solder ball test

"solder ball test" search results in the Electronics Forums



4071 results found for "solder ball test" in the Electronics Forums

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Flason SMT Products

Oct 3, 2018 |

When to use gloves

Aug 14, 2017 | We run a "no clean" soldering process, class II primarily, conformal coating using a Humiseal acryli

Nickel Silver Reflow process

Mar 1, 2013 | Solder paste flux formulation can make a difference when soldering to nickel silver...due to the all

Use of Stored PCB

Mar 19, 2012 | J-STD-003B prescribes test methods, defect definitions and illustrations for assessing the solderabi

Sn100C Plating, Mixed Alloy Scenario

Dec 13, 2011 | There should not be a problem we have done this. If you are concerned send out a test board to be an

PASTE DRYING OUT ON STENCIL

Feb 10, 2011 | Some solder paste formulations can be frozen with no effect. Other formulations ... not so much.

SAC BGA in Pb Process

Mar 29, 2010 | SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale p

Motherboard become NO POST when humidity increase to 90%

Nov 20, 2009 | One of our instruments has a high impedance front-end. We: * Passed functional test in the environm

defects in pcb manufacturing

Nov 3, 2009 | Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (

Importance of Exposed Pad In ST QFP for Set top box product

Oct 1, 2009 | First, the reflow thermal recipe provided by your paste supplier is only a ball park guess. Beyond t

Lead Free finish

Oct 29, 2008 | During soldering, the gold dissolves into the solder connection. You solder to the nickel. The gold

Pogo Contamination

Aug 13, 2008 |

solving tombstone

Aug 1, 2008 |

Lead Free De-Wetting...

Apr 28, 2008 | Here's a crude wettability test. Take a PCB - both types of finish - print them, and reflow with

no-clean flux vs. impedance

Feb 18, 2008 | If the hand soldering is done right and you use little to no extra flux (other than whats in the sol

BGA Voids

Feb 12, 2008 |

Axial capacitor Pull out force

Aug 21, 2007 | There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC d

high power operation

Aug 6, 2007 | Hi Is there any standard or requirement to test the solder under high power operation? For example,

Reflow issue with QFN

Jul 5, 2007 | QFN assembled on a PCB indicates paramteric fails when tested. When the QFN on PCB is reflowed a sec

3D xray

May 31, 2007 |

ICT bare board

Mar 12, 2007 |

Books for SMT

Jan 16, 2007 | DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein Wassin

PBGA open connection

Oct 3, 2006 | We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diag

Justification on buying machine (Reflow/Wave)

Jun 19, 2006 | Because some lead free solders are very corrosive to anything but titanium. Also "clean it very wel

Lead Free Dross

Feb 14, 2006 | Rick, You are correct, it does need the solder dross in the pot to mirgate (pool) to an area. Some m

SN100C: High Temp

Jan 20, 2006 | adlsmt, Solder pot temp is set to 265C. About solder joint quality, you must take in consideration

SMD acceptable criteria

Dec 9, 2005 | thanks for info Most of the defect soldering joint do not take place. Observe that PCB not cleaned

cleaning of no clean flux

Aug 10, 2005 | we are using heareous F381, F352 no clean solder paste. specially in qfp for high frequency board

Repeated reflows

Aug 26, 2004 | We do perform multiple reflow only for reliability testing. 90% of the time we have not seen any ch

Can I use lead free BGA parts in a lead based process?

Jun 13, 2004 | Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our

PCB & Ceramic Cap strain - Specification?

May 10, 2004 | There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, be

About testability of OSP board

Apr 30, 2004 | Hello all, these days I've met an OSP board testability issue. 1.OSP board 2.Solder paste:Kester

Indium NC-SMQ92J paste problems

Apr 27, 2004 | We have switched over form Indium's nc-smq92 to > nc-smq92j and are experiencing a ton of solder

Crystallised Joints

Apr 26, 2004 | We see this sometimes but I have found it to happen based on how fast the solder is cooled back into

Voiding in board to BGA joints

Mar 9, 2004 | Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale C

Voiding in board to BGA joints

Mar 6, 2004 | 1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4

reballing

Jan 22, 2004 |

PCBA shelf life

Jan 5, 2004 |

lead-free mixed technolgy

Nov 7, 2003 | From my understanding (and I am not a metalurgist)Most Lead free solders can be intercahngeable.The

Porosity in Good Plating

Jul 15, 2003 |

Porosity in Good Plating

Jul 9, 2003 | When we try another test by using less solder paste, we found under the microscope that the solder w

Small Parts Tips

selective soldering