solder ball test

"solder ball test" search results in the Electronics Forums



4066 results found for "solder ball test" in the Electronics Forums

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Temperature Profile for 0.2mm Thick ENIG Flex PCB

Jan 31, 2020 | Thanks for your response, attaching the solder profile for your verification. The part NXP Make PCA2

Component Skew during Reflow Process

Aug 1, 2019 | Looks like you have too much solder, looks like is balling out of the side of your pads.

Ceramic PCB Challenge

Jul 18, 2018 |

Regarding BGA Pad Lifting

Mar 1, 2017 | Hi! I am Bob and pls forgive me if technical words I use are wrong. What may cause the BGA solder pa

PCB pads corrosion

Dec 15, 2015 | Peculiar that ENIG boards are corroded, not that it can't happen. * J-STD-002, Solderability Tests

BGA

Dec 22, 2014 |

BGA drop off from the boards

May 23, 2014 | Hi Evtimov. 1. yes both part and the process are lead free/RoHS 2. I ever did X-ray, the balls sha

Nickel Silver Reflow process

Feb 15, 2013 | Use a standard that everyone will recognize. If you say, "The solderability test was performed in ac

BGA REFLOW

Feb 1, 2011 |

BGA REFLOW

Jan 7, 2011 | Consider measuring the temperature of the BGA solder balls during reflow. This will give you a more

BGA opens

Nov 10, 2009 |

Stencil Cutters

Nov 20, 2008 | Don't forget the value of being able to blame everything from bridging, solder balls,tombstoneing ,

Humidity question

Oct 16, 2008 | "We don't associate solder balls with no-clean flux and humidity." I'll let the former speak for

BGA thermal reflowing issue

Sep 26, 2008 | Can anyone take a look on the cross sectional diagram of this reflowed BGA ball? Any idea on what ha

BGAs not reflowing??

Nov 6, 2007 | Hi All, We are using BGAs from a new supplier, and the BGA solder balls are not collpasing proper

Void

Sep 17, 2007 | We have never studied this, but here's what we'd guess. If there are void in BGA solder balls at inb

Homeplate design

Jul 25, 2007 |

Reflow issue with QFN

Jul 6, 2007 | Solderability testing and if possible, measure the plating thickness (XRF).

Reflow issue with QFN

Jul 5, 2007 | ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires

Opportunity

Jun 20, 2007 |

double printing

Mar 21, 2007 |

Local Fiducials

Oct 20, 2006 |

Cracking

Sep 7, 2006 | Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has c

Ag/Pd Component Finish

Jun 29, 2006 | Hi Slaine, The terminations are still present on the component but all the solder (including the

SMT component life spend.

Jun 21, 2006 | Are you worried the terminations might b oxidized? Do a dip test. If you have a solder pot careful

BGA Reflow Issue

Apr 19, 2006 |

Gold Flash with QFN28 problem

Mar 30, 2006 | So you have solder balls at the outer edge of the part right where the pad goes underneath? If so y

Voids

Mar 1, 2006 | we are observing voids in solder ball bonding process using laser.Final metal finish is of Au on Cu.

Heat guns and component damage

Feb 1, 2006 | Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found

Wave Pallets

Jan 24, 2006 |

How to prevent Bluetooth Module BGA short anybody?

Nov 23, 2005 | Shorted to the sheild or the BGA balls are shorted? Sheilds move a lot during reflow. If this is t

Lead Free Stencil Design

Jul 13, 2005 | Are you seeing solder balling on your discretes when you print 1:1? Are you washing your boards?

How to avoid tombstoning in 0201 components

Jul 5, 2005 | So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joi

Maximum Overprint

Jun 28, 2005 | Fabricators take different approaches in developing paste that is more or less prone to solder balli

Type of NEXLEV Connector

Apr 23, 2005 |

SMT Line set-up - bare board??

Apr 12, 2005 | I use the solder sample pcb that comes w/ each batch of boards. We ask our pcb vendor to send 1 pcb

Non-wetting: PTH on double-side reflow

Apr 6, 2005 | It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did

QFN Packages

Feb 25, 2005 |

pb free component leads

Feb 16, 2005 | Thank you for respond. Could you describe me how to make solderability tests please? Greg

Pasteproblemater aftersoldering

Feb 8, 2005 | we have even tried with 6mil stencil even than we are getting the solder ball thanks for your sugges

BGA Via Tenting

Jan 21, 2005 |

SMT adhesive printing

Dec 15, 2004 | yes,it maybe lead to test failure,because solder joint is bad

Open BGA joint

Sep 15, 2004 | if opens in same aria check for mask to via coverage for that pad. We had vias pulling solder from p

Panasonic CM402, CM602, DT401

SMT Spare Parts and Feeders