Electronics Forum | Tue Jan 15 14:03:18 EST 2008 | patrickbruneel
Hi �Pb-Head� I agree with everything you say, except for your statement that alcohol based fluxes perform poorly with convection heat. The fluxes you tried might have performed poorly, but that doesn�t mean that all alcohol based fluxes perform poor
Electronics Forum | Tue Oct 28 10:45:22 EST 2003 | Gabriele
After following the suggestions above, and where it would not be possible to mask BGA by soldering fixture, a Kapton tape (pre-punched) can be placed under BGA ( wave solder source side ) it can help to keep temperature low enough avoiding "seconda
Electronics Forum | Tue May 28 09:27:04 EDT 2002 | pjc
Does this PBGA have eutectic balls? If so and the PCB is HASL finish, or has solder on the lands from BGA removal, you may not have to apply solderpaste. Check with you flux supplier to see if they offer a NC "flux paste" product, otherwise I know Mu
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F
Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F
Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b
Electronics Forum | Fri Aug 19 02:05:32 EDT 2011 | ppcbs
We have been developing profiles for BGA process going on 14 years now. We have never had to drill holes or resort to any type of destructive methods for BGA assembly, rework or defect analysis. Depending on requirements, i.e BGA rework or BGA assem
Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen
| We have successfully put .016" vias in .030" pads. | There is no issue with .030" solder balls, since | the actual volume of the .002" via in pad is small | compared to the ball+solder paste volume. | We did notice random bubbles where, apparentl