Electronics Forum | Wed Feb 28 10:00:46 EST 2001 | dason_c
Please advise what kind of the solder mask, glossy or matt? Matt finished can reduce the solder ball significant. Check Enthone, Enplate DSR Series. Good Luck!
Electronics Forum | Tue Apr 13 14:14:59 EDT 2004 | russ
I have actually printed this same condition with type 3 paste Alpha WS709. I posted this for discussion and cannot remember what I called it. We did need to clean the stencil after every three prints. I did not check volume on these locations but
Electronics Forum | Fri Apr 29 07:14:13 EDT 2005 | jdumont
Recently we have been seeing issues with an inability to print through .45mil apertures on our stencils. We have also been seeing a alot of solder balls under some BGAs (some worse than others). I was checking the refridgerator (small mini fridge) we
Electronics Forum | Wed Jun 01 07:34:19 EDT 2005 | davef
It's unusual to use a horseshoe shaped pad for a 0805. Commonly when people want to reduce the paste volume to reduce solder balling, they print a "home plate" aperature. We print paste 1:1 with the pad. �IPC-7351 LP Wizard� is the library mainten
Electronics Forum | Mon Aug 04 16:28:49 EDT 2008 | grics
Hey Patrick, thanks. The area that is dark (half circle) is where the camera was. It is the same color as the above. But you may be correct still. I also noticed that the majority of the solder balls were along the "Dark" blue depression around the
Electronics Forum | Mon May 15 20:10:27 EDT 2000 | Dave F
David: How about starting with MCMs? IPC docs are: * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * DD-135 - Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Wed Sep 15 22:52:58 EDT 2004 | pdeuel
We had same problem. Solder balls appeared on top side of board and led to damaged second side stencles. We worked around problem by running blank boards thru oven and inspecting and removing solder before processing boards with parts.
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Electronics Forum | Wed Jun 07 21:45:53 EDT 2006 | davef
We do not understand the question. Take a deep breath, remember not all of us are trained as geologists. The smallest solder ball we've seen is a little less than 5 nm.
