Electronics Forum | Mon Jan 07 20:31:15 EST 2002 | davef
While not a Motorola 860 BGA user, we see that on other components. In fact, some of the ErsaScope adverts show the effect. WHAT CAUSES THIS? Generally, the design / layout of the interposer has been the cause of this appearance. IS THIS A CONCER
Electronics Forum | Wed Feb 01 10:13:39 EST 2006 | kmorris
I haven't seen a hydrometer used in years. Are > you still foam fluxing? There used to be > automatic units available, but with the advent of > the spray fluxer, they may have dried up. If you > are still foam fluxing with alcohol thinner, >
Electronics Forum | Thu Sep 07 08:50:45 EDT 2006 | Grant
Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has cracked off the PCB. It's below the intermetalic layer in the ball. Reflow otherwise looks good, and the raw components are clean. I am wondering what c
Electronics Forum | Wed Jul 25 11:55:21 EDT 2007 | ck_the_flip
Zoinks!! Doing the homeplate design on 0402 will actually make your tombstones WORSE! Think about it. Your wetting forces are now on the ENDS of the device with no solder paste toward the middle of the device to tack the part down - a gauranteed f
Electronics Forum | Thu Nov 27 10:55:51 EST 2008 | muarty
Hi Steve, Are you actually profiling the BGA itself? By that I mean have you, for example, drilled through the underside of the pcb into the balls of the BGA and attached a probe there? You may find that even although the topside components have a p
Electronics Forum | Tue Feb 01 10:11:36 EST 2011 | clampron
good Morning, it looks from the peak temperature that this is a RoHS application? If so, is the BGA that you are having issues with leaded? If so, you might be experiencing "ball drop" where the ball becomes disconnected from the component substrate
Electronics Forum | Mon Oct 05 14:38:03 EDT 2015 | deanm
We are planning on using a chip that is available in LGA or Sn/Pb balled BGA. The package dimensions are the same. Pitch = 1.27mm. We are using a Sn/Pb soldering process and no clean paste (wash afterward) for high reliability Class 3 assemblies. Fai
Electronics Forum | Fri Aug 07 13:30:22 EDT 2020 | emeto
ASM machines have great algorithms for BGA and I am positive it will detect missing ball. Still, on your pictures it seems like you are severely starving solder in the locations shown on X-ray. Part seem too small to bend that much in reflow to form
Electronics Forum | Thu Feb 08 08:28:11 EST 2007 | mzaboogie
Good Morning Everyone, We have an application coming up with several BGA's on a RoHS assembly. One is a 25 mil ball on a 40 mil pitch, another is a 15 mil ball on a 40 mil pitch. In the past for leaded assemblies, we have used square apertures for 1
Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x
Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp
