Single Solder ball stuck to the mask may indicate undercured as well. The issue is not so much t

Regarding BGA Pad Lifting

Mar 1, 2017 | Hi! I am Bob and pls forgive me if technical words I use are wrong. What may cause the BGA solder pa

Melted BGA part

Sep 15, 2016 |

pad cratering

Jul 1, 2015 |

LGA Rework

Mar 19, 2015 | We remove the LGA, clean the pads, "re-ball" the LGA by solder-printing it, reflow and re-install it

PIHR... what do you think...?

Jun 12, 2014 | No, is will not create random solder balls. I have experience doing this(When we had a big via in mi

0603 LED Tilt

May 27, 2013 |

Use of Stored PCB

Mar 23, 2012 | J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > s


Jan 7, 2011 | Consider measuring the temperature of the BGA solder balls during reflow. This will give you a more

defects in pcb manufacturing

Nov 3, 2009 | Has anyone ever done a tape test to see if the solder resist pulls away from the PCB? Is this an ac

BGA failure after coating

Oct 5, 2009 | we suggest as below : the first : check the soldering(solder ball and pad) by X-ray ; second: to d

Ecofree 303 conductive and corrosive?

Aug 24, 2009 | Hallo Joanne, I had employed by producer of Ecofrec 303. We make many tests of corrosion and conduct

X5R dielectric aging

Jun 1, 2009 | Reflow soldering de-ages the capacitors. Two things may be affecting your testing. * Capacitance

BGA dropping off underside of board

Aug 13, 2007 | The solder used to attach the BGA ball to the BGA interposer would have a liquidous point dependent

Reflow issue with QFN

Jul 6, 2007 | Solderability testing and if possible, measure the plating thickness (XRF).

Reflow issue with QFN

Jul 5, 2007 | ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires

Lead-Free BGA Rework

Jun 26, 2007 |


Jun 20, 2007 |

3D xray

May 30, 2007 | Pretty much everybody does functional or system test at the end of a printed board assembly line. I



Component Peel Strenght

Oct 12, 2006 | This type of testing is only done to verify your reflow process. It is destructive testing and shou

Oop's Pb BGA's in a RoHS process?

Jun 21, 2006 | Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher he

Water Soluble vs. No Clean

May 3, 2006 | All good points by Pee Wee Herman; your solder balling may appear if you don't currently have stenci

Apr 14, 2006 | As from previous discussions on this topic here on SMTnet, we are perfectly comfotable using leadfre

Gold Flash with QFN28 problem

Mar 30, 2006 | So you have solder balls at the outer edge of the part right where the pad goes underneath? If so y

Stencil thickness

Mar 2, 2006 | Dis agree?!?!?! We solder plenty of them o6o3s at honda and they l00k 0k! Solder balls will always

Heat guns and component damage

Feb 1, 2006 | Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found

How to avoid tombstoning in 0201 components

Jul 5, 2005 | So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joi

SMT Line set-up - bare board??

Apr 12, 2005 | I use the solder sample pcb that comes w/ each batch of boards. We ask our pcb vendor to send 1 pcb

pb free component leads

Feb 16, 2005 | Thank you for respond. Could you describe me how to make solderability tests please? Greg

BGA Via Tenting

Jan 21, 2005 |

Conformal Coating BGA's

Jan 13, 2005 | We agree that coating BGA solder balls with conformal coat is a bad idea due to differences between

SMT adhesive printing

Dec 15, 2004 | yes,it maybe lead to test failure,because solder joint is bad

Questions about SMT Process Control

Aug 13, 2004 | Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Termin

About testability of OSP board

May 2, 2004 | I'd thought that the solder on test pad can benefit our ICT,but in fact,the residue issue arised.I'd

No Lead BGA Hot Gas Rework

Apr 13, 2004 | I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviou

Batch Cleaners

Oct 17, 2003 | we will be using water soluble solder paste. cleaning will be for smt assemblies only. waste water

Relfow ?

Jun 19, 2003 |

Large PCB Dispensing System

Selective Conformal Coating System