Electronics Forum | Mon May 17 02:06:57 EDT 2004 | johnwnz
Look here: _a class=roll > href="http://www.aimsolder.com/techarticles/tech%2 > 0sheet%20BGA%20voiding-%20reducing%20through%20pro > cess%20optimization.pdf" > target="_blank"_http://www.aimsolder.com/techartic > les/tech%20sheet%20BGA%20voidin
Electronics Forum | Fri Apr 08 09:32:09 EDT 2005 | bystrom123
We are using a low end Air vac system to place the BGA's. We have X ray we can use. Our CGA's as well use this system. They are one off parts that are above the 20K a piece range. So I have been tasked with making sure all of these procedures are the
Electronics Forum | Wed Aug 24 10:07:56 EDT 2005 | stepheniii
I think where the fuzzy thinking starts is by calling the recipe's; profiles. Or maybe I"m being too fussy. Idealy you want every solder joint to have the same thermal "profile" (not recipe). That is the temperature over time is best if identical fo
Electronics Forum | Tue Oct 03 17:04:07 EDT 2006 | cuculi54986@yahoo.com
Glenn, What alloy are you using for Pb-free HASL? You say tin copper nickel, but is it SN100C? Against manufacturing engineering's recommendation, my company specified simply "Pb-free HASL" as the finish for our Pb-free PCBs. One of our suppliers
Electronics Forum | Tue Oct 31 13:15:13 EST 2006 | realchunks
SWAG is prolly right. You can verify the tactile sensor by watching the machine carefully. When finding the stencil height, make sure the board goes all the way up and touches the stencil to trigger the tactile. If it doesn't, then something is wr
Electronics Forum | Sat Mar 24 05:25:07 EDT 2007 | mika
Thanks aj, Ohh I wish that there was a way to post a picture in this forum or a possibility to attach the datasheet... Which BTW does not have any recommendation of "how to". This package does not have the "center thermal pad" like a QFN or MLF pack
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
Electronics Forum | Mon Apr 05 14:25:56 EDT 2010 | krish_bala
Hello Bob, What makes this problem even harder for us is that we are not the manufacturer of this particular board. We are just performing re-works on them based on the issues they come in for, and thus refurbishing the unit. We are currently in th
Electronics Forum | Fri Feb 11 13:02:01 EST 2011 | deanm
Thank you for all who read this with interest and especially those who replied. I have considered the points posted and here is what we came up with: We all agree that double inspection is a wasteful operation especially if the operator is more crit
Electronics Forum | Wed Jun 08 10:57:20 EDT 2011 | pcbrookie
We recently got our last BGA X-Ray results back (no X-ray in house yet) and had more than one board/BGA look like the attached image. The balls on one corner are completely collapsed (so much so that bridges appear) and raised on the opposite corner
