Electronics Forum: solder ball test (Page 351 of 418)

Re: Liquid, Dispensable Solder Mask

Electronics Forum | Tue Mar 21 20:33:09 EST 2000 | Dave F

Shane: We don�t dispense, but we have thought about it. Several points about peelable solder masks in a no-clean (low residue) process: � Beware of latex peelable solder mask with a low res process without extensive testing. The problem is usuall

Re: Non soldered leads on ic's

Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach

| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o

Re: Floating 144-pin QFPs

Electronics Forum | Fri Nov 13 09:55:08 EST 1998 | Chrys

| We are experiencing 'lifting' on one or more sides of a QFP. Poor lead co-planarity has been ruled out by independent tests. Please tell me which of the two remaining failure modes is the most probrable? | | 1. Expansion of gases in vias underneat

Re: Floating 144-pin QFPs

Electronics Forum | Thu Nov 19 05:25:07 EST 1998 | karlin

| | We are experiencing 'lifting' on one or more sides of a QFP. Poor lead co-planarity has been ruled out by independent tests. Please tell me which of the two remaining failure modes is the most probrable? | | | | 1. Expansion of gases in vias und

Re: Solder paste print with two thicknesses

Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger

| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema

Re: Solder paste print with two thicknesses

Electronics Forum | Thu Oct 08 22:32:58 EDT 1998 | Dave F

| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re

Excess Flux in uBGA rework

Electronics Forum | Tue Sep 25 12:50:13 EDT 2001 | mparker

Since you are mostly concerned about the flux and suspect an application issue, you need to do a few things to validate whats going on. 1. Forget about speed of processing, length of time to do the job. Focus on accuracy first, then speed. with that

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef

Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via

Gold plated PCB's

Electronics Forum | Sun May 05 22:18:20 EDT 2002 | ianchan

Hi mate, we had a crap experience (once...no more...) with gold plated over nickle (Au/Ni) PCB that had nickle contaminents in the PCB supplier's gold bath. the Ni caused batch-delivery of the PCB to us for mass production, to exhibit the visible s

PCB's for oven profile testing

Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef

Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s


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