Electronics Forum | Tue Nov 13 11:22:50 EST 2001 | fmonette
Dave, Hany, I was actually surprised to hear that topside SMT components can reach such a high temperature during wave soldering. If this is the case then the concern for component damage is very valid. This morning I discussed this issue with Jac
Electronics Forum | Fri Apr 23 16:19:17 EDT 1999 | Todd
We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using a
Electronics Forum | Mon Feb 12 11:13:12 EST 2007 | davef
Q1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? A1. It depends on your current oven. Some ovens can meet the higher t
Electronics Forum | Thu Oct 30 21:55:27 EST 2003 | johnwnz
Now I've checked the archives on this and found the starts of an answer but not much else, but then that posting was a while ago and I though there would be some more data now. So here's the question: who, if anyone is placeign Pb-free BGA's (ideally
Electronics Forum | Sat Jun 23 08:29:04 EDT 2001 | davef
Well, at least I don�t feel so bad that we�re not the only ones going anal on this blankin� cap thing. We�re gunna change process on ever effin wave soldered SMT cap!!! I�m going to off myself!!!! And in about 15 seconds, some doodoo brain is goin
Electronics Forum | Thu Jul 09 13:05:46 EDT 1998 | Phil Crane
I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. Thanks for any and all help given
Electronics Forum | Thu Jul 09 13:04:19 EDT 1998 | Phil
I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. Thanks for any and all help given
Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef
1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we
Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain
Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no
Electronics Forum | Thu Apr 03 09:08:50 EST 2003 | rdr
Thanks Scott,Iman, The problem has been isolated to detachment from package so I believe that there are no fabrication issues related to the Gold on the PCB. What is a Moyet analisys? where can I find more info? Dave, I am still waiting on Altera t
