Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX
Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar
Electronics Forum | Fri Feb 11 08:51:45 EST 2000 | HMAL
Dear Masdi, Perhaps you should check again your screen print process. Small amounts of solder paste under stencil can cause your problems. This paste is from previous printed pcb. When printing next pcb this paste attachs to places that it doesn't
Electronics Forum | Tue Jun 27 11:16:33 EDT 2000 | Christopher Lampron
Hello Bill, Ioan's idea's are good. One more thing that you may want to consider is using a "Home Plate" aperture on your stencil for the aforementioned caps. The idea is to put a smaller amount of solder paste directly underneath the component. This
Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX
Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar
Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef
There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust
Electronics Forum | Thu Jun 19 12:47:47 EDT 2003 | russ
I would believe that the connector spec is for the max temp that it can withstand while the paste is the max temp that you need to achieve. Solder balls are usually from excessive ramp rates in the oven. I would contact the connector mfg. and see wh
Electronics Forum | Sat Jul 31 08:52:15 EDT 2004 | g2garyg2
I am soldering with a softbeam laser and often get a flux/solder build up at the end of the feed tube. Seems better when we use Senju wire but this is very costly. It seems like we have tried everything to resolve this. Would appreciate assistance on
Electronics Forum | Fri Jan 21 19:30:11 EST 2005 | Dreamsniper
Hi T2, The purpose of this is that we want to make our rework robust. Whenever we rework BGA's we have solder getting trapped into those 1 sided tented vias and bet yah...they are hard to desolder! And during BGA resoldering these trapped solder will
Electronics Forum | Wed Feb 01 22:27:16 EST 2006 | KEN
Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found the SMT relay manufacturer used eutectic solder inside their hermetic relay. The SMT relay would fail because the solder balled up on the post, woul
Electronics Forum | Mon Feb 06 15:50:10 EST 2006 | ajaygarg1980
Hi, We are electrodepositing Au(0.25 to 0.5 microns) on Cu & using solder ball bonding process via laser.We are getting lots of voids within the solder (not kirkendall voids). Can anyone shed some light on this problem.We are not using any flux.Pre
