solder ball test

"solder ball test" search results in the Electronics Forums



4071 results found for "solder ball test" in the Electronics Forums

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Reflow with lead-free 96.5 /3/0.5 No-Clean T4 brown-orange burn color on parts

Dec 26, 2019 | Doesn't really look like no-clean to me...typically, no-clean encapsulates the solder joint after re

Soder Paste Shelf life extension

Feb 23, 2011 | Does someone with technical knowledge knows what exactly happend with the solder paste after the she

BGA Placement Process

Mar 27, 2010 |

gpu removal

Sep 16, 2009 |

lead free joint finish

Jan 28, 2009 |

Vapor (vapour) Phase?

Jun 18, 2008 |

Lead Free Dross

Feb 13, 2006 |

Silver finish components

Dec 19, 2005 |

Leadfree Trials

Sep 7, 2005 | were looking at paste, wire, preforms and solder bars (for solder pots), concentraiting on HMP, sn62

How to avoid tombstoning in 0201 components

Jul 29, 2005 | In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder join

BGA pad size

Jun 14, 2005 |

Stencil Thickness

Dec 15, 2004 |

BGA Inspection Equipment

Jul 19, 2004 |

Ni/Sn plated parts

Jun 16, 2004 | I ran some test samples with a water soluble past (Amatech ws488). I also tried hand soldering using

inspection system

Apr 15, 2003 |

BGA attach eval.

Apr 1, 2003 |

Inline Washers

Feb 27, 2003 |

type 3 vs type 4 paste

Nov 7, 2002 |

Via in Pad

Sep 13, 2002 |

Non-wettig on chip cap.

Dec 10, 2001 |

Agilent 5DX

Jul 31, 2001 |

Low cost BGA inspection?

Jun 30, 2001 |

No-Clean or water

Jun 11, 2001 |

Info on OSP PCB�s

Jun 5, 2001 |

Trouble reworking Xilinx 4044XL BGA chip

Jan 29, 2001 | The solder ball collapse is associated with overheating. Of coarse there's no problem taking it off,

LGA Stencil Spec

Aug 5, 2000 |

Skewing chip components

Jun 22, 2000 |

Rambuss

May 22, 2000 |

Cleaning No-Clean Paste??

Feb 25, 2000 |

best reflow oven

selective soldering