Electronics Forum | Tue Oct 03 18:41:16 EDT 2006 | C.K. Flip
With recent implementation of VOC-Free flux in our shop, we've experienced little solder fines/balls on the above combo of VOC-Free, Water Based, and glossy to semi-glossy mask finish on PCB's. The solder balls show up on close conductor spacings, ~
Electronics Forum | Thu Jul 29 15:00:22 EDT 2004 | Sam Haq
Hi, I am trying to locate a vendor for very low alpha count solder balls. Solder is 63Sn/37Pb or 62Sn/36Pb/2Ag. Ball Specifications 63% tin / 37% lead solder (optional 2% silver in the form of 62/36/2 would be acceptable) 300 micron diameter
Electronics Forum | Wed Aug 16 13:52:24 EDT 2006 | russ
Oven settings are meaningless here. What does the board see? It is the paste we are concerned about not what the heaters are running at hehe. These solder balls are at the end of pad, which end? under the part or away from the part. I believe you
Electronics Forum | Wed Nov 04 17:18:30 EST 2009 | davef
It will be very difficult to apply the proper amount of solder with a stencil to bump a ball that is the proper size. A low volume ball is less reliable than a customary sized ball. There are: * Reballing service providers * Reballing preforms * For
Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7
My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a
Electronics Forum | Wed Apr 06 21:37:35 EDT 2005 | KEN
Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? This means your thermal profile is not hot enough. why the sudden cahnge? I will bet the lead frame material was copper and is now alloy 42. sounds like
Electronics Forum | Mon Sep 24 12:58:31 EDT 2018 | vincentl
We are attaching 0.50mm diameter SAC 305 solder balls onto 0.38 diameter Au plated pins placed at a 0.80mm pitch (pins are pressed into a plastic insulator). A tacky flux is then stenciled onto the pins using a stencil with.a 0.38mm diameter aperture
Electronics Forum | Tue Aug 15 15:56:37 EDT 2006 | Chunks
Ball SACs are not hard to over come. Most people solder these devices well using a straight ramp with a slight knee right before liquidous. Ramp-soak-and spike would not an ideal way to reflow.....
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F
Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls
