Electronics Forum: solder ball test (Page 301 of 418)

Re: Capability Study for Solder Printing Process

Electronics Forum | Sat Sep 23 15:13:40 EDT 2000 | Francois Racine

Hi Sophia, I`m responsible of SMT line and we solved this problem with a complete automatic solder paste printer machine. In the past we had problem with off alignment and solder height too.... at that time we used a semi-auto printer machine and w

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Fri Oct 08 16:36:59 EDT 1999 | Dave F

| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7

Hidden Pillow Phenomenon

Electronics Forum | Tue Nov 14 21:27:26 EST 2006 | davef

"Hidden pillow" seems to be a a variant of "pillow effect" or "head in pillow". Pillow effect is an open, with non-wetting between the lead and the solder on the pad. Here the lead sags into the solder without any bonding or wetting. Poor wetting c

Re: Altera PQFP240 Solderability

Electronics Forum | Tue Apr 14 09:38:07 EDT 1998 | Earl Moon

| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X

soldering issues

Electronics Forum | Mon May 06 11:49:20 EDT 2002 | Jacob

Hello all, I am having soldering issues with an Everlight component it is a TM4201/TR2 (Right angle IRDA with a 1mm pitch). The problem I have is that after reflow the solder joints look perfect, but during test we are losing 7 micro amps as soon as

Viscosity Solder Paste for SMT Production

Electronics Forum | Mon Aug 22 10:33:23 EDT 2005 | davef

Q1. What is recommended viscosity standard? A1: There is no standard. ASTM D4040-05 "Standard Test Method for Rheological Properties of Paste Printing and Vehicles by the Falling-Rod Viscometer" is a test method that might work. For more, look her

Re: SRT BGA Rework

Electronics Forum | Fri Dec 18 10:18:55 EST 1998 | Dave F

| I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it doe

Re: Reflow Oven Capability Study

Electronics Forum | Sat Jul 10 02:47:27 EDT 1999 | Scott

| | | Hi! | | | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board

Re: Where's Earl Moon ?

Electronics Forum | Tue May 09 22:39:55 EDT 2000 | Dave F

Hi Earl ... You movin' to Montana soon? Gonna be a dental floss tycoon, eh? The adverts don't bug me near as much as the weekly "Duh, I've got (you choose): * Solder balls * Tomb stoned caps * Poor soldering with my NC flux ... question from the m

Solder Paste Volume

Electronics Forum | Fri Apr 06 08:35:20 EDT 2001 | brownsj

You can buy plenty of paste height measuring systems today, ranging from full 3D laser systems to systems using an oblique light line which will measure the paste height only. I found that the lowest cost option was to attach a DTI to the focus contr


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